Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 71V2556SA133BGI8

Part No.:
71V2556SA133BGI8
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V2556SA133BGI8.pdf
Description:
IC SRAM 4.5MBIT PAR 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,003

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

71V2556SA133BGI8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit organization (4.5 Mbit), 133 MHz operation (7.5 ns clock-to-data access), pipelined outputs, and zero-bus-turnaround architecture. It features 2.5V I/O supply, individual byte write control (BW1–BW4), three chip enables, and supports linear/interleaved 4-word burst modes in high-speed networking and packet buffering applications.

For engineers reviewing the 71V2556SA133BGI8 datasheet, 71V2556SA133BGI8 pinout, 71V2556SA133BGI8 application, or 71V2556SA133BGI8 equivalent, key selection criteria include ZBT timing compliance, TQFP-100 package compatibility, industrial temperature range (–40°C to +85°C), JTAG test support, and burst counter behavior under ADV/LD and LBO control.

Technical Context

This device implements a fully synchronous, clock-edge-triggered architecture with address/data/control registers aligned to the rising CLK edge. Its internal burst counter increments on ADV/LD = HIGH and loads external addresses on ADV/LD = LOW, enabling deterministic linear or interleaved burst sequences selected by the LBO pin.

The ZBT™ architecture eliminates dead cycles between read/write transitions via internally synchronized OE and pipelined output registers. Clock Enable (CEN) halts register updates without affecting output state, while CE1/CE2/CE2 enable depth expansion and precise cycle gating with two-cycle tri-state latency upon deselect.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36-bit (4.5 Mbit); supports 36-bit parallel data path for wide-bus systems.
Max Clock Frequency 133 MHz; enables 7.5 ns clock-to-data access time for real-time packet processing.
Supply Voltages VDD = 3.3 V ±5%, VDDQ = 2.5 V; separates core logic and I/O domains to reduce noise coupling.
Burst Capability 4-word burst (linear or interleaved); reduces address bus traffic and improves throughput in sequential access.
Operating Temperature –40°C to +85°C; qualified for industrial-grade embedded and telecom infrastructure use.
Package JEDEC-standard 100-pin TQFP (14 mm × 20 mm); compatible with standard SMT reflow profiles.
JTAG Support IEEE 1149.1-compliant optional boundary scan; enables in-system test and debug without additional probes.

Pinout & Package

71V2556SA133BGI8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 1 is located at top-left corner (notch-mark side), with pins numbered counterclockwise.

Pin/Terminal Circuit Role Design Meaning
A0–A16 Address Inputs 17-bit address bus; selects one of 128K locations; sampled on rising CLK edge.
CLK System Clock Input Rising-edge-triggered master clock; synchronizes all address, control, and data transfers.
R/W Read/Write Control Single pin determines cycle direction; status latched at burst initiation, not per-word.
ADV/LD Address Valid/Load Control LOW loads new external address; HIGH increments internal burst counter.
LBO Burst Order Select Connect to VSS for linear burst (0,1,2,3); to VDD for interleaved (0,2,1,3).
BW1–BW4 Byte Write Enables Active-Low controls write masking for four 9-bit bytes (I/O[0:31] + I/OP[1:4]).
CE1, CE2, CE2 Chip Enable Inputs Three independent enables; any false disables new operations but completes pending transfers.
I/O[0:31], I/OP[1:4] Data I/O Bus 36-bit bidirectional data path; 2.5V I/O voltage domain with 50 Ω AC test load.
VDD, VDDQ, VSS Power Supplies VDD (3.3V core), VDDQ (2.5V I/O), VSS (common ground); decoupling required per JEDEC layout guidelines.

Key Features

Feature Design Value
ZBT™ Zero Bus Turnaround Eliminates idle cycles between read/write transitions, enabling back-to-back memory accesses at full clock rate.
Pipelined Output Registers Output data valid after fixed clock-to-data delay; removes need for external OE timing control.
Internal Burst Counter Hardware counter manages 4-word burst sequence without external logic or address incrementing.
Individual Byte Write Control Four independent BW pins allow selective 9-bit writes-critical for partial-word packet header updates.
Three Chip Enables Supports seamless depth expansion across multiple devices without external address decoding logic.
JTAG Boundary Scan (Optional) IEEE 1149.1 interface enables production test, fault isolation, and board-level verification.

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in switch fabric ASIC interfaces.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer between ingress parser and egress scheduler; operates at line-rate clocking.

Use Value: ZBT™ architecture enables continuous read-write alternation without pipeline stalls, sustaining >95% bus utilization at 133 MHz.

Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line cards handling 10 Gbps traffic.

IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as shared memory for ATM cell assembly/disassembly engines.

Use Value: 4-word burst mode reduces address bus overhead by 75% versus single-word access, improving system-level throughput.

High-Speed Test Equipment Memory Industrial PLC Data Logging

Use Scenario: Capturing real-time digital waveform data in automated test equipment (ATE) pattern generators.

IC Role / Device Role / Timing Role: Cyclic buffer storing high-speed parallel test vectors synchronized to system clock.

Use Value: Pipelined outputs ensure deterministic data availability with 7.5 ns access, meeting tight setup/hold margins of ATE timing subsystems.

