Renesas 71V2556SA166BG8
- Part No.:
- 71V2556SA166BG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V2556SA166BG8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V2556SA166BG8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit organization (4.5 Mbit), 166 MHz clock frequency (3.5 ns clock-to-data access), and pipelined outputs. It supports zero-bus-turnaround (ZBT) operation, individual byte write control (BW1–BW4), and burst read/write modes (linear or interleaved) - deployed in high-speed networking packet buffers and cache subsystems.
For engineers reviewing the 71V2556SA166BG8 datasheet, 71V2556SA166BG8 pinout, 71V2556SA166BG8 application, or 71V2556SA166BG8 equivalent, key selection criteria include ZBT timing compliance, 2.5V I/O voltage compatibility, 119-ball BGA (BG119) package footprint, industrial temperature range (–40°C to +85°C), and JTAG boundary-scan support for testability.
Technical Context
This SRAM implements a fully synchronous, positive-edge-triggered architecture with address/data/control registers, an on-chip 4-word burst counter, and internally synchronized output enable (OE). The ADV/LD pin controls burst counter increment (HIGH) or external address load (LOW), while LBO selects linear vs. interleaved burst order.
It features three chip enables (CE1, CE2, CE2) for depth expansion, clock enable (CEN) for cycle suspension, and optional IEEE 1149.1 JTAG interface (TMS/TDI/TCK/TDO/TRST) on dedicated pins. All I/Os operate at 2.5V (VDDQ), while core logic runs at 3.3V (VDD), with separate VSS planes for analog and digital domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4,718,592 bits); supports 36-bit wide data path for high-throughput buffering. |
| Max Clock Frequency | 166 MHz; enables 3.5 ns clock-to-data access time for sub-6 ns read cycles in pipelined systems. |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 2.5 V (I/O); dual-rail design isolates noise-sensitive I/O from core logic. |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus traffic and improves bandwidth efficiency in sequential access. |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for deployment in telecom infrastructure and industrial controllers. |
| Package | 119-ball BGA (BG119), JEDEC standard; compact footprint suitable for dense PCB layouts with thermal pad. |
| ZBT Functionality | No dead cycles between read/write transitions; eliminates bus turnaround latency critical in full-duplex memory interfaces. |
Pinout & Package
71V2556SA166BG8 is packaged in a JEDEC-standard 119-ball grid array (BG119) with 1.0 mm ball pitch and exposed thermal pad. Pinout conforms to IDT's BG119 mechanical drawing (document 4875 drw 13a), supporting industrial temperature operation and optional JTAG test access.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus; accesses 128K words (217 = 131,072) in 36-bit words. |
| CLK | System Clock Input | Positive-edge-triggered master clock; all synchronous operations referenced to rising edge. |
| R/W | Read/Write Control | Single-pin command: HIGH = read, LOW = write; determines burst direction at cycle start. |
| ADV/LD | Burst Counter Control | HIGH = increment internal burst counter; LOW = load new external address into counter. |
| LBO | Burst Order Select | VSS = linear burst (0,1,2,3); VDD = interleaved burst (0,2,1,3); defines sequential address generation. |
| BW1–BW4 | Byte Write Enables | Independent 9-bit byte masks (BW1→I/O[8:0], BW2→I/O[17:9], etc.); enables partial-word writes without read-modify-write. |
| CE1, CE2, CE2 | Chip Enable Inputs | Three enables allow seamless depth expansion; device selected only when CE1=L, CE2=L, CE2=H. |
| I/O[0:31], I/OP[1:4] | Data I/O Bus | 32 data lines + 4 parity bits; 2.5V SSTL-compatible signaling with programmable drive strength. |
| TMS, TDI, TCK, TDO, TRST | JTAG Boundary Scan | IEEE 1149.1-compliant test interface; TRST is optional active-low reset (internally pulled to VDD if floating). |
