My Inquiry
My Account
Renesas 71V2556SA100BGGI
- Part No.:
- 71V2556SA100BGGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V2556SA100BGGI.pdf
- Description:
- IC SRAM 4.5MBIT PAR 119PBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,442
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
71V2556SA100BGGI from IDT (now Renesas) is a 128K × 36-bit (4.5 Mbit), 3.3V synchronous ZBT™ SRAM with pipelined outputs, 2.5V I/O supply, and zero bus turnaround architecture. It supports 166 MHz operation (3.5 ns clock-to-data access), 4-word burst (linear or interleaved), individual byte write control (BW1–BW4), and operates across industrial temperature range (–40°C to +85°C). It is used in high-speed packet buffering and cache applications in network switches and baseband processors.
For engineers reviewing the 71V2556SA100BGGI datasheet, 71V2556SA100BGGI pinout, 71V2556SA100BGGI application, or 71V2556SA100BGGI equivalent, key selection considerations include its ZBT™ zero-bus-turnaround timing, TQFP-100 package compatibility, 2.5V I/O voltage requirement, and JTAG boundary-scan support (IEEE 1149.1) for testability in dense PCB layouts.
Technical Context
The 71V2556SA100BGGI implements a fully synchronous, clock-edge-triggered architecture with input registers for address, data, and control signals. Its internal burst counter and LBO-controlled linear/interleaved burst sequencing enable deterministic 4-cycle data transfers per address load.
ZBT™ operation eliminates dead cycles between read/write transitions via internally synchronized output buffer enable and pipelined output registers. The device integrates three chip enables (CE1, CE2, CE2) for depth expansion and supports optional IEEE 1149.1 JTAG for boundary-scan testing - enabled only on SA variants like this part.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits (4.5 Mbit); supports 36-bit wide data paths without external multiplexing. |
| Max Clock Frequency | 166 MHz; enables 3.5 ns clock-to-data access time for real-time buffering in telecom line cards. |
| I/O Voltage (VDDQ) | 2.5 V ±10%; decouples I/O signaling from core logic supply, reducing noise coupling and enabling interface to 2.5V ASICs/FPGAs. |
| Burst Mode | 4-word burst (linear or interleaved); reduces address bus traffic and improves effective bandwidth in sequential access patterns. |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade deployment in base stations, industrial controllers, and edge compute systems. |
| JTAG Support | IEEE 1149.1 compliant (SA variant only); provides boundary-scan test capability without requiring additional test fixtures. |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); compatible with automated SMT assembly and thermal management in multi-layer boards. |
Pinout & Package
71V2556SA100BGGI is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm pitch. Pin 1 is located at top-left corner (notch-mark side).
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-depth addressing; sampled on rising CLK edge for synchronous access. |
| CLK | Master Clock Input | Positive-edge-triggered system clock; all synchronous operations (address latching, burst increment, data transfer) are aligned to this edge. |
| R/W | Read/Write Control | Single bidirectional control signal; determines cycle direction at burst initiation; ignored during internal burst counter advancement. |
| ADV/LD | Address Valid/Load Control | Loads external address when low; increments internal burst counter when high - enables seamless burst sequencing without address bus updates. |
| BW1–BW4 | Byte Write Enables | Four independent 8-bit write masks; allow partial-word writes without read-modify-write, critical for protocol header updates in networking buffers. |
| CE1, CE2, CE2 | Chip Enable Inputs | Three enables support hierarchical memory decoding; any one false disables new operations but allows completion of pending reads/writes. |
| LBO | Burst Order Select | Configures burst sequence as linear (LBO = VSS) or interleaved (LBO = VDD); matches CPU or DMA controller burst expectations. |
| TMS, TDI, TCK, TDO, TRST | JTAG Test Interface | IEEE 1149.1 boundary-scan pins; TRST is optional active-low reset; all pulled internally if left unconnected. |
| VDD, VDDQ, VSS | Power Supplies | VDD = 3.3 V ±5% (core logic); VDDQ = 2.5 V ±10% (I/O drivers); VSS = ground; separate supplies isolate switching noise. |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 32-bit data + 4 parity bits; bidirectional, registered I/O with pipelined outputs; tri-stated automatically on deselect or write initiation. |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates idle cycles between read/write transitions - enables back-to-back memory accesses at full 166 MHz throughput without bus arbitration overhead. |
| Pipelined Output Registers | Output data is registered on CLK edge, guaranteeing deterministic 3.5 ns clock-to-data timing and simplifying timing closure in high-speed designs. |
| Internal Burst Counter | Generates four consecutive addresses from single ADV/LD assertion - reduces address bus activity by 75% in sequential burst scenarios. |
| Individual Byte Write Control | BW1–BW4 enable selective 8-bit writes without disturbing adjacent bytes - essential for efficient packet header manipulation in networking silicon. |
| Synchronous Output Enable | OE is internally synchronized to CLK; removes need for external OE timing control and prevents output glitches during asynchronous deassertion. |
| JTAG Boundary Scan (SA version) | Full IEEE 1149.1 compliance with TAP controller - enables structural testing of solder joints and interconnects in high-density BGA/TQFP layouts. |
Applications
| Network Packet Buffering | Baseband Processor Cache |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared buffer providing zero-turnaround read/write for ingress/egress queues. Use Value: 166 MHz operation and 4-word burst deliver >5.3 Gbps sustained throughput, meeting line-rate requirements for 10G Ethernet interfaces. |
