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Renesas 71V256SA20PZG8
- Part No.:
- 71V256SA20PZG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
71V256SA20PZG8.pdf
- Description:
- IC SRAM 256KBIT PARALLEL 28TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,885
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Product details
Overview
71V256SA20PZG8 from Renesas Electronics is a 256K (32K × 8-bit) high-speed CMOS static RAM with 20 ns access time, 3.3 V ±0.3 V single-supply operation, LVTTL-compatible I/O, and industrial-grade temperature range support (–40°C to +85°C). It serves as secondary cache memory in 3.3 V desktop and embedded systems requiring low-power standby and fast read/write cycles.
For engineers reviewing the 71V256SA20PZG8 datasheet, 71V256SA20PZG8 pinout, 71V256SA20PZG8 application, or 71V256SA20PZG8 equivalent, key selection criteria include guaranteed 20 ns tAA/tRC timing, full standby current ≤2 mA, TSOP Type I (PZG28) package compatibility, and CS-controlled power-down behavior for battery-sensitive designs.
Technical Context
The 71V256SA20PZG8 implements a synchronous, asynchronous SRAM architecture with independent chip select (CS), output enable (OE), and write enable (WE) controls. Its address decoding supports 15-bit addressing (A0–A14) for 32K words, and bidirectional I/O0–I/O7 lines operate at LVTTL voltage levels (VIH ≥2.0 V, VIL ≤0.8 V) under 3.3 V supply.
Power management relies on CS-driven state transitions: CS = VIH enables full standby (ISB1 ≤2 mA), while CS = VIL activates active mode with dynamic ICC ≤85 mA at fMAX. Timing is defined by overlapping control signals-read cycles require OE and CS low, write cycles require simultaneous CS and WE low-with tDW (data-to-write overlap) ≥8 ns and tDH (data hold) ≥0 ns specified.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32K × 8-bit (262,144 bits), enabling byte-wide data access without external multiplexing |
| Access Time (tAA) | 20 ns max - guarantees reliable interface with 50 MHz bus systems using standard setup/hold margins |
| Supply Voltage | 3.3 V ±0.3 V - compatible with modern low-voltage logic families and eliminates need for level shifters |
| Standby Current (ISB1) | ≤2 mA at full standby (CS > VHC, f = 0) - extends battery life in portable or always-on embedded systems |
| I/O Voltage Compatibility | LVTTL - ensures direct interfacing with Intel Pentium, AMD K6, and other 3.3 V microprocessors without translation |
| Operating Temperature | –40°C to +85°C - qualified for industrial control, networking equipment, and automotive infotainment ECUs |
| Package | 28-pin TSOP Type I (PZG28), 8.1 mm × 13.4 mm footprint - supports high-density PCB layouts with automated assembly compatibility |
Pinout & Package
71V256SA20PZG8 is housed in a 28-pin TSOP Type I (PZG28) package with 0.5 mm pitch, JEDEC MO-141 compliant, and optimized for surface-mount reflow assembly. Pin 1 is marked by a notch or dot at the top-left corner when viewed from the top with pins facing downward.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit unidirectional address bus supporting 32K-word addressing; no internal latching - requires stable address during CS low |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit tristatable data path; direction controlled by WE and CS; high-impedance when CS high or OE high during read |
| CS | Chip Select | Primary enable/disable signal - drives device into full standby (≤2 mA) when held at CMOS-high level (VHC) |
| WE | Write Enable | Active-low write control; must be low simultaneously with CS low to initiate write; determines data capture timing (tWP ≥15 ns) |
| OE | Output Enable | Active-low read control; allows output drivers to activate only when CS and OE are both low; enables bus sharing |
| VCC | Power Supply | 3.3 V ±0.3 V main supply; decoupling capacitor (0.1 µF) required within 10 mm of pin for noise immunity |
| GND | Ground Reference | Signal and power ground return; must be connected to low-impedance plane to maintain VIH/VIL thresholds |
Key Features
| Feature | Design Value |
|---|---|
| Low-Power Full Standby Mode | ISB1 ≤2 mA at VCC = 3.6 V and f = 0 - reduces system idle power by >95% vs. active mode (ICC ≤85 mA) |
| Fast 20 ns Read/Write Cycles | tRC = 20 ns, tWC = 20 ns - supports 50 MHz burst transfers in cache subsystems without wait states |
| LVTTL-Compatible Interface | VIH(min) = 2.0 V, VIL(max) = 0.8 V at VCC = 3.0 V - ensures robust noise margin (>0.4 V) in electrically noisy industrial environments |
| Industrial Temperature Range | –40°C to +85°C operation - validated across thermal cycling and long-term bias stress per JESD22-A108 |
| Green Compliant Packaging | Lead-free, RoHS-compliant TSOP (PZG28) - meets IPC-J-STD-609A Class 1 marking and halogen-free requirements |
Applications
| Industrial PLC Memory Buffer | Network Router Packet Buffer |
|---|---|
Use Scenario: Real-time I/O scanning and ladder logic execution in programmable logic controllers requiring deterministic memory access. IC Role / Device Role / Timing Role: Secondary cache buffer storing frequently accessed program instructions and process variables with 20 ns tAA latency. Use Value: Enables sub-microsecond response to fieldbus interrupts by eliminating DRAM refresh overhead and reducing CPU wait states. | Use Scenario: Temporary storage of Ethernet frames during line-rate forwarding in Layer 3 switches and edge routers. IC Role / Device Role / Timing Role: Asynchronous packet buffer interfacing directly with MAC controllers via LVTTL-bus, operating in burst-mode read/write. Use Value: Sustains 100 Mbps+ throughput with zero frame loss under sustained traffic due to guaranteed 20 ns tRC and tWC timing. |
| Medical Imaging Control Module | Automotive Infotainment Head Unit |