| VDD, VDDQ, VSS | Power & Ground | Dual supplies: VDD (3.3V core), VDDQ (2.5V I/O); separate VSS planes minimize switching noise coupling. |
| ZZ (T7) | Deep Sleep Mode | Active-low sleep input (on latest die revision); reduces standby current to <10 µA when asserted. |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates bus turnaround dead cycles between reads and writes - enables continuous 166 MHz throughput in full-duplex memory channels. |
| Pipelined Output Buffers | Internally synchronized OE removes external timing constraints; outputs align deterministically to CLK edge without skew management. |
| 4-Word Burst Counter | Reduces address bus activity by 75% during sequential access; LBO pin selects linear or interleaved addressing for cache line alignment. |
| Individual Byte Write Control | BW1–BW4 enable independent 9-bit byte masking - avoids destructive read-modify-write for partial updates in multi-processor shared memory. |
| Industrial Temperature Support | Guaranteed operation from –40°C to +85°C with full AC/DC specs; qualified for base station RF modules and motor drive controllers. |
| JTAG Boundary Scan (Optional) | IEEE 1149.1-compliant test access via dedicated pins; supports board-level interconnect testing and in-system programming verification. |
Applications
| Network Packet Buffer | High-Speed Cache Controller |
|---|---|
|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decision and egress scheduling. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer with ZBT mode enabling back-to-back read/write of frame headers and payloads without bus idle cycles. Use Value: Sustains 166 MHz sustained throughput across 36-bit bus, reducing packet drop rate under 10 Gbps line-rate traffic. |
Use Scenario: Acting as Level 2 (L2) cache tag RAM and data RAM in FPGA-based compute accelerators requiring deterministic memory access. IC Role / Device Role / Timing Role: Synchronous SRAM providing pipelined, burst-capable storage with precise 3.5 ns clock-to-data timing for tight pipeline stages. Use Value: Enables single-cycle hit detection and 4-word burst fill, cutting cache miss penalty by >40% versus asynchronous SRAM alternatives. |
| Telecom Baseband Processing | Industrial Motion Control Buffer |
|
Use Scenario: Temporary storage of OFDM symbol data between FFT processing blocks in 4G/5G remote radio units (RRUs). IC Role / Device Role / Timing Role: Dual-voltage (3.3V core / 2.5V I/O) SRAM interfacing with 2.5V DSPs/FPGAs; JTAG supports field-upgrade validation. Use Value: Industrial temp rating (–40°C to +85°C) ensures reliability in uncontrolled outdoor enclosures; ZZ mode cuts power during symbol gaps. |
Use Scenario: Real-time buffering of position feedback and motion command streams in servo drive controllers with microsecond jitter requirements. IC Role / Device Role / Timing Role: Deterministic 166 MHz access with no wait states; byte-write enables selective update of encoder error counters without corrupting adjacent fields. Use Value: Eliminates software overhead of atomic RMW sequences, reducing control loop latency by up to 12 ns per update. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355BV18-167BZXI | 128K × 36, 167 MHz, 1.8V core + 1.8V I/O; no JTAG; 100-pin TQFP only | Lacks industrial temp support (0°C to +70°C only); no ZZ sleep mode; incompatible voltage rails | Select only for cost-sensitive commercial designs where 1.8V system integration and absence of JTAG are acceptable. |
| AS7C3256B-167BIN | 128K × 32, 167 MHz, 3.3V single-supply; no burst counter; no byte write enables; 100-pin TQFP | 32-bit bus width limits bandwidth; lacks ZBT and pipelined OE; no JTAG or sleep mode | Use only when system requires simpler control logic and can tolerate reduced data width and higher bus turnaround latency. |
Compared with CY7C1355BV18-167BZXI and AS7C3256B-167BIN, the 71V2556SA166BG8 uniquely delivers industrial-grade reliability, ZBT timing, 2.5V I/O compatibility, and JTAG testability in a space-efficient BGA - making it the only option for ruggedized, high-throughput embedded memory subsystems.