Use Scenario: Cyclic logging of sensor inputs and control states in ruggedized programmable logic controllers.

IC Role / Device Role / Timing Role: Nonvolatile-backed SRAM used for fast-access runtime data storage with industrial temp resilience.

Use Value: –40°C to +85°C rating and robust TQFP packaging ensure reliable operation in uncontrolled cabinet environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1356BV18-133BZI 128K × 36, 133 MHz, 3.3V core / 1.8V I/O; no JTAG; different burst control (BWS vs. BWx). Requires 1.8V I/O rail; lacks LBO-selectable burst order; uses byte write strobes instead of dedicated BW pins. Choose when lower I/O voltage and absence of JTAG are acceptable, and burst sequencing is fixed.
AS7C3256B-133JCIN 128K × 36, 133 MHz, 3.3V only (no separate VDDQ); no burst counter; asynchronous OE. Higher I/O noise susceptibility; requires external OE timing management; no hardware burst acceleration. Choose for cost-sensitive designs where ZBT timing and burst features are unnecessary.

Compared with CY7C1356BV18-133BZI and AS7C3256B-133JCIN, the 71V2556SA133BGI8 uniquely delivers 2.5V I/O separation, JTAG testability, and configurable linear/interleaved burst-enabling higher signal integrity, easier validation, and optimized throughput in protocol-aware systems.

Availability

71V2556SA133BGI8 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment, and industrial PLC data logging requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 71V2556SA133BGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 71V2556SA133BGI8 belongs to IDT's ZBT™ SRAM product line, designed specifically for zero-latency bus turnaround in high-throughput packet-switching and real-time signal processing systems.

FAQ

What is the maximum operating frequency of the 71V2556SA133BGI8?

The 71V2556SA133BGI8 is rated for 133 MHz operation, delivering a 7.5 ns clock-to-data access time. This specification is guaranteed over the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% VDD supply, with 2.5 V VDDQ. Performance is validated using JEDEC-standard AC test conditions with 50 Ω load and defined setup/hold margins.

Does the 71V2556SA133BGI8 support both linear and interleaved burst modes?

Yes, the 71V2556SA133BGI8 supports both linear and interleaved 4-word burst sequences. The LBO (Burst Order) pin selects the mode: tied to VSS for linear (0,1,2,3) and to VDD for interleaved (0,2,1,3). This configuration is sampled at burst initiation and remains active throughout the burst cycle.

What is the function of the ADV/LD pin on the 71V2556SA133BGI8?

The ADV/LD pin on the 71V2556SA133BGI8 serves dual functions: when LOW, it loads a new external address into the internal address register; when HIGH, it advances the internal burst counter. This eliminates external address generation logic during burst reads/writes and ensures deterministic sequence control.

Is JTAG boundary scan supported on the 71V2556SA133BGI8?

Yes, the 71V2556SA133BGI8 includes optional IEEE 1149.1-compliant JTAG boundary scan functionality. Pins TMS, TDI, TCK, TDO, and TRST are assigned to dedicated balls/pins in the BGA variant and are NC (no-connect) in the TQFP version unless explicitly enabled per ordering code - the "SA" suffix confirms JTAG capability in this variant.

How does the ZBT™ architecture eliminate dead cycles in the 71V2556SA133BGI8?

The ZBT™ architecture in the 71V2556SA133BGI8 eliminates dead cycles by synchronizing output enable internally and decoupling read/write transitions from bus turnaround delays. Unlike traditional SRAMs, it allows immediate read-after-write or write-after-read without wait states, achieving continuous data flow at full clock rate.

71V2556SA133BGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V2556SA133BGI8 FAQ

1.How can I place an order for 71V2556SA133BGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V2556SA133BGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V2556SA133BGI8 reliable?

The price and inventory of 71V2556SA133BGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2556SA133BGI8 is usually 5 days.

3.What payment methods are accepted for 71V2556SA133BGI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V2556SA133BGI8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V2556SA133BGI8?

71V2556SA133BGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V2556SA133BGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V2556SA133BGI8?

For technical support, including 71V2556SA133BGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2556SA133BGI8 requirements.

6.How does Aetrix verify that 71V2556SA133BGI8 is sourced from the original manufacturer or authorized distributors?

All 71V2556SA133BGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2556SA133BGI8 meets industry standards.

7.What is the process for return or replacement of 71V2556SA133BGI8?

All 71V2556SA133BGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V2556SA133BGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V2556SA133BGI8 part is unused and in its original packaging.

Return procedure for 71V2556SA133BGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

71V2556SA133BGI8 Tags

  • 71V2556SA133BGI8
  • 71V2556SA133BGI8 PDF
  • 71V2556SA133BGI8 Datasheet
  • 71V2556SA133BGI8 Specifications
  • 71V2556SA133BGI8 Images
  • Renesas
  • Renesas 71V2556SA133BGI8
  • Buy 71V2556SA133BGI8
  • 71V2556SA133BGI8 Price
  • 71V2556SA133BGI8 Distributor
  • 71V2556SA133BGI8 Supplier
  • 71V2556SA133BGI8 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER