Renesas 71V2556SA166BG
- Part No.:
- 71V2556SA166BG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V2556SA166BG.pdf
- Description:
- IC SRAM 4.5MBIT PAR 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V2556SA166BG from IDT (now Renesas) is a 128K × 36-bit (4.5 Mbit), 3.3V synchronous ZBT™ SRAM with 2.5V I/O, pipelined outputs, and zero-bus-turnaround architecture. It operates at 166 MHz (3.5 ns clock-to-data access), supports 4-word linear or interleaved burst mode via LBO control, and features individual byte write (BW1–BW4), three chip enables (CE1/CE2/CE2), and optional IEEE 1149.1 JTAG boundary scan. It is used in high-speed networking packet buffers and cache subsystems requiring deterministic latency and no dead cycles between read/write transitions.
For engineers reviewing the 71V2556SA166BG datasheet, 71V2556SA166BG pinout, 71V2556SA166BG application, or 71V2556SA166BG equivalent, key selection criteria include ZBT timing compliance, TQFP-100 vs. BGA-119 package compatibility, 2.5V I/O voltage tolerance, industrial temperature support (–40°C to +85°C), and JTAG testability for production validation.
Technical Context
The 71V2556SA166BG implements a fully synchronous, clock-edge-triggered architecture with address/data/control registers sampled on the positive clock edge. Its internal burst counter increments on ADV/LD = HIGH and loads external addresses on ADV/LD = LOW, enabling deterministic 4-word burst sequences without external logic.
ZBT operation eliminates bus turnaround dead cycles by allowing immediate read-after-write or write-after-read transitions - achieved via internally synchronized output buffer enable (OE) and pipelined output registers that decouple data output timing from control signal propagation delays.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports depth expansion using CE1/CE2/CE2 for multi-chip memory banks |
| Max Clock Frequency | 166 MHz; enables 3.5 ns clock-to-data access time for real-time packet buffering in 10G+ Ethernet line cards |
| I/O Voltage | 2.5V VDDQ supply; allows direct interfacing with 2.5V logic families while maintaining 3.3V core (VDD) for stability |
| Burst Capability | 4-word linear or interleaved burst; reduces address bus traffic and improves bandwidth efficiency in sequential-access applications |
| Operating Temperature | –40°C to +85°C industrial range; qualified for deployment in base station RF units and industrial controllers |
| JTAG Support | IEEE 1149.1-compliant optional boundary scan (TMS/TDI/TCK/TDO/TRST); enables in-system test and debug without physical probe access |
| Package | 119-ball BGA (BG119); compact footprint suitable for space-constrained telecom modules with thermal pad for enhanced heat dissipation |
Pinout & Package
71V2556SA166BG is packaged in a JEDEC-standard 119-ball grid array (BGA) with 0.8 mm pitch, thermal pad, and ball assignment per BG119 layout. Pin functions are defined for synchronous operation with strict setup/hold timing relative to CLK.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Positive-edge-triggered master clock; all synchronous inputs (address, R/W, BWx, ADV/LD) are latched on rising edge |
| R/W | Read/Write control | Single-pin bidirectional mode control; determines burst cycle direction at first address load, not per-word |
| ADV/LD | Address load/burst counter advance | LOW loads new external address; HIGH increments internal burst counter - defines burst sequence start point |
| LBO | Linear/interleaved burst select | Connected to VSS for linear burst (0,1,2,3); to VDD for interleaved (0,2,1,3) - configures memory access pattern |
| BW1–BW4 | Byte write enables | Active-Low per-byte write masks; allow partial writes without read-modify-write, critical for protocol header updates |
| CE1, CE2, CE2 | Chip enable inputs | Three independent enables; device selected only when CE1=L, CE2=L, CE2=H - enables flexible depth expansion |
| VDDQ | I/O power supply | 2.5V supply for all I/O pins (I/O[0:31], I/OP[1:4]); isolated from 3.3V core (VDD) to prevent noise coupling |
| TMS/TDI/TCK/TDO/TRST | JTAG interface | Boundary scan test signals; TRST is optional active-low reset - supports automated PCB test in volume manufacturing |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ architecture | Eliminates bus turnaround dead cycles between reads and writes - enables continuous 166 MHz throughput in burst-mode packet processing |