Availability
71V2556SA166BG8 is available at Aetrix Electronics and suitable for network packet buffering, telecom baseband processing, industrial motion control, and high-speed cache subsystems requiring stable component supply across extended lifecycle windows.
Supply support for 71V2556SA166BG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.
The 71V2556SA166BG8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency bus turnaround in high-speed packet-processing and cache-coherent subsystems demanding deterministic timing and industrial reliability.
FAQ
What is the maximum operating frequency and corresponding access time for the 71V2556SA166BG8?
The 71V2556SA166BG8 is rated for a maximum clock frequency of 166 MHz, with a guaranteed clock-to-data access time of 3.5 ns. This specification applies under industrial temperature conditions (–40°C to +85°C) and nominal supply voltages (VDD = 3.3 V ±5%, VDDQ = 2.5 V). The 71V2556SA166BG8 achieves this performance using fully pipelined synchronous architecture and ZBTTM bus protocol.
Does the 71V2556SA166BG8 support JTAG boundary scan, and which pins are used?
Yes, the 71V2556SA166BG8 supports optional IEEE 1149.1 JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and TRST (ball positions U5, U4, U3, U2, and U1 respectively in BG119 layout) implement the JTAG interface. TRST is optional and internally pulled to VDD if left floating; all JTAG pins are NC on non-SA variants but functional on the 71V2556SA166BG8.
How does the ZBTTM feature eliminate dead cycles in the 71V2556SA166BG8?
The ZBTTM (Zero Bus Turnaround) feature in the 71V2556SA166BG8 allows immediate transition from a write cycle to a read cycle (or vice versa) without inserting idle bus cycles. This is achieved through internal pipelining and burst counter synchronization, ensuring that the bus remains active and productive - a critical advantage in high-throughput packet buffering where 71V2556SA166BG8 sustains 166 MHz back-to-back operations.
What is the function of the LBO pin on the 71V2556SA166BG8, and how does it affect burst behavior?
The LBO (Linear/Interleaved Burst Order) pin on the 71V2556SA166BG8 selects burst sequence mode: pulled to VSS for linear order (0,1,2,3) or to VDD for interleaved order (0,2,1,3). This directly determines how the internal burst counter increments addresses during 4-word bursts, enabling optimal alignment with cache line structures or memory controller expectations - a configurable feature unique to the 71V2556SA166BG8 among its speed grade.
Is the 71V2556SA166BG8 compatible with industrial temperature requirements, and what is its qualification scope?
Yes, the 71V2556SA166BG8 is fully qualified for industrial temperature operation from –40°C to +85°C, with all AC and DC electrical specifications guaranteed across this range. It is manufactured in a JEDEC-standard 119-ball BGA package with thermal pad, and includes ZZ (deep sleep) mode support on pin T7 - making the 71V2556SA166BG8 suitable for deployment in base stations, motor drives, and other harsh-environment embedded systems.
71V2556SA166BG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V2556SA166BG8 FAQ
1.How can I place an order for 71V2556SA166BG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V2556SA166BG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V2556SA166BG8 reliable?
The price and inventory of 71V2556SA166BG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2556SA166BG8 is usually 5 days.
3.What payment methods are accepted for 71V2556SA166BG8?
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4.How is shipping managed for 71V2556SA166BG8?
71V2556SA166BG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V2556SA166BG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V2556SA166BG8?
For technical support, including 71V2556SA166BG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2556SA166BG8 requirements.
6.How does Aetrix verify that 71V2556SA166BG8 is sourced from the original manufacturer or authorized distributors?
All 71V2556SA166BG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2556SA166BG8 meets industry standards.
7.What is the process for return or replacement of 71V2556SA166BG8?
All 71V2556SA166BG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V2556SA166BG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V2556SA166BG8 part is unused and in its original packaging.
Return procedure for 71V2556SA166BG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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