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Renesas 71V25761S200PFG8

Part No.:
71V25761S200PFG8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V25761S200PFG8.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,602

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Product details

Overview

71V25761S200PFG8 from Renesas Electronics is a 128K × 36-bit synchronous SRAM with pipelined outputs, burst counter, and single-cycle deselect. It operates at 200 MHz (3.1 ns clock access), supports 3.3 V core and 2.5 V I/O, and features linear/interleaved burst mode via LBO input. Used in high-speed networking line cards for packet buffering and cache coherency.

For engineers reviewing the 71V25761S200PFG8 datasheet, 71V25761S200PFG8 pinout, 71V25761S200PFG8 application, or 71V25761S200PFG8 equivalent, key selection criteria include burst-mode timing compliance, 100-pin TQFP footprint compatibility, industrial-grade temperature support (-40°C to +85°C), and ZZ-controlled sleep mode power management.

Technical Context

This SRAM implements a synchronous interface with registered address, data, and control inputs triggered on the rising edge of CLK. Its internal burst address counter enables four-word burst reads/writes per address, with sequence order determined by LBO state (linear or interleaved) and ADV signal control.

The device integrates self-timed write logic using GW, BWE, and BW1–BW4 for global or byte-level writes, and supports pipelined output with one-cycle latency. Power-down is managed asynchronously via ZZ, while OE provides asynchronous output enable control independent of clock timing.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36 bits = 4.608 Mbit; supports 36-bit wide data paths for RISC processor caches or network switch buffers.
Clock Frequency 200 MHz max (5 ns cycle time); enables 800 MB/s peak bandwidth in burst mode for real-time packet processing.
Access Time 3.1 ns clock-to-data (tCD); guarantees deterministic read latency critical for deterministic real-time systems.
Supply Voltages VDD = 3.3 V ±5% (core), VDDQ = 2.5 V ±5% (I/O); separates core and I/O domains to reduce noise coupling and support mixed-voltage SoC interfacing.
Operating Temperature -40°C to +85°C (industrial grade); validated for deployment in telecom infrastructure and industrial control cabinets without derating.
Power Consumption IDDA = 360 mA @ 200 MHz (commercial); ISB2 = 130 mA with clock running but deselected; IZZ = 30 µA in full sleep - enables low-power standby states.
Burst Mode Linear or interleaved 4-word burst via LBO pin; eliminates external address generation logic and reduces bus arbitration overhead.

Pinout & Package

Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, 0.5 mm pitch.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs Synchronous 18-bit address bus; A0–A16 select 128K words; A17 unused in 128K×36 config but retained for pin compatibility.
CLK Clock Input Rising-edge-triggered master clock; all synchronous operations referenced to this signal; no internal PLL.
CE, CS0, CS1 Chip Enable / Selects Three-level decode (CE LOW + CS0 HIGH + CS1 LOW) enables device; allows multi-SRAM bank selection without address decoding logic.
GW, BWE, BW1–BW4 Write Control Inputs GW enables full 36-bit write; BWE gates BWx; BW1–BW4 each control 9-bit byte (I/O0–7+I/OP1, etc.) - supports partial-word updates without read-modify-write.
ADV, ADSP, ADSC Burst Address Control ADV advances internal burst counter; ADSP/ADSC load initial address - enables cache controller or CPU-driven burst initiation with status handshake.
LBO Burst Order Select Asynchronous static input: LBO = LOW → linear burst (0,1,2,3); LBO = HIGH → interleaved (0,2,1,3); must be stable during operation.
OE Output Enable Asynchronous active-low control; overrides clock timing to place I/O pins in high-Z - essential for bus sharing and hot-swap designs.
ZZ Sleep Mode Asynchronous active-high input; gates internal clock and reduces supply current to 30 µA; retains data; internal pull-down ensures safe default state.
I/O0–I/O31, I/OP1–I/OP4 Data I/O 36-bit bidirectional synchronous bus; I/OP1–I/OP4 are parity bits; all registered on CLK rising edge - eliminates setup/hold violations in high-speed routing.
VDD, VDDQ, VSS Power/Ground VDD = 3.3 V core; VDDQ = 2.5 V I/O; separate supplies isolate switching noise; multiple VSS pins provide low-inductance return paths.

Key Features

Feature Design Value
Pipelined Burst Outputs First data word appears on next CLK rising edge (1-cycle latency); subsequent burst words follow on successive edges - eliminates pipeline stalls in CPU/Switch ASIC interfaces.
Single-Cycle Deselect Device enters high-Z state within one clock cycle after CE/CS deassertion - prevents bus contention during rapid bank switching in multi-SRAM systems.
Self-Timed Write Cycle Internal timing logic completes write without external wait-state generation; compatible with fixed-clock processors lacking dynamic bus control.
2.5 V I/O with 3.3 V Core Enables direct interfacing to 2.5 V logic families (e.g., FPGA I/O banks) while maintaining higher core voltage for speed/power trade-off optimization.
Industrial Temperature Range Validated operation from -40°C to +85°C with no parameter derating - qualified for base station radios, railway signaling, and factory automation controllers.

Applications

High-Speed Network Line Cards Multi-Core Processor Cache Coherence

Use Scenario: Buffering incoming/outgoing packets in 10G/25G Ethernet switch ASICs with strict latency budgets.

IC Role / Device Role / Timing Role: Primary burst-access buffer providing 4-word reads per address cycle to match switch fabric throughput.

Use Value: 200 MHz clock rate and pipelined outputs deliver 800 MB/s sustained bandwidth, eliminating bottlenecks in cut-through forwarding paths.

Use Scenario: Shared L3 cache directory storage in dual-ARM Cortex-A72 SoCs requiring coherent snoop responses.

IC Role / Device Role / Timing Role: Synchronous SRAM holding tag/state entries with single-cycle deselect to support concurrent snoop and fill operations.

Use Value: Single-cycle deselect and burst capability reduce average snoop latency by 35% vs. non-burst SRAMs in cache coherency protocols.

Industrial PLC Motion Control Radar Signal Processing Buffers

Use Scenario: Real-time trajectory interpolation buffers in CNC controllers where deterministic memory access is mandatory.

IC Role / Device Role / Timing Role: Deterministic-latency SRAM storing motion profile segments accessed via DMA bursts.

Use Value: 3.1 ns tCD and guaranteed industrial temp operation ensure sub-microsecond jitter in position loop updates under thermal stress.

Use Scenario: Storing FFT intermediate results in airborne radar front-ends operating in extended temperature environments.

IC Role / Device Role / Timing Role: High-bandwidth buffer between ADC interface and DSP engine, leveraging burst reads to feed parallel MAC units.

Use Value: Linear burst mode aligns with sequential FFT bin addressing; ZZ sleep mode cuts idle power by 99.9% during inter-pulse intervals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1371DV25-200AXC 128K × 36, 200 MHz, 3.3 V core / 2.5 V I/O, same TQFP-100 package; lacks LBO-selectable burst order (fixed linear only). Requires redesign of burst address sequencing logic if interleaved mode is needed; otherwise drop-in for linear-burst use cases. Select when LBO flexibility is unnecessary and Cypress supply chain alignment is preferred.
AS7C33128PFS-200BIN 128K × 36, 200 MHz, 3.3 V core / 2.5 V I/O, TQFP-100; supports single-cycle deselect and pipelined burst but no ZZ sleep mode. Cannot enter ultra-low-power sleep state; unsuitable for battery-backed or intermittent-duty radar applications. Select when continuous operation is required and sleep mode is not part of system power architecture.

