Renesas 71V256SA12PZG
- Part No.:
- 71V256SA12PZG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
71V256SA12PZG.pdf
- Description:
- IC SRAM 256KBIT PARALLEL 28TSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V256SA12PZG from Renesas Electronics is a 256K (32K × 8-bit) high-speed CMOS static RAM with 12 ns access time, single 3.3 V ±0.3 V supply, LVTTL-compatible I/O, and industrial-grade temperature range (–40°C to +85°C). It serves as secondary cache memory in 3.3 V desktop and embedded processor systems requiring low-latency, low-power volatile storage.
For engineers reviewing the 71V256SA12PZG datasheet, 71V256SA12PZG pinout, 71V256SA12PZG application, or 71V256SA12PZG equivalent, key selection criteria include guaranteed 12 ns tAA and tACS, full standby current ≤2 mA, TSOP Type I (PZG28) package compatibility, and support for CS-controlled read/write timing in space-constrained industrial computing designs.
Technical Context
The 71V256SA12PZG implements a synchronous, asynchronous SRAM architecture with independent chip select (CS), output enable (OE), and write enable (WE) controls. Its address decoder supports 15-bit addressing (A0–A14) for 32K words, and I/O pins operate bidirectionally with TTL-level thresholds (VIH = 2.0 V min, VIL = 0.8 V max).
Power management relies on CS-driven state transitions: CS = VIH forces full standby (ISB1 ≤2 mA), while CS = VIL enables active read/write cycles. Timing is defined by overlapping control signals-read requires CS and OE low with WE high; write requires CS and WE low-and all AC parameters are specified under VCC = 3.3 V ±0.3 V and commercial/industrial temperature ranges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 256 Kbit (32K × 8-bit) - supports byte-wide data bus interfacing without external demultiplexing |
| Access Time (tAA) | 12 ns max - enables direct integration into 83 MHz CPU secondary cache paths |
| Supply Voltage | 3.3 V ±0.3 V - compatible with standard 3.3 V logic rails; no level-shifting required |
| Standby Current (ISB1) | 2 mA max at full standby (CS > VHC, f = 0) - extends battery life in portable industrial controllers |
| I/O Interface | LVTTL-compatible - ensures interoperability with 3.3 V microprocessors and FPGAs without interface logic |
| Operating Temperature | –40°C to +85°C - qualified for deployment in uncontrolled industrial environments |
| Package | 28-pin TSOP Type I (PZG28), 300 mil width - surface-mount compatible with high-density PCB layouts |
Pinout & Package
71V256SA12PZG is housed in a 28-pin TSOP Type I (PZG28) package with 300 mil body width and standard JEDEC-compliant pinout. The package supports reflow soldering and meets RoHS/Green requirements.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit address bus accepting 0–32767 word locations; CMOS input structure with VIH ≥2.0 V |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit parallel data path; tri-stated during CS high or OE high; LVTTL-compatible drive strength |
| CS | Chip Select | Active-low enable controlling device activation and power state (ISB1 entered when CS ≥ VHC) |
| WE | Write Enable | Active-low signal qualifying write cycles; must overlap with CS low to initiate data latch |
| OE | Output Enable | Active-low control enabling read data output; high-Z when deasserted to prevent bus contention |
| VCC | Power Supply | 3.3 V ±0.3 V main supply; decoupling capacitor recommended per datasheet layout guidelines |
| GND | Ground Reference | Signal and power ground return; separate ground plane recommended for noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| 12 ns access time | Guaranteed tAA ≤12 ns at VCC = 3.3 V - meets timing closure for 3.3 V Pentium-class secondary cache subsystems |
| Full standby current ≤2 mA | ISB1 measured at CMOS-level CS high and zero-frequency operation - reduces idle power in always-on edge nodes |
| TSOP Type I (PZG28) package | 28-pin, 300 mil width, JEDEC MO-141 compliant - enables automated assembly and high board density |
| LVTTL-compatible I/O | VIH = 2.0 V min, VIL = 0.8 V max - eliminates need for voltage translators when interfacing with 3.3 V ASICs or microcontrollers |
| Industrial temperature range | –40°C to +85°C operation - validated across thermal cycling and extended burn-in for ruggedized applications |
Applications
| Industrial PLC Memory Buffer | Embedded Network Router Cache |
|---|---|
Use Scenario: Real-time I/O data buffering in programmable logic controllers operating in factory-floor environments with ambient temperatures up to +85°C. IC Role / Device Role / Timing Role: Volatile scratchpad memory holding transient process variables and instruction buffers between scan cycles. Use Value: 12 ns tAA ensures deterministic response within tight PLC scan intervals; ISB1 ≤2 mA minimizes thermal load in sealed enclosures. | Use Scenario: Packet header and lookup table caching in fanless enterprise routers deployed in telecom cabinets. IC Role / Device Role / Timing Role: Secondary cache supporting MIPS or ARM-based network processors handling line-rate forwarding decisions. Use Value: TSOP packaging allows dense memory placement near processor BGA; LVTTL compatibility avoids signal integrity degradation on short trace runs. |
| Medical Diagnostic Imaging Controller | Ruggedized Handheld Test Equipment |
Use Scenario: Frame buffer staging in portable ultrasound or X-ray control units requiring reliable operation across –40°C cold-start and +85°C sustained use. IC Role / Device Role / Timing Role: High-reliability SRAM storing acquisition metadata and calibration coefficients during image capture bursts. Use Value: Industrial temp grade and full standby mode extend battery runtime between charges; 32K × 8 organization matches common DMA burst widths. | Use Scenario: Configuration and measurement result storage in handheld multimeters and oscilloscopes subjected to field vibration and thermal shock. IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding user settings and last-measurement history during power cycling. Use Value: PZG28 TSOP mechanical robustness resists solder joint fatigue; 2 mA ISB1 enables multi-week standby on coin-cell backup. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62256ELL-12ZXI | 512K (64K × 8) capacity; 12 ns access; 3.3 V supply; SOIC-28 package | Higher density but larger SOIC footprint; lacks TSOP option for space-constrained layouts | Select when board area permits SOIC and >256K memory depth is required |
| AS6C4008-12ZIN | 4 Mbit (512K × 8); 12 ns; 3.3 V; TSOP-32 package | Different pin count (32 vs 28) and address width (19-bit vs 15-bit); not pin-compatible | Choose only if system redesign accommodates wider bus and additional address lines |
Compared with CY62256ELL-12ZXI and AS6C4008-12ZIN, the 71V256SA12PZG offers optimal fit for legacy 32K × 8 systems needing drop-in TSOP replacement with verified industrial temp performance and minimal layout impact.
Availability
71V256SA12PZG is available at Aetrix Electronics and suitable for industrial PLC memory buffers, embedded network router cache, and medical diagnostic imaging controllers requiring stable component supply across extended product lifecycles.
Supply support for 71V256SA12PZG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The IDT71V256SA family was originally developed by Integrated Device Technology (acquired by Renesas in 2019) to deliver high-speed, low-power SRAM for 3.3 V processor cache and buffering applications in demanding industrial environments.
FAQ
What is the maximum guaranteed access time for 71V256SA12PZG?
The 71V256SA12PZG has a maximum guaranteed address access time (tAA) of 12 ns under VCC = 3.3 V ±0.3 V and industrial temperature conditions (–40°C to +85°C). This value is production-tested and specified in the AC Electrical Characteristics table of the Renesas datasheet. The 71V256SA12PZG achieves this timing without requiring special speed-binning or derating, making it suitable for deterministic real-time systems where worst-case latency must be bounded.
Does 71V256SA12PZG support both commercial and industrial temperature grades?
Yes, the 71V256SA12PZG is specifically rated for the industrial temperature range of –40°C to +85°C, as confirmed by its ordering code suffix "I" in variants like 71V256SA12PZGI. While the base 71V256SA family includes commercial-grade versions (0°C to +70°C), the 71V256SA12PZG part number corresponds to the industrial-grade variant shipped in TSOP packaging and qualified per Renesas industrial reliability standards.
What package type does 71V256SA12PZG use, and is it RoHS-compliant?
The 71V256SA12PZG uses a 28-pin TSOP Type I package with 300 mil width (package code PZG28). It is RoHS-compliant and designated as a "Green" part per Renesas ordering information, meaning it contains no lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB), or polybrominated diphenyl ethers (PBDE). The "G" suffix in 71V256SA12PZG explicitly indicates Green compliance.
How does the standby power mode work on 71V256SA12PZG?
The 71V256SA12PZG enters full standby mode when chip select (CS) is driven to a CMOS-high level (≥VHC), resulting in guaranteed standby current (ISB1) ≤2 mA at VCC max and f = 0. This mode disables internal array activity and places I/O pins in high-impedance state. Unlike partial standby, full standby requires no clock or address activity and is used to minimize power in battery-backed or thermally constrained systems using the 71V256SA12PZG.
Is 71V256SA12PZG pin-compatible with other 28-pin SRAMs like the 62256 series?
No, the 71V256SA12PZG is not pin-compatible with standard 62256-series SRAMs (e.g., HM62256, AS6C256) due to differing pin assignments: 71V256SA12PZG places A10/A11/A12 on pins 13/14/22, whereas 62256 variants locate A10/A11 on pins 18/19. Additionally, 71V256SA12PZG uses TSOP-28 (PZG28), while many 62256 parts use SOJ-28 or DIP-28. Interchange requires PCB redesign; the 71V256SA12PZG must be treated as a unique footprint.
71V256SA12PZG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP
71V256SA12PZG FAQ
1.How can I place an order for 71V256SA12PZG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V256SA12PZG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V256SA12PZG reliable?
The price and inventory of 71V256SA12PZG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V256SA12PZG is usually 5 days.
3.What payment methods are accepted for 71V256SA12PZG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V256SA12PZG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V256SA12PZG?
71V256SA12PZG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V256SA12PZG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V256SA12PZG?
For technical support, including 71V256SA12PZG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V256SA12PZG requirements.
6.How does Aetrix verify that 71V256SA12PZG is sourced from the original manufacturer or authorized distributors?
All 71V256SA12PZG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V256SA12PZG meets industry standards.
7.What is the process for return or replacement of 71V256SA12PZG?
All 71V256SA12PZG units undergo pre-shipment inspection (PSI). If there is an issue with 71V256SA12PZG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V256SA12PZG part is unused and in its original packaging.
Return procedure for 71V256SA12PZG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V256SA12PZG Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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M24C02-FMC6TG
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AT24C04C-SSHM-T
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