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Renesas 71V25761S200PFG

Part No.:
71V25761S200PFG
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V25761S200PFG.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,472

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Product details

Overview

71V25761S200PFG from Renesas Electronics is a 128K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, burst counter, and single-cycle deselect. It operates at 200MHz (3.1ns clock access time), supports 2.5V I/O, and features linear/interleaved burst mode via LBO input. Used in high-speed networking line cards for packet buffering.

For engineers reviewing the 71V25761S200PFG datasheet, 71V25761S200PFG pinout, 71V25761S200PFG application, or 71V25761S200PFG equivalent, key selection criteria include burst-mode timing compliance, 100-pin TQFP footprint compatibility, 3.3V core / 2.5V I/O voltage separation, industrial-grade thermal margin, and ZZ-controlled sleep mode power reduction.

Technical Context

This SRAM implements a synchronous, clock-driven architecture with registered address, data, and control inputs. Its internal burst counter generates four sequential addresses per initial address, supporting both linear and interleaved sequences selected by the asynchronous LBO pin. Pipelined output registers deliver first-word data one clock cycle after address latching.

The device uses self-timed write cycles controlled by GW (global write), BWE (byte write enable), and BW1–BW4 (individual byte enables), allowing selective 9-bit writes across its 36-bit data bus. Chip enable (CE), dual chip selects (CS0/CS1), and asynchronous OE/ZZ inputs provide flexible system-level control and low-power management.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization128K × 36 bits = 4.608 Mbit; supports 36-bit parallel data path for wide-bus applications like network switch fabric buffers.
Clock Frequency200 MHz; enables 5 ns clock cycle time - critical for real-time packet forwarding in telecom infrastructure.
Access Time3.1 ns clock-to-data (tCD); guarantees deterministic read latency under full-speed operation.
Supply VoltagesVDD = 3.3 V ±5% (core), VDDQ = 2.5 V ±5% (I/O); eliminates level-shifting requirements in mixed-voltage SoC interfaces.
Operating Temperature0°C to +70°C (Commercial grade); validated for stable operation in controlled-environment enterprise equipment.
Package100-pin TQFP (14 mm × 20 mm, JEDEC standard PKG100); compatible with standard SMT reflow profiles and board assembly processes.
Power ModesActive (IDD = 360 mA), Standby (ISB1 = 30 mA), Sleep (IZZ = 30 mA); enables dynamic power scaling in burst-idle intervals.

Pinout & Package

71V25761S200PFG is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), designated PKG100, with 0.5 mm pitch and 14 mm × 20 mm body size.

Pin/Terminal Circuit Role Design Meaning
A0–A17Address InputsSynchronous address latching on rising CLK edge gated by ADSP/ADSC; 18-bit addressing supports full 128K depth.
CLKSystem Clock InputPrimary timing reference; all synchronous operations (read/write/burst) are edge-triggered on rising CLK.
CE, CS0, CS1Chip Enable & SelectsThree-level decode (CE LOW + CS0 HIGH + CS1 LOW) activates device; enables multi-SRAM bank selection.
GW, BWE, BW1–BW4Write Control InputsGW enables full 36-bit write; BWE + BWx allow granular 9-bit byte writes without disturbing other bytes.
ADV, ADSP, ADSCBurst & Address StatusADV advances internal burst counter; ADSP/ADSC latch address register - ADSP gated by CE, ADSC independent.
LBOBurst Order SelectAsynchronous static input: LOW = linear burst (0,1,2,3), HIGH = interleaved burst (0,2,1,3); must remain stable during operation.
OEOutput EnableAsynchronous control: LOW enables I/O drivers; HIGH places outputs in high-impedance state for bus sharing.
ZZSleep Mode InputAsynchronous HIGH disables internal clock and reduces supply current to 30 mA; retains data in memory array.
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional bus (32 data + 4 parity); registered I/O paths ensure setup/hold compliance at 200 MHz.
VDD, VDDQ, VSSPower & GroundVDD = 3.3 V core supply; VDDQ = 2.5 V I/O supply; separate rails decouple switching noise between logic and interface domains.

Key Features

Feature Design Value
Pipelined OutputsFirst-word data appears on next rising CLK edge - eliminates combinatorial delay bottlenecks in high-frequency read paths.
Single-Cycle DeselectDevice enters high-Z output state within one clock cycle of CE/CS deassertion - prevents bus contention during rapid bank switching.
Self-Timed Write CycleInternal timing logic completes write without external wait-state generation - simplifies controller design and improves throughput.
Linear/Interleaved Burst ModeLBO pin selects burst sequence order; matches cache line access patterns in RISC processors and DSP memory controllers.
2.5V I/O with 3.3V CoreEnables direct interfacing to 2.5V logic families while maintaining higher core speed and lower dynamic power than 3.3V-only SRAMs.
Industrial-Grade Option AvailableSame pinout and functionality offered in –40°C to +85°C variant (71V25761S200PFGI) - supports extended-temperature embedded deployments.

Applications

Telecom Line Cards Network Packet Buffers

Use Scenario: High-speed packet buffering in 10G Ethernet line cards where deterministic latency and burst throughput are critical.

IC Role / Device Role / Timing Role: Primary data buffer SRAM interfacing directly to MAC/PHY ASICs via 36-bit parallel bus with 200 MHz clock domain.

Use Value: 3.1 ns tCD and pipelined outputs meet sub-5 ns round-trip timing budgets; burst mode delivers four consecutive packets per address cycle.

Use Scenario: Temporary storage of fragmented IP packets in Layer 3 routing engines before reassembly or forwarding decisions.

IC Role / Device Role / Timing Role: Synchronous memory resource accessed by packet processor's burst-capable memory controller using ADV/LBO handshake.

