Renesas 71V25761S166PFG8
- Part No.:
- 71V25761S166PFG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V25761S166PFG8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V25761S166PFG8 from Renesas Electronics is a 128K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, burst counter, and single-cycle deselect. It operates at 166MHz (3.5ns clock access time), supports 2.5V I/O, and features linear/interleaved burst mode via LBO input. Used in high-speed cache and buffer subsystems for network processors and telecom line cards.
For engineers reviewing the 71V25761S166PFG8 datasheet, 71V25761S166PFG8 pinout, 71V25761S166PFG8 application, or 71V25761S166PFG8 equivalent, this page delivers verified timing parameters, JEDEC-standard TQFP-100 package mapping, burst-mode control logic, power-down behavior under ZZ, and real-world use cases in synchronous memory subsystems requiring deterministic latency and multi-byte burst throughput.
Technical Context
The 71V25761S166PFG8 implements a synchronous interface with registered address, data, and control inputs triggered on the rising edge of CLK. Its internal burst address counter generates four sequential addresses per initial access, with order determined by LBO state (linear or interleaved) and advanced via ADV signal.
Burst writes are supported through global write (GW) or byte-write enables (BWE + BW1–BW4), while self-timed write cycles eliminate external write pulse generation. Pipelined output staging delivers first data one clock cycle after address latch, enabling sustained 166MHz read throughput without wait states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits = 4.608 Mbit; provides 36-bit wide data bus alignment for DSP and packet processor interfaces. |
| Clock Frequency | 166 MHz maximum; enables 6 ns clock cycle time with guaranteed 3.5 ns access to valid output data (tCD). |
| I/O Voltage | 2.5 V supply (VDDQ); compatible with 2.5V logic families while core runs at 3.3V for optimized speed/power trade-off. |
| Operating Temperature | Commercial grade (0°C to +70°C); validated for stable operation in standard industrial computing environments. |
| Power Supply | 3.3 V ±5% core (VDD), 2.5 V ±5% I/O (VDDQ); separate supplies allow independent voltage scaling and noise isolation. |
| Package | JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm footprint; surface-mount compatible with automated assembly. |
| Standby Current | 30 mA (ISB1) in CMOS standby mode; low-power retention when deselected but clock active. |
| Sleep Mode Current | 30 mA (IZZ) with ZZ = HIGH; reduces dynamic power by gating internal clock and disabling outputs while retaining data. |
Pinout & Package
71V25761S166PFG8 is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm pitch and exposed thermal pad (not electrically connected). Pin 1 is marked by a dot or beveled corner; pin numbering follows standard counter-clockwise convention from top-left.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous 18-bit address bus; latched on rising CLK edge when ADSP or ADSC is asserted low with CE low. |
| CLK | Clock Input | Primary timing reference; all synchronous operations (address capture, data output, burst advance) are edge-triggered on rising edge. |
| CE, CS0, CS1 | Chip Enable / Selects | Three-level chip selection: CE (active-low sync), CS0 (active-high sync), CS1 (active-low sync); full enable requires CE=LOW, CS0=HIGH, CS1=LOW. |
| GW, BWE, BW1–BW4 | Write Control Inputs | GW enables full 36-bit write; BWE gates byte writes; BW1–BW4 select 9-bit bytes (I/O0–7+I/OP1, etc.) - supports partial-word updates without read-modify-write. |
| ADV, ADSP, ADSC, LBO | Burst & Address Control | ADV advances internal burst counter; ADSP/ADSC indicate address validity from processor/cache; LBO selects linear (LOW) or interleaved (HIGH) burst sequence. |
| OE | Output Enable | Asynchronous control: OE=LOW enables I/O drivers; OE=HIGH forces high-impedance state regardless of clock or chip select. |
| ZZ | Sleep Mode Input | Asynchronous sleep entry: ZZ=HIGH gates internal clock and reduces current to 30 mA while preserving memory contents. |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous data bus; registered input/output paths ensure setup/hold compliance at 166MHz. |
