Renesas 71V3556S100PFGI8
- Part No.:
- 71V3556S100PFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V3556S100PFGI8.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3556S100PFGI8 from IDT (now Renesas) is a 128K × 36-bit, 4.5-Mbit, 3.3V synchronous ZBT™ SRAM with zero bus turnaround, pipelined outputs, and 4-word burst capability. It operates at 166 MHz with 3.5 ns clock-to-data access, supports linear/interleaved burst order via LBO pin, and features three chip enables for depth expansion in high-speed networking and packet buffering applications.
For engineers reviewing the 71V3556S100PFGI8 datasheet, 71V3556S100PFGI8 pinout, 71V3556S100PFGI8 application, or 71V3556S100PFGI8 equivalent, key selection criteria include ZBT™ dead-cycle elimination, 100-pin TQFP industrial-grade packaging (–40°C to +85°C), synchronous R/W control with ADV/LD address management, and support for individual byte write (BW1–BW4) and JTAG boundary scan.
Technical Context
The 71V3556S100PFGI8 implements a fully pipelined architecture where address/control signals are registered on the rising CLK edge, and data transfers occur two cycles later. Its ZBT™ feature eliminates bus idle cycles between read/write transitions by synchronizing internal output enable-removing the need for external OE timing control.
It integrates a synchronous 4-word burst counter controlled by ADV/LD and LBO pins, supporting both linear and interleaved addressing sequences. The device uses separate VDD (3.3V core) and VDDQ (3.3V I/O) supplies, includes three active-low/high chip enables (CE1, CE2, CE2), and offers optional IEEE 1149.1 JTAG test interface in BGA variants-though not implemented in this TQFP variant.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); fixed configuration for high-bandwidth data buffering |
| Max Clock Frequency | 166 MHz; enables 3.5 ns clock-to-data access for real-time packet processing |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); decoupling-critical dual-rail design |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus overhead in streaming applications |
| Operating Temperature | –40°C to +85°C industrial grade; qualified for base station and industrial control environments |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); surface-mount compatible with automated assembly |
| ZBT™ Feature | Zero bus turnaround; eliminates dead cycles between read/write transitions for continuous bus utilization |
Pinout & Package
71V3556S100PFGI8 is packaged in a 100-pin plastic thin quad flatpack (TQFP), JEDEC standard PKG100, with 0.5 mm pitch and exposed thermal pad (not electrically connected). Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14, 16, and 66 tolerate VIH-level inputs without direct VDD connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; A0–A16 used for 128K×36 addressing; A17 reserved/NC |
| CLK | Clock Input | Rising-edge-triggered master clock; all synchronous registers (address, control, data) align to this edge |
| R/W | Read/Write Control | Single synchronous signal defining cycle type; sampled with ADV/LD to initiate load operations |
| ADV/LD | Advance Burst / Load Address | Synchronous control: LOW loads new external address; HIGH advances internal burst counter |
| LBO | Linear/Interleaved Burst Order | Static input selecting burst sequence; LOW = linear, HIGH = interleaved; must remain stable during operation |
| BW1–BW4 | Byte Write Enables | Four independent active-low enables for 9-bit bytes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CE1, CE2, CE2 | Chip Enables | Three enables: CE1/CE2 active-low, CE2 active-high; any false condition initiates 2-cycle deselect |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous bus; registered input/output paths ensure timing predictability |
| OE | Output Enable | Asynchronous active-low; tri-states outputs independently of clock-can be tied low for reads |
| ZZ | Sleep Mode | Active-high synchronous input; gates internal clock and reduces power while retaining data |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates dead cycles between read/write transitions, enabling 100% bus utilization in burst-intensive systems |
| Internally Synchronized Output Enable | Removes need for external OE timing control-output register is clock-aligned, simplifying system timing |
| 4-Word Burst Counter with LBO Selection | Reduces address bus traffic by 75% per burst; LBO pin allows runtime selection of linear vs. interleaved order |
| Three Chip Enables for Depth Expansion | Supports seamless memory bank expansion without external logic; 2-cycle deselect ensures clean bus release |
| Individual Byte Write (BW1–BW4) | Enables precise 9-bit sub-word writes without read-modify-write; BWx can be tied low for full-word writes |
| Industrial Temperature Range (–40°C to +85°C) | Qualified for deployment in telecom infrastructure, industrial PLCs, and outdoor embedded systems |
Applications
| Packet Buffering in Switch ASICs | High-Speed Network Line Cards |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: Primary data buffer with zero-turnaround burst reads/writes synchronized to switch fabric clock. Use Value: 166 MHz operation and ZBT™ eliminate bus stalls, sustaining line-rate throughput across 10G/25G interfaces. |
Use Scenario: Frame buffering and header modification in carrier-grade line cards with deterministic latency. IC Role / Device Role / Timing Role: Synchronous SRAM acting as pipeline stage between MAC and PHY layers with ADV/LD-controlled burst addressing. Use Value: 4-word burst + pipelined outputs reduce control overhead, enabling sub-100ns round-trip latency for time-sensitive protocols. |
| Real-Time Signal Processing Buffers | Industrial Motion Control Memory |
|
Use Scenario: Temporary storage of FFT coefficients and filter taps in FPGA-based DSP subsystems. IC Role / Device Role / Timing Role: Low-latency, deterministic-access memory interfaced directly to FPGA fabric using registered I/O paths. Use Value: 3.5 ns clock-to-data access and synchronous byte write (BW1–BW4) allow fine-grained coefficient updates without bus contention. |
Use Scenario: Position lookup tables and motion profile storage in servo drive controllers operating in harsh environments. IC Role / Device Role / Timing Role: Industrial-grade SRAM providing reliable, fast access to trajectory data under temperature cycling and EMI stress. Use Value: –40°C to +85°C rating and ZZ sleep mode support energy-efficient operation during motor idle periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-167AXC | 128K × 32-bit (4-Mbit), 167 MHz, 3.3V, no ZBT™; uses conventional OE-controlled outputs | Lacks zero-turnaround; requires external OE timing coordination; higher pin count for same density | Choose when ZBT™ is unnecessary and higher clock speed (167 MHz) outweighs bus efficiency loss. |
| AS7C33128PFSI-15 | 128K × 32-bit (4-Mbit), 15 ns async access, 3.3V; asynchronous interface, no burst or pipelining | No clock domain; incompatible with synchronous burst architectures; simpler timing but lower bandwidth | Select only for legacy designs requiring async SRAM compatibility-no ZBT™, no ADV/LD, no burst counter. |
Compared with CY7C1362BV33-167AXC and AS7C33128PFSI-15, the 71V3556S100PFGI8 delivers superior bus efficiency via ZBT™ and deterministic latency via pipelined outputs-