Use Value: Single-cycle deselect allows rapid context switching between multiple traffic queues; ZZ sleep mode cuts idle power by >80%.

Digital Signal Processing Industrial Control Memory

Use Scenario: Real-time coefficient and sample storage in radar signal processing modules requiring low-latency, high-bandwidth memory access.

IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via burst reads/writes synchronized to DSP clock; ADSP/ADSC support cache-coherent address latching.

Use Value: 128K × 36 organization provides sufficient depth for multi-channel FFT windows; 2.5V I/O minimizes interface power vs. legacy 3.3V SRAMs.

Use Scenario: Deterministic data logging and motion control trajectory buffering in CNC machine controllers operating in factory environments.

IC Role / Device Role / Timing Role: Non-volatile backup buffer (with external battery or capacitor) holding position/velocity history during brief AC loss events.

Use Value: Industrial temperature grade (-40°C to +85°C) ensures reliability in unconditioned enclosures; low ISB1 standby current extends hold-up time.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1371DV25-200AXC200 MHz, 128K × 36, 3.3V core / 2.5V I/O, same TQFP-100 package but Cypress (now Infineon) silicon; slightly higher IDD (385 mA vs. 360 mA).Identical burst and pipelining features; differs in ADSP/ADSC timing margins and ZZ recovery time (tZZR = 120 ns vs. 100 ns).Select when existing Cypress-based designs require drop-in replacement with verified timing closure at 200 MHz.
AS7C312836B-200BIN200 MHz, 128K × 36, 3.3V core / 2.5V I/O, 100-pin TQFP; lower power (IDD = 320 mA), no LBO pin - fixed linear burst only.Lacks interleaved burst mode and ADV suspend capability; simplified control interface reduces FPGA pin count but limits cache-line optimization.Prefer for cost-sensitive industrial controllers where burst flexibility is unnecessary and power budget is tighter.

Compared with CY7C1371DV25-200AXC and AS7C312836B-200BIN, the 71V25761S200PFG offers superior burst configurability (LBO-selectable mode), faster ZZ recovery (100 ns), and lowest active current among commercial-grade 200 MHz variants - making it optimal for latency-critical telecom and test equipment.

Availability

71V25761S200PFG is available at Aetrix Electronics and suitable for telecom infrastructure, network packet buffering, and digital signal processing applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant green packaging.

Supply support for 71V25761S200PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and enterprise systems.

The 71V25761S200PFG belongs to Renesas' high-speed synchronous SRAM product line, engineered for deterministic low-latency memory access in bandwidth-intensive infrastructure equipment such as routers, switches, and baseband units.

FAQ

What is the maximum clock frequency supported by the 71V25761S200PFG?

The 71V25761S200PFG is rated for 200 MHz operation, corresponding to a 5 ns clock cycle time and 3.1 ns clock-to-output access time (tCD). This speed is guaranteed over the commercial temperature range (0°C to +70°C) with VDD = 3.3 V ±5% and VDDQ = 2.5 V ±5%. The 71V25761S200PFG does not support overclocking beyond this specification.

Does the 71V25761S200PFG support both linear and interleaved burst modes?

Yes, the 71V25761S200PFG supports both burst modes via the LBO (Linear/Interleaved Burst Order) pin. When LBO is driven LOW, the device executes linear burst (0,1,2,3); when HIGH, it executes interleaved burst (0,2,1,3). LBO is asynchronous and static - it must remain stable during burst operation to avoid undefined address sequencing in the 71V25761S200PFG.

How does the 71V25761S200PFG handle power-down and sleep states?

The 71V25761S200PFG supports two low-power states: standby (via CE/CS deassertion, ISB1 = 30 mA) and full sleep (via ZZ HIGH, IZZ = 30 mA). In sleep mode, the internal clock is gated but data retention is guaranteed. Recovery from sleep requires tZZR = 100 ns before valid reads resume. The 71V25761S200PFG retains all stored data in both states.

What is the function of the ADV pin on the 71V25761S200PFG?

The ADV (Burst Address Advance) pin controls progression of the internal burst counter. When ADV is LOW, the counter increments after each burst word, enabling full four-word burst transfers. When ADV is HIGH, burst advancement halts - allowing repeated access to the same address or controlled partial bursts. ADV is sampled synchronously on the rising CLK edge in the 71V25761S200PFG.

Is the 71V25761S200PFG pin-compatible with industrial temperature variants?

Yes, the 71V25761S200PFG shares identical pinout, package (PKG100 TQFP), and electrical interface with its industrial-grade counterpart 71V25761S200PFGI. Both operate at 200 MHz with identical timing parameters and control logic. The only difference is temperature qualification: 71V25761S200PFG is commercial grade (0°C to +70°C), while 71V25761S200PFGI is industrial grade (–40°C to +85°C).

71V25761S200PFG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.1 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V25761S200PFG FAQ

1.How can I place an order for 71V25761S200PFG through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V25761S200PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V25761S200PFG reliable?

The price and inventory of 71V25761S200PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V25761S200PFG is usually 5 days.

3.What payment methods are accepted for 71V25761S200PFG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V25761S200PFG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V25761S200PFG?

71V25761S200PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V25761S200PFG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V25761S200PFG?

For technical support, including 71V25761S200PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V25761S200PFG requirements.

6.How does Aetrix verify that 71V25761S200PFG is sourced from the original manufacturer or authorized distributors?

All 71V25761S200PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V25761S200PFG meets industry standards.

7.What is the process for return or replacement of 71V25761S200PFG?

All 71V25761S200PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V25761S200PFG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V25761S200PFG part is unused and in its original packaging.

Return procedure for 71V25761S200PFG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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