| VDD, VDDQ, VSS | Power & Ground | VDD = 3.3V core supply; VDDQ = 2.5V I/O supply; VSS = common ground; decoupling required per JEDEC TQFP layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Output Architecture | First output data appears one clock cycle after address latch, enabling continuous 166MHz read throughput without pipeline stalls. |
| Four-Word Burst Counter | Generates sequential addresses internally for four consecutive 36-bit words per access - eliminates external address sequencing logic. |
| Linear/Interleaved Burst Order Selection | LBO pin statically configures burst sequence (linear or interleaved) to match cache line or DRAM row access patterns. |
| Single-Cycle Deselect | Device enters high-impedance output state within one clock cycle of chip disable, preventing bus contention during rapid reconfiguration. |
| Self-Timed Write Cycle | Internal timing logic completes write based on GW/BWE/BWx sampling at clock edge - no external write pulse generator needed. |
| Low-Power Sleep Mode | ZZ-controlled sleep reduces supply current to 30 mA while guaranteeing data retention - ideal for power-gated subsystems. |
Applications
| Network Processor Cache Buffer | Telecom Line Card Packet Buffer |
|---|---|
|
Use Scenario: High-speed packet buffering between SerDes PHY and packet classification engine in 10Gbps line cards. IC Role / Device Role / Timing Role: Synchronous SRAM providing 36-bit-wide, burst-accessible storage for ingress/egress packet headers and metadata. Use Value: 166MHz clock rate and pipelined outputs deliver deterministic 3.5ns read access, enabling zero-wait-state header processing at line rate. |
Use Scenario: Frame buffering in SONET/SDH add-drop multiplexers requiring low-latency, burst-capable memory for ATM cell reassembly. IC Role / Device Role / Timing Role: Burst-mode SRAM serving as temporary frame store with linear burst addressing aligned to 53-byte ATM cell boundaries. Use Value: LBO-configurable linear burst mode matches fixed-cell-length access pattern, reducing address overhead and improving bandwidth efficiency. |
| DSP Co-Processor Local Memory | Industrial PLC Real-Time Data Log |
|
Use Scenario: Local instruction/data memory for dual-core DSPs executing real-time filtering algorithms in radar signal processing units. IC Role / Device Role / Timing Role: Low-latency, synchronous SRAM interfaced directly to DSP EMIF with burst reads for coefficient tables and circular buffers. Use Value: Single-cycle deselect and 2.5V I/O compatibility simplify interface design with 2.5V DSP I/O rails while maintaining 166MHz throughput. |
Use Scenario: Buffered logging of sensor timestamps and analog readings in ruggedized programmable logic controllers operating in factory-floor environments. IC Role / Device Role / Timing Role: Industrial-grade (–40°C to +85°C) SRAM storing time-stamped process data with guaranteed retention during brownouts. Use Value: ZZ sleep mode reduces power to 30 mA during idle periods, extending backup battery life in uninterruptible logging applications. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371DV33-166AXC | 128K × 36, 3.3V core, 2.5V I/O, same 166MHz speed; uses different burst control (BWS# instead of ADV/LBO) and lacks ZZ sleep mode. | Requires external burst address generation logic; not suitable for systems needing autonomous burst sequencing or low-power sleep. | Select when legacy Cypress interface compatibility is required and sleep mode is unnecessary. |
| AS7C312836B-166BIN | 128K × 36, 3.3V core, 2.5V I/O, 166MHz; identical pinout and timing but no LBO pin - burst order fixed as linear only. | Cannot support interleaved burst patterns; unsuitable for cache architectures requiring interleaved addressing. | Choose when linear-burst-only operation suffices and second-source availability is prioritized over burst flexibility. |
Compared with CY7C1371DV33-166AXC and AS7C312836B-166BIN, the 71V25761S166PFG8 uniquely integrates configurable burst sequencing (LBO), autonomous burst advance (ADV), and hardware sleep control (ZZ), making it optimal for cache-coherent and power-constrained synchronous memory subsystems.
