Renesas 71V2556SA133BG8
- Part No.:
- 71V2556SA133BG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V2556SA133BG8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V2556SA133BG8 from IDT (now Renesas) is a 128K × 36-bit (4.5 Mbit), 3.3V synchronous ZBT™ SRAM with pipelined outputs, 133 MHz operation (7.5 ns clock-to-data access), 2.5V I/O supply, and integrated burst counter. It eliminates bus turnaround dead cycles between read/write transitions and supports linear or interleaved 4-word bursts in high-speed networking and packet buffering applications.
For engineers reviewing the 71V2556SA133BG8 datasheet, 71V2556SA133BG8 pinout, 71V2556SA133BG8 application, or 71V2556SA133BG8 equivalent, key selection criteria include ZBT™ zero-turnaround timing, JEDEC-standard 119-ball BGA (BG119) package, industrial temperature support (–40°C to +85°C), JTAG boundary scan capability, and individual byte write control for memory subsystem optimization.
Technical Context
This SRAM implements a fully synchronous, clock-edge-triggered architecture with address, data, and control registers aligned to the rising edge of CLK. Its internal burst counter and ADV/LD-controlled address loading enable deterministic 4-word burst sequences without external logic.
The device integrates three chip enables (CE1/CE2/CE2), single R/W control, and four independent byte write enables (BW1–BW4), allowing flexible depth expansion and partial writes. Optional IEEE 1149.1 JTAG support provides testability in dense PCB layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 36-bit wide data paths for high-throughput packet buffers. |
| Max Clock Frequency | 133 MHz; enables 7.5 ns clock-to-data access time for sub-8 ns system timing closure. |
| Supply Voltages | VDD = 3.3 V ±5%, VDDQ = 2.5 V; separates core logic and I/O domains to reduce noise coupling. |
| Burst Capability | 4-word linear or interleaved burst; reduces address bus traffic and improves bandwidth efficiency. |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade embedded systems and telecom infrastructure. |
| Package | 119-ball BGA (BG119), 14 mm × 20 mm footprint; matches JEDEC MO-207AC standard for automated assembly. |
| ZBT™ Feature | No dead cycles between read/write transitions; eliminates bus turnaround latency in full-duplex memory interfaces. |
Pinout & Package
71V2556SA133BG8 is packaged in a JEDEC-standard 119-ball grid array (BG119) with 1.0 mm ball pitch, optimized for thermal dissipation and signal integrity in high-speed memory subsystems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-depth addressing; sampled on rising CLK edge. |
| CLK | System Clock Input | Rising-edge-triggered master clock; synchronizes all address, control, and data transfers. |
| R/W | Read/Write Control | Single-pin mode select: HIGH = read, LOW = write; determines burst cycle direction at first address load. |
| ADV/LD | Address Valid/Load Control | LOW loads external address; HIGH increments internal burst counter - enables seamless burst sequencing. |
| BW1–BW4 | Byte Write Enables | Four independent 9-bit byte masks; allows partial writes without read-modify-write overhead. |
| CE1, CE2, CE2 | Chip Enable Inputs | Three enables support hierarchical memory decoding; any false disable suspends operation after pending cycles. |
| I/O[0:31], I/OP[1:4] | Data I/O Bus | 36-bit bidirectional data path (32 data + 4 parity); operates at 2.5V I/O voltage for compatibility with 2.5V logic families. |
| LBO | Burst Order Select | Connect to VSS for linear burst, VDD for interleaved burst - configures burst address sequence without software overhead. |
| TMS, TDI, TCK, TDO, TRST | JTAG Boundary Scan | IEEE 1149.1-compliant test interface; enables in-system verification and interconnect testing on dense PCBs. |
| VDD, VDDQ, VSS | Power Supplies | VDD (3.3V core), VDDQ (2.5V I/O), and VSS (ground) pins are distributed across package for low-impedance decoupling. |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates idle cycles between consecutive read/write operations - increases effective memory bandwidth by up to 30% in burst-intensive workloads. |
| Pipelined Output Registers | Output data registered on CLK edge; removes need for external output latches and simplifies timing closure in high-frequency designs. |
| Internally Synchronized OE | OE function is fully synchronous - no external timing constraints or setup/hold violations when disabling outputs. |
| 4-Word Burst Counter | Hardware-based counter generates sequential addresses automatically; reduces CPU/memory controller address generation burden. |
| Individual Byte Write Control | BW1–BW4 enable per-byte write masking - avoids destructive full-word writes during partial updates in cache or buffer management. |
| JTAG Boundary Scan Support | IEEE 1149.1 compliance enables automated test pattern generation and fault isolation without physical probe access. |
Applications
| Packet Buffering in Switch ASICs | High-Speed Cache for Network Processors |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer with zero-turnaround read/write switching for full-duplex line-rate processing. Use Value: 133 MHz operation and 4-word burst mode deliver sustained 4.8 GB/s throughput, enabling wire-speed forwarding without packet loss. |
Use Scenario: Acting as L2/L3 cache for programmable network processors handling deep packet inspection. IC Role / Device Role / Timing Role: Pipelined synchronous SRAM providing deterministic access latency and burst-aligned data delivery to processor cores. Use Value: 7.5 ns clock-to-data access and byte-write capability allow fine-grained cache line updates without performance penalty. |
| Telecom Line Card Memory Subsystem | Industrial Real-Time Data Acquisition Buffer |
|
Use Scenario: Buffering time-sensitive voice/video frames in carrier-grade SDH/SONET line cards. IC Role / Device Role / Timing Role: Industrial-temperature-rated ZBT SRAM serving as dual-port-like FIFO replacement with synchronous burst control. Use Value: –40°C to +85°C operation and 119-ball BGA package ensure reliability in thermally constrained telecom chassis environments. |