Compared with CY7C1371DV25-200AXC and AS7C33128PFS-200BIN, the 71V25761S200PFG8 uniquely combines selectable burst order (LBO), full ZZ sleep mode, and industrial temperature qualification - making it optimal for thermally demanding, power-aware, and protocol-flexible embedded systems.

Availability

71V25761S200PFG8 is available at Aetrix Electronics and suitable for high-speed networking equipment, industrial PLCs, and radar signal processing systems requiring stable component supply across commercial and industrial temperature grades.

Supply support for 71V25761S200PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V25761S200PFG8 belongs to Renesas' high-performance synchronous SRAM product line, designed specifically for deterministic, low-latency memory subsystems in networking, test equipment, and real-time control applications.

FAQ

What is the maximum clock frequency supported by the 71V25761S200PFG8?

The 71V25761S200PFG8 is rated for 200 MHz operation with a 5 ns clock cycle time and 3.1 ns clock-to-data (tCD) access time. This specification applies to the commercial temperature range (0°C to +70°C). For industrial-grade operation (-40°C to +85°C), the device supports up to 183 MHz (3.3 ns tCD) and 166 MHz (3.5 ns tCD), as confirmed in the AC Electrical Characteristics table of the Renesas datasheet.

Does the 71V25761S200PFG8 support both linear and interleaved burst modes?

Yes, the 71V25761S200PFG8 supports both linear and interleaved burst sequences via the LBO (Linear/Interleaved Burst Order) pin. When LBO is driven LOW, the device executes linear burst order (0,1,2,3); when LBO is HIGH, it uses interleaved order (0,2,1,3). The LBO pin is asynchronous and static - it must remain stable during burst operation, as stated in the Pin Definitions table and Burst Sequence Tables.

What power supply voltages does the 71V25761S200PFG8 require?

The 71V25761S200PFG8 requires two independent supply rails: VDD = 3.3 V ±5% for the core logic and VDDQ = 2.5 V ±5% for the I/O interface. These are specified in the Recommended Operating Conditions table. The separation enables clean 2.5 V signaling to FPGAs or ASICs while maintaining higher core voltage for speed, and is mandatory for correct functionality - mixing or omitting either rail will cause malfunction.

How does the ZZ pin function in the 71V25761S200PFG8?

The ZZ pin on the 71V25761S200PFG8 is an asynchronous active-HIGH sleep mode input. When asserted HIGH, it gates the internal clock and reduces supply current to 30 µA (IZZ), while guaranteeing data retention. The pin has an internal pull-down, ensuring safe default behavior during power-up or floating conditions. Recovery from sleep requires tZZR ≥ 100 ns after ZZ returns LOW, as defined in the AC Electrical Characteristics table.

Is the 71V25761S200PFG8 available in industrial temperature grade?

Yes, the 71V25761S200PFG8 is offered in industrial temperature grade (-40°C to +85°C), as confirmed in the Ordering Information table and Absolute Maximum Ratings section. While the "PFG8" suffix denotes tape-and-reel packaging and commercial temperature, the industrial variant is the pin-compatible 71V25761S200PFGI8. Both share identical electrical specs except for speed grading: the industrial version is characterized up to 183 MHz (not 200 MHz) at full temperature range.

71V25761S200PFG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.1 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V25761S200PFG8 FAQ

1.How can I place an order for 71V25761S200PFG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V25761S200PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V25761S200PFG8 reliable?

The price and inventory of 71V25761S200PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V25761S200PFG8 is usually 5 days.

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Once your 71V25761S200PFG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V25761S200PFG8?

For technical support, including 71V25761S200PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V25761S200PFG8 requirements.

6.How does Aetrix verify that 71V25761S200PFG8 is sourced from the original manufacturer or authorized distributors?

All 71V25761S200PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V25761S200PFG8 meets industry standards.

7.What is the process for return or replacement of 71V25761S200PFG8?

All 71V25761S200PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V25761S200PFG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V25761S200PFG8 part is unused and in its original packaging.

Return procedure for 71V25761S200PFG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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