| Pipelined output registers | Decouples output data timing from control path delay; guarantees deterministic 3.5 ns clock-to-data access regardless of OE assertion timing |
| Internally synchronized OE | Removes need for external OE timing control - simplifies system-level timing closure and reduces FPGA pin count |
| Individual byte write (BW1–BW4) | Enables selective 8-bit updates to 36-bit words without full-word read-modify-write - essential for low-overhead header manipulation |
| Three chip enables (CE1/CE2/CE2) | Supports seamless depth expansion across multiple devices using hierarchical enable logic - scalable to 1M×36 or larger memory arrays |
Applications
| High-Speed Packet Buffering | Network Processor Cache |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/3 switches with line-rate performance. IC Role / Device Role / Timing Role: As a 166 MHz ZBT SRAM, it serves as the primary packet buffer memory, accepting ingress data on write bursts and delivering egress data on read bursts with zero turnaround latency. Use Value: Enables sustained 10 Gbps+ throughput by eliminating bus idle cycles during read/write alternation - directly improving switch fabric utilization. | Use Scenario: Acting as L1/L2 cache for network processors executing deep packet inspection and classification algorithms. IC Role / Device Role / Timing Role: Provides low-latency, pipelined access to instruction and metadata tables; burst mode accelerates sequential table walks. Use Value: Reduces average memory access latency by 40% compared to asynchronous SRAM, accelerating rule-matching throughput in DPI engines. |
| Telecom Line Card Memory | Industrial Real-Time Control Buffer |
Use Scenario: Buffering time-sensitive CPRI/OBSAI data streams between radio units and baseband processors in 4G/5G small cells. IC Role / Device Role / Timing Role: Serves as deterministic latency memory with industrial temperature rating; JTAG support enables field-upgradable firmware storage verification. Use Value: Guarantees sub-5 ns access consistency across –40°C to +85°C ambient - critical for jitter-sensitive fronthaul synchronization. | Use Scenario: Holding sensor fusion data and motion control command queues in CNC machine controllers requiring hard real-time response. IC Role / Device Role / Timing Role: Functions as a dual-port-like shared memory between FPGA-based motion sequencer and ARM host processor via burst-aligned read/write handshaking. Use Value: Eliminates inter-processor arbitration delays through ZBT zero-turnaround - ensures ≤1 µs worst-case command dispatch latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV166BZC | 128K × 36, 3.3V, 166 MHz, but uses QDR-II architecture with separate read/write ports and no ZBT zero-turnaround | Requires dual-clock domain management and lacks burst counter; better suited for true dual-port workloads than burst-sequential packet buffers | Select only if application requires simultaneous read/write concurrency rather than ZBT's single-port burst efficiency |
| IS61WV12836BLL-166BLI | 128K × 36, 3.3V, 166 MHz, but asynchronous SRAM with no burst counter, no pipelined outputs, and no JTAG | Higher access latency (12 ns), no burst capability, and no industrial temp option - limited to non-real-time embedded control | Choose only for cost-sensitive, non-burst, non-industrial designs where timing margin is abundant |
Compared with CY7C1356BV166BZC and IS61WV12836BLL-166BLI, the 71V2556SA166BG uniquely delivers zero-bus-turnaround operation, integrated burst counter, and JTAG testability - making it the only viable choice for deterministic-latency, high-throughput packet buffering in telecom infrastructure.
Availability
71V2556SA166BG is available at Aetrix Electronics and suitable for high-speed networking equipment, telecom line cards, and industrial real-time controllers requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for 71V2556SA166BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance memory, timing, and interface solutions for communications and computing markets.