Use Scenario: Storing calibration tables and real-time sensor fusion results in ultrasound or MRI subsystems with strict thermal constraints. IC Role / Device Role / Timing Role: Low-power SRAM holding volatile configuration data during imaging acquisition, powered from isolated 3.3 V rail. Use Value: Maintains data integrity across –40°C to +85°C ambient with ISB1 ≤2 mA, minimizing heat generation near sensitive analog front-ends. | Use Scenario: Supporting GUI rendering and audio codec buffering in head units where space and thermal dissipation are constrained. IC Role / Device Role / Timing Role: Byte-accessible working memory for ARM Cortex-A53 application processors running Linux-based HMI stacks. Use Value: TSOP package (8.1 × 13.4 mm) saves >30% board area vs. SOJ alternatives while delivering 32K × 8 capacity in same footprint. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62256LN-20ZSXI | 256K × 8, 20 ns, 3.3 V, SOIC-28 package; ISB ≤5 mA (vs. 2 mA) | Larger SOIC footprint (18.1 × 7.6 mm vs. TSOP 13.4 × 8.1 mm); no industrial temp option in ZSXI suffix | Select when legacy SOIC layout exists and lower standby current is not critical. |
| AS6C4008-20TIN | 512K × 8, 20 ns, 3.3 V, TSOP-32; higher density but incompatible pinout and address width (A0–A18) | Requires PCB redesign (32-pin vs. 28-pin); supports larger buffers but lacks A14-only addressing simplicity | Choose only if future scalability to 512K is mandated and board revision is acceptable. |
Compared with CY62256LN-20ZSXI and AS6C4008-20TIN, the 71V256SA20PZG8 offers optimal balance of industrial temperature rating, ultra-low standby current, and compact TSOP footprint - making it preferred for space-constrained, thermally demanding embedded systems where pin compatibility and power efficiency are prioritized over raw density or legacy package support.
Availability
71V256SA20PZG8 is available at Aetrix Electronics and suitable for industrial PLC memory buffers, network router packet buffers, medical imaging control modules, and automotive infotainment head units requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 71V256SA20PZG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The IDT71V256SA family was originally developed by Integrated Device Technology (acquired by Renesas in 2019) to deliver high-speed, low-power SRAMs for 3.3 V processor cache and buffer applications in space- and energy-constrained systems.
FAQ
What is the maximum clock frequency supported by the 71V256SA20PZG8?
The 71V256SA20PZG8 is an asynchronous SRAM and does not use a clock signal. Its maximum operational speed is defined by timing parameters: tRC (read cycle time) and tWC (write cycle time) are both guaranteed ≤20 ns, enabling reliable interface with 50 MHz bus systems when combined with appropriate setup/hold margins and PCB trace length matching.
Does the 71V256SA20PZG8 support automatic power-down without external control logic?
Yes. The 71V256SA20PZG8 enters full standby mode automatically when CS is driven to CMOS-high level (VHC), requiring no additional control signals or sequencing. In this state, ISB1 is guaranteed ≤2 mA at VCC = 3.6 V and f = 0, and the device remains in standby as long as CS remains high - simplifying power management in battery-backed or energy-harvesting systems.
Can the 71V256SA20PZG8 be used with 5 V logic interfaces?
No. The 71V256SA20PZG8 is strictly a 3.3 V LVTTL device: VIH is specified as 2.0 V minimum and VCC +0.3 V maximum, and absolute maximum terminal voltage is VCC +0.5 V. Direct connection to 5 V logic risks permanent damage. Level translation (e.g., TXB0108 or SN74AVC4T245) is required for interoperability with 5 V systems.
What is the meaning of the '8' suffix in 71V256SA20PZG8?
The '8' suffix in 71V256SA20PZG8 indicates tape-and-reel packaging - specifically, 1,000 units per reel in antistatic carrier tape conforming to EIA-481-D standards. This format is optimized for automated SMT placement and ensures consistent moisture sensitivity level (MSL) handling per J-STD-020.
Is the 71V256SA20PZG8 pin-compatible with earlier 71V256SA15PZG8 or 71V256SA12PZG8 variants?
Yes. All 71V256SA-xPZG8 variants share identical pinout, package (PZG28 TSOP), and functional interface. The only differences are AC timing specifications: tAA/tRC is 20 ns for 71V256SA20PZG8, 15 ns for 71V256SA15PZG8, and 12 ns for 71V256SA12PZG8. System-level timing margins must be verified per selected speed grade, but PCB layout and firmware initialization remain unchanged.
71V256SA20PZG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP
71V256SA20PZG8 FAQ
1.How can I place an order for 71V256SA20PZG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V256SA20PZG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V256SA20PZG8 reliable?
The price and inventory of 71V256SA20PZG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V256SA20PZG8 is usually 5 days.
3.What payment methods are accepted for 71V256SA20PZG8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V256SA20PZG8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V256SA20PZG8?
71V256SA20PZG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V256SA20PZG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V256SA20PZG8?
For technical support, including 71V256SA20PZG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V256SA20PZG8 requirements.
6.How does Aetrix verify that 71V256SA20PZG8 is sourced from the original manufacturer or authorized distributors?
All 71V256SA20PZG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V256SA20PZG8 meets industry standards.
7.What is the process for return or replacement of 71V256SA20PZG8?
All 71V256SA20PZG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V256SA20PZG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V256SA20PZG8 part is unused and in its original packaging.
Return procedure for 71V256SA20PZG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V256SA20PZG8 Tags
-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
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