Use Scenario: Capturing high-resolution sensor streams (e.g., vibration, thermal imaging) in factory automation controllers. IC Role / Device Role / Timing Role: Deterministic-access memory buffer interfacing with FPGA-based acquisition logic via synchronous 36-bit bus. Use Value: Individual byte write enables selective storage of metadata alongside raw samples, minimizing bus contention and power consumption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV33-133BZI | 128K × 36-bit, 133 MHz, 3.3V core, but uses 3.3V I/O (no VDDQ separation); no JTAG support. | Suitable for cost-sensitive designs where 2.5V I/O compatibility and boundary scan are not required. | Choose when interfacing exclusively with 3.3V logic and JTAG testability is unnecessary. |
| AS7C33128P-133BIN | 128K × 36-bit, 133 MHz, 3.3V core/IO, no burst counter or ZBT™ feature; asynchronous OE. | Applicable where simpler timing models and lower gate count are prioritized over zero-turnaround performance. | Select if system design tolerates bus turnaround latency and does not require hardware burst sequencing. |
Compared with CY7C1356BV33-133BZI and AS7C33128P-133BIN, the 71V2556SA133BG8 uniquely delivers ZBT™ zero-turnaround operation, 2.5V I/O voltage isolation, and integrated JTAG - making it optimal for high-reliability, high-bandwidth telecom and industrial control memory subsystems requiring deterministic timing and test coverage.
Availability
71V2556SA133BG8 is available at Aetrix Electronics and suitable for packet buffering in networking equipment, cache acceleration in network processors, telecom line card memory subsystems, and real-time industrial data acquisition requiring stable component supply across extended product lifecycles.
Supply support for 71V2556SA133BG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor leader specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V2556SA133BG8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency memory interfaces in high-speed packet-switched systems where deterministic burst access and bus turnaround elimination are critical.
FAQ
What is the maximum operating frequency of the 71V2556SA133BG8?
The 71V2556SA133BG8 is rated for 133 MHz operation, delivering a 7.5 ns clock-to-data access time. This specification is guaranteed over the full industrial temperature range (–40°C to +85°C) and under recommended DC operating conditions (VDD = 3.3 V ±5%, VDDQ = 2.5 V). The device achieves this performance using a fully pipelined synchronous architecture with edge-triggered registers.
Does the 71V2556SA133BG8 support JTAG boundary scan?
Yes, the 71V2556SA133BG8 includes optional IEEE 1149.1-compliant JTAG boundary scan functionality. Pins TMS, TDI, TCK, TDO, and TRST are dedicated to this interface and are implemented in the "SA" variant. TRST is optional and may be left floating (internally pulled to VDD) if not used. JTAG enables in-system testability and interconnect verification without physical probe access.
How does the ZBTTM feature improve system performance in the 71V2556SA133BG8?
The ZBTTM (Zero Bus Turnaround) feature in the 71V2556SA133BG8 eliminates idle cycles between consecutive read and write operations. Unlike conventional SRAMs requiring bus release/reacquisition, this device transitions directly from one operation to the next on the same clock domain - increasing effective memory bandwidth by up to 30% in mixed-access workloads typical of packet buffering and cache coherency protocols.
What is the purpose of the ADV/LD and LBO pins on the 71V2556SA133BG8?
ADV/LD controls whether an external address is loaded (LOW) or the internal burst counter is incremented (HIGH), enabling automatic 4-word burst sequencing. LBO selects burst order: tied to VSS for linear sequence (0,1,2,3), or VDD for interleaved (0,2,1,3). Together, these pins eliminate external burst address generation logic and simplify controller firmware for high-speed memory access patterns.
Is the 71V2556SA133BG8 compatible with industrial temperature requirements?
Yes, the 71V2556SA133BG8 is qualified for industrial temperature operation from –40°C to +85°C. This rating is explicitly confirmed in the manufacturer's datasheet under "Recommended Operating Temperature and Supply Voltage" and applies to the "SA" speed grade. The device uses robust packaging and process technology to maintain timing and electrical specifications across this full range.
71V2556SA133BG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V2556SA133BG8 FAQ
1.How can I place an order for 71V2556SA133BG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V2556SA133BG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V2556SA133BG8 reliable?
The price and inventory of 71V2556SA133BG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2556SA133BG8 is usually 5 days.
3.What payment methods are accepted for 71V2556SA133BG8?
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4.How is shipping managed for 71V2556SA133BG8?
71V2556SA133BG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V2556SA133BG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V2556SA133BG8?
For technical support, including 71V2556SA133BG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2556SA133BG8 requirements.
6.How does Aetrix verify that 71V2556SA133BG8 is sourced from the original manufacturer or authorized distributors?
All 71V2556SA133BG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2556SA133BG8 meets industry standards.
7.What is the process for return or replacement of 71V2556SA133BG8?
All 71V2556SA133BG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V2556SA133BG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V2556SA133BG8 part is unused and in its original packaging.
Return procedure for 71V2556SA133BG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V2556SA133BG8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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