The 71V2556SA166BG belongs to IDT's ZBT SRAM product line, designed specifically for applications demanding deterministic latency, zero-bus-turnaround operation, and burst-mode efficiency in packet-processing and cache subsystems.
FAQ
What is the maximum operating frequency and corresponding access time for the 71V2556SA166BG?
The 71V2556SA166BG is rated for a maximum clock frequency of 166 MHz, with a guaranteed clock-to-data access time of 3.5 ns under specified conditions (VDD = 3.3V ±5%, VDDQ = 2.5V, TA = –40°C to +85°C). This timing is achievable only when all synchronous inputs meet setup/hold requirements relative to the CLK rising edge, and the device is operated in its supported industrial temperature range.
Does the 71V2556SA166BG support both linear and interleaved burst modes, and how is the mode selected?
Yes, the 71V2556SA166BG supports both linear and interleaved 4-word burst sequences. The mode is selected via the LBO (Linear/Interleaved Burst Order) pin: connecting LBO to VSS selects linear order (0,1,2,3), while connecting LBO to VDD selects interleaved order (0,2,1,3). This configuration is sampled at the rising edge of CLK and remains effective until changed, enabling runtime burst pattern adaptation in firmware-controlled systems.
What is the function of the three chip enable pins (CE1, CE2, CE2) on the 71V2556SA166BG?
The 71V2556SA166BG uses three chip enable pins - CE1, CE2, and CE2 - to provide flexible depth expansion control. The device is selected only when CE1 = LOW, CE2 = LOW, and CE2 = HIGH. Any deviation (e.g., CE2 = LOW or CE1 = HIGH) deselects the device. This triple-enable scheme allows hierarchical memory bank decoding and supports cascaded configurations without external logic, reducing system complexity in multi-SRAM designs.
Is JTAG boundary scan functionality standard or optional on the 71V2556SA166BG, and which pins are involved?
JTAG boundary scan is an optional feature on the 71V2556SA166BG, implemented per IEEE 1149.1. It uses dedicated pins TMS, TDI, TCK, TDO, and optional TRST - all assigned to NC balls on the "S" version but functional on the "SA" version (as indicated by the "A" suffix in 71V2556SA166BG). These pins are pulled up internally to VDD when unused, and TRST may be left floating if not required, simplifying board design while retaining test flexibility.
How does the 71V2556SA166BG achieve zero-bus-turnaround (ZBT) behavior, and what system-level benefit does it provide?
The 71V2556SA166BG achieves ZBT behavior through its internal architecture: the output buffer enable is synchronized to the clock, eliminating asynchronous OE timing constraints, and the burst counter allows immediate transition from write to read (or vice versa) within the same burst sequence. This removes traditional bus idle cycles, enabling continuous 166 MHz data flow - a critical advantage in packet buffering where back-to-back read/write operations dominate, directly increasing effective memory bandwidth by up to 30% over conventional synchronous SRAMs.
71V2556SA166BG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V2556SA166BG FAQ
1.How can I place an order for 71V2556SA166BG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V2556SA166BG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V2556SA166BG reliable?
The price and inventory of 71V2556SA166BG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2556SA166BG is usually 5 days.
3.What payment methods are accepted for 71V2556SA166BG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V2556SA166BG transactions.
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4.How is shipping managed for 71V2556SA166BG?
71V2556SA166BG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V2556SA166BG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V2556SA166BG?
For technical support, including 71V2556SA166BG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2556SA166BG requirements.
6.How does Aetrix verify that 71V2556SA166BG is sourced from the original manufacturer or authorized distributors?
All 71V2556SA166BG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2556SA166BG meets industry standards.
7.What is the process for return or replacement of 71V2556SA166BG?
All 71V2556SA166BG units undergo pre-shipment inspection (PSI). If there is an issue with 71V2556SA166BG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V2556SA166BG part is unused and in its original packaging.
Return procedure for 71V2556SA166BG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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