Availability
71V25761S166PFG8 is available at Aetrix Electronics and suitable for network processor cache buffers, telecom packet buffers, and DSP co-processor local memory requiring stable component supply across commercial temperature range and long-term production cycles.
Supply support for 71V25761S166PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT applications.
The 71V25761S166PFG8 belongs to Renesas' high-speed synchronous SRAM product line, designed specifically for deterministic-latency, burst-capable memory subsystems in networking, telecommunications, and real-time embedded systems.
FAQ
What is the maximum clock frequency supported by the 71V25761S166PFG8?
The 71V25761S166PFG8 is rated for 166 MHz operation, corresponding to a 6 ns clock cycle time and guaranteed 3.5 ns clock-to-data (tCD) access time. This speed is validated across the commercial temperature range (0°C to +70°C) with VDD = 3.3 V ±5% and VDDQ = 2.5 V ±5%. The 71V25761S166PFG8 does not support 183 MHz or 200 MHz operation - those speeds require distinct orderable variants (e.g., 71V25761S183PFG8).
How does the LBO pin affect burst addressing in the 71V25761S166PFG8?
The LBO (Linear/Interleaved Burst Order) pin on the 71V25761S166PFG8 statically selects burst sequence: LBO = LOW enables linear addressing (00→01→10→11), while LBO = HIGH enables interleaved addressing (00→01→11→10). This configuration must be set before device initialization and held static during operation. The 71V25761S166PFG8 uses this input to align burst output with cache line or DRAM row access patterns without external logic.
Does the 71V25761S166PFG8 support partial-word writes, and how are they implemented?
Yes, the 71V25761S166PFG8 supports partial-word writes via its byte-write architecture. Four 9-bit byte groups (BW1–BW4) control I/O0–7+I/OP1, I/O8–15+I/OP2, I/O16–23+I/OP3, and I/O24–31+I/OP4 respectively. When BWE = LOW, active BWx signals enable writing only the selected bytes; unselected bytes retain prior data. This eliminates need for read-modify-write cycles in the 71V25761S166PFG8.
What is the function of the ZZ pin on the 71V25761S166PFG8, and what power savings does it provide?
The ZZ (Sleep Mode) pin on the 71V25761S166PFG8 is an asynchronous input that, when driven HIGH, gates the internal clock and places the device in full sleep mode. In this state, supply current drops to 30 mA (IZZ), while data retention is guaranteed. This feature enables significant power reduction during idle periods in systems like packet buffers or PLC loggers, where the 71V25761S166PFG8 remains powered but inactive.
Is the 71V25761S166PFG8 pin-compatible with other members of the 71V25761 family?
Yes, the 71V25761S166PFG8 shares identical pinout and package (100-pin TQFP) with all speed grades in the 71V25761SxxxPFGx series, including 183 MHz and 200 MHz variants. Electrical characteristics and timing parameters differ by speed grade, but PCB layout, power delivery, and signal routing remain interchangeable - allowing field-upgradeable performance scaling without board redesign for the 71V25761S166PFG8.
71V25761S166PFG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
71V25761S166PFG8 FAQ
1.How can I place an order for 71V25761S166PFG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V25761S166PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V25761S166PFG8 reliable?
The price and inventory of 71V25761S166PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V25761S166PFG8 is usually 5 days.
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5.How can I obtain technical support or documentation for 71V25761S166PFG8?
For technical support, including 71V25761S166PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V25761S166PFG8 requirements.
6.How does Aetrix verify that 71V25761S166PFG8 is sourced from the original manufacturer or authorized distributors?
All 71V25761S166PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V25761S166PFG8 meets industry standards.
7.What is the process for return or replacement of 71V25761S166PFG8?
All 71V25761S166PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V25761S166PFG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V25761S166PFG8 part is unused and in its original packaging.
Return procedure for 71V25761S166PFG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V25761S166PFG8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
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