Use Scenario: Acting as L2 instruction/data cache for multi-core DSPs in 4G/5G wireless baseband units. IC Role / Device Role / Timing Role: Synchronous SRAM serving as tightly coupled memory with deterministic 3.5 ns access to feed parallel execution units. Use Value: Pipelined outputs and 2.5V I/O ensure clean signal integrity when interfacing to 28 nm/16 nm baseband SoCs operating at 1.2 V core. |
| Industrial PLC Memory Expansion | Test Equipment Pattern Memory |
|
Use Scenario: Extending program memory and data tables in ruggedized programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Industrial-temperature-rated SRAM providing reliable, fast storage for ladder logic execution and I/O mapping. Use Value: –40°C to +85°C rating and TQFP packaging ensure long-term reliability under thermal cycling and vibration in harsh environments. |
Use Scenario: Storing high-speed digital stimulus and expected response vectors in automated test equipment (ATE) for semiconductor validation. IC Role / Device Role / Timing Role: Deterministic-access memory enabling precise timing alignment between pattern generation and capture clocks. Use Value: JTAG boundary scan (SA variant) allows in-system verification of memory interconnect integrity before functional test execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355BV18-167BZI | 128K × 36, 1.8V core / 1.8V I/O, 167 MHz, no JTAG, 100-pin TQFP | Lacks IEEE 1149.1 test interface; requires 1.8V I/O ecosystem instead of 2.5V | Preferred where lower power and newer process node outweigh JTAG need and 2.5V interface compatibility. |
| AS7C33128P-10TCN | 128K × 36, 3.3V core/I/O, 10 ns async access, no burst, no ZBT, 100-pin TQFP | Asynchronous interface; no pipelining, no burst counter, no zero-turnaround - significantly lower bandwidth and higher latency | Only suitable for cost-sensitive, non-real-time applications where 166 MHz timing and ZBT™ are not required. |
Compared with CY7C1355BV18-167BZI and AS7C33128P-10TCN, the 71V2556SA100BGGI uniquely delivers 2.5V I/O compatibility with industrial temperature range and integrated JTAG - making it optimal for testable, high-throughput embedded systems where mixed-voltage interfacing and production test coverage are mandatory.
Availability
71V2556SA100BGGI is available at Aetrix Electronics and suitable for network switch buffering, baseband processor caching, and industrial PLC memory expansion requiring stable component supply, long-lifecycle support, and verified industrial-temperature performance.
Supply support for 71V2556SA100BGGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.
The 71V2556SA100BGGI belongs to IDT's ZBT™ SRAM product line, designed specifically for zero-latency, high-bandwidth buffering in telecom, networking, and real-time embedded systems demanding deterministic timing and industrial reliability.
FAQ
What does the 'SA' suffix indicate in 71V2556SA100BGGI?
The 'SA' suffix denotes the version with integrated IEEE 1149.1 JTAG boundary-scan capability. Unlike the base 'S' variant, the 71V2556SA100BGGI includes functional TMS, TDI, TCK, TDO, and TRST pins - enabling in-circuit testability of PCB interconnects and solder joints without physical probe access.
Does 71V2556SA100BGGI support both linear and interleaved burst modes?
Yes, the 71V2556SA100BGGI supports both linear and interleaved 4-word burst sequences. The LBO (Linear/Interleaved Burst Order) pin selects mode: tied to VSS for linear, VDD for interleaved. This matches burst expectations of different host processors and DMA controllers.
What is the function of the ADV/LD pin on 71V2556SA100BGGI?
The ADV/LD pin controls address loading versus burst counter advancement on the 71V2556SA100BGGI. When low, it loads an external address into the internal latch; when high, it increments the burst counter - enabling continuous burst transfers without re-driving the address bus.
Can 71V2556SA100BGGI operate with only 3.3V supply, or is 2.5V I/O mandatory?
The 71V2556SA100BGGI requires two supplies: VDD = 3.3 V ±5% for core logic and VDDQ = 2.5 V ±10% for I/O drivers. Using only 3.3V on VDDQ violates absolute maximum ratings and risks damage or unreliable operation - the 2.5V I/O supply is mandatory.
Is the 71V2556SA100BGGI pin-compatible with other members of the 71V2556 family?
Yes, the 71V2556SA100BGGI shares identical pinout and footprint with all 100-pin TQFP variants in the 71V2556 family (e.g., 71V2556S100BGGI), including identical power, ground, address, data, and control pin assignments - enabling drop-in replacement where JTAG is not required.
71V2556SA100BGGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V2556SA100BGGI FAQ
1.How can I place an order for 71V2556SA100BGGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V2556SA100BGGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V2556SA100BGGI reliable?
The price and inventory of 71V2556SA100BGGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2556SA100BGGI is usually 5 days.
3.What payment methods are accepted for 71V2556SA100BGGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V2556SA100BGGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V2556SA100BGGI?
71V2556SA100BGGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V2556SA100BGGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V2556SA100BGGI?
For technical support, including 71V2556SA100BGGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2556SA100BGGI requirements.
6.How does Aetrix verify that 71V2556SA100BGGI is sourced from the original manufacturer or authorized distributors?
All 71V2556SA100BGGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2556SA100BGGI meets industry standards.
7.What is the process for return or replacement of 71V2556SA100BGGI?
All 71V2556SA100BGGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V2556SA100BGGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V2556SA100BGGI part is unused and in its original packaging.
Return procedure for 71V2556SA100BGGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V2556SA100BGGI Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
