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Renesas 71V256SA12PZGI
- Part No.:
- 71V256SA12PZGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
71V256SA12PZGI.pdf
- Description:
- IC SRAM 256KBIT PARALLEL 28TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,647
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Product details
Overview
71V256SA12PZGI from Renesas Electronics is a 256K (32K × 8-bit) high-speed CMOS static RAM with 12 ns access time, single 3.3 V ±0.3 V supply, LVTTL-compatible I/O, and industrial temperature range (–40°C to +85°C). It serves as secondary cache memory in 3.3 V embedded computing systems requiring low standby power and fast read/write cycles.
For engineers reviewing the 71V256SA12PZGI datasheet, 71V256SA12PZGI pinout, 71V256SA12PZGI application, or 71V256SA12PZGI equivalent, key selection criteria include guaranteed 12 ns tAA/tRC timing, 2 mA full-standby current (ISB1), TSOP Type I (PZG28) package compatibility, and industrial-grade reliability for mission-critical control subsystems.
Technical Context
The 71V256SA12PZGI implements asynchronous SRAM architecture with independent chip select (CS), output enable (OE), and write enable (WE) controls, enabling flexible bus interfacing in microprocessor-based systems. Its address decoder supports full 15-bit addressing (A0–A14) for 32K word access, and I/O pins operate bidirectionally with TTL-level thresholds (VIH = 2.0 V min, VIL = 0.8 V max).
Power management is achieved via two standby modes: TTL-level CS HIGH yields ISB ≤ 20 mA, while CMOS-level CS HIGH (VHC ≥ VCC – 0.2 V) guarantees ISB1 ≤ 2 mA at f = 0. All DC and AC parameters-including VOL ≤ 0.4 V (IOL = 8 mA), VOH ≥ 2.4 V (IOH = –4 mA), and tWHZ ≤ 8 ns-are specified across the full industrial temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32K × 8-bit (262,144 bits), enabling byte-wide data transfers without external demultiplexing |
| Access Time (tAA) | 12 ns maximum - supports CPU clock domains up to ~60 MHz in cache applications |
| Supply Voltage | 3.3 V ± 0.3 V - compatible with standard 3.3 V logic rails and eliminates level-shifting requirements |
| Standby Current (ISB1) | 2 mA maximum at full standby (CS > VHC, f = 0) - extends battery life in portable industrial controllers |
| Operating Temperature | –40°C to +85°C - qualified for use in automotive engine control units and factory automation PLCs |
| I/O Compatibility | LVTTL - ensures direct interface with Intel 386/486, PowerPC, and ARM9-based host processors |
| Package | 28-pin TSOP Type I (PZG28), 8.1 mm × 13.4 mm footprint - enables high-density PCB layouts in space-constrained modules |
Pinout & Package
71V256SA12PZGI is housed in a 28-pin TSOP Type I (PZG28) package with 0.5 mm pitch and JEDEC-standard pinout. The package supports automated surface-mount assembly and provides thermal performance suitable for convection-cooled industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit address bus accepting full 32K-word decoding; no internal latching required |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit parallel interface supporting simultaneous read and write operations without external transceivers |
| CS | Chip Select | Active-low enable controlling device activation; drives full standby when held HIGH (TTL or CMOS level) |
| WE | Write Enable | Active-low signal qualifying write cycles; must overlap LOW CS to initiate data storage |
| OE | Output Enable | Active-low control for output drivers; allows shared bus operation with other peripherals |
| VCC | Power Supply | 3.3 V ± 0.3 V main supply; decoupling capacitor placement near pin critical for noise immunity |
| GND | Ground Reference | Signal and power return path; requires low-inductance connection to minimize ground bounce during fast transitions |
Key Features
| Feature | Design Value |
|---|---|
| 12 ns Read Cycle Time (tRC) | Enables tight timing closure in 3.3 V secondary cache designs with CPUs operating above 50 MHz |
| 2 mA Full Standby Current (ISB1) | Reduces system-level quiescent power by >90% versus active mode, critical for always-on edge nodes |
| LVTTL-Compatible Interface | Eliminates need for voltage translators when interfacing with legacy 3.3 V microcontrollers and FPGAs |
| Industrial Temperature Range | Validated operation from –40°C to +85°C ensures reliability in uncontrolled ambient environments |
| TSOP Type I Packaging | Standardized 28-pin footprint simplifies PCB layout reuse and supports automated optical inspection |
Applications
| Industrial PLC Memory Buffer | Automotive Engine Control Unit Cache |
|---|---|
Use Scenario: Real-time I/O scanning and logic execution in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Secondary cache storing frequently accessed ladder logic instructions and process variable tables. Use Value: 12 ns tAA ensures instruction fetch latency remains below 20 ns, preserving sub-millisecond scan cycle integrity. | Use Scenario: Storing sensor calibration maps and real-time combustion timing tables in engine control modules. IC Role / Device Role / Timing Role: Fast-access SRAM holding dynamic lookup tables updated during closed-loop fuel trim adjustments. Use Value: Industrial temperature rating and 2 mA ISB1 support continuous operation under hood temperatures up to +85°C with minimal thermal derating. |
| Medical Imaging Data FIFO | Ruggedized Handheld Terminal RAM |
Use Scenario: Temporary buffering of digitized X-ray or ultrasound frame segments prior to compression and transmission. IC Role / Device Role / Timing Role: High-bandwidth data staging buffer between ADC interface and DSP subsystem. Use Value: 8-bit bidirectional I/O and 12 ns tRC allow sustained 83 MB/s read throughput matching 100 MHz pixel clocks. | Use Scenario: Field-deployed barcode scanners and asset trackers requiring non-volatile session state retention during intermittent power loss. IC Role / Device Role / Timing Role: Low-power working memory retaining UI context and scan history between wake events. Use Value: 2 mA ISB1 enables multi-week battery life in sleep mode while maintaining instant resume capability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62256ELL-12ZXI | Same 32K × 8 organization and 12 ns speed, but uses SOIC-28 package (wider 300 mil body vs. TSOP's 8.1 mm width) | Requires PCB layout revision due to different footprint and thermal profile; less suitable for ultra-thin handhelds | Select when existing SOIC-based designs require drop-in replacement with identical timing and voltage specs |
| AS6C4008-12BIN | 12 ns access, industrial temp, but operates at 2.7–3.6 V range (wider than 71V256SA12PZGI's 3.0–3.6 V); higher ISB1 (3 mA max) | Acceptable for mixed-voltage systems where 2.7 V brownout tolerance is needed; marginally higher standby draw | Choose when board-level supply regulation varies beyond ±0.3 V or when sourcing from alternate SRAM vendors is required |
Compared with CY62256ELL-12ZXI and AS6C4008-12BIN, the 71V256SA12PZGI offers the smallest PCB footprint (TSOP), lowest guaranteed ISB1 (2 mA), and strictest 3.3 V supply tolerance-making it optimal for space- and power-constrained industrial edge devices where thermal headroom is limited.
Availability
71V256SA12PZGI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, automotive engine control unit cache, and medical imaging data FIFOs requiring stable component supply across extended product lifecycles.
Supply support for 71V256SA12PZGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.
The 71V256SA series was designed as high-reliability, low-power 3.3 V SRAMs targeting secondary cache and real-time data buffering in harsh-environment control systems.
FAQ
What is the maximum guaranteed access time for the 71V256SA12PZGI?
The 71V256SA12PZGI has a maximum guaranteed address access time (tAA) of 12 ns and read cycle time (tRC) of 12 ns under industrial conditions (VCC = 3.3 V ± 0.3 V, TA = –40°C to +85°C). This value is production-tested and appears in Table 10 of the Renesas datasheet as a hard specification limit-not a typical or nominal figure.
Does the 71V256SA12PZGI support true low-power standby mode?
Yes, the 71V256SA12PZGI supports full standby mode with guaranteed ISB1 ≤ 2 mA when CS is driven above VHC (≥ VCC – 0.2 V) and all inputs are static (f = 0). This mode reduces power consumption to <6.6 mW and is explicitly validated across the full industrial temperature range per Table 7 in the datasheet.
Which package type does the 71V256SA12PZGI use, and what are its mechanical dimensions?
The 71V256SA12PZGI uses a 28-pin TSOP Type I package coded PZG28, measuring 8.1 mm × 13.4 mm with 0.5 mm lead pitch. Its JEDEC-standard footprint matches industry-wide assembly tooling and is documented in Figure 3 of the Renesas datasheet (drawing 3101 drw 03).
Is the 71V256SA12PZGI compatible with LVTTL logic families?
Yes, the 71V256SA12PZGI features LVTTL-compatible inputs and outputs, with VIH(min) = 2.0 V, VIL(max) = 0.8 V, VOL(max) = 0.4 V (IOL = 8 mA), and VOH(min) = 2.4 V (IOH = –4 mA). These thresholds ensure interoperability with standard 3.3 V microcontrollers and FPGAs without level shifters.
What is the operating temperature grade of the 71V256SA12PZGI?
The 71V256SA12PZGI is rated for industrial temperature operation from –40°C to +85°C, as confirmed by the "I" suffix in its part number and Table 5 (Recommended DC Operating Conditions) in the Renesas datasheet. This grade is validated for continuous operation under thermal stress without derating.
71V256SA12PZGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP
71V256SA12PZGI FAQ
1.How can I place an order for 71V256SA12PZGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V256SA12PZGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V256SA12PZGI reliable?
The price and inventory of 71V256SA12PZGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V256SA12PZGI is usually 5 days.
3.What payment methods are accepted for 71V256SA12PZGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V256SA12PZGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V256SA12PZGI?
71V256SA12PZGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V256SA12PZGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V256SA12PZGI?
For technical support, including 71V256SA12PZGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V256SA12PZGI requirements.
6.How does Aetrix verify that 71V256SA12PZGI is sourced from the original manufacturer or authorized distributors?
All 71V256SA12PZGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V256SA12PZGI meets industry standards.
7.What is the process for return or replacement of 71V256SA12PZGI?
All 71V256SA12PZGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V256SA12PZGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V256SA12PZGI part is unused and in its original packaging.
Return procedure for 71V256SA12PZGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V256SA12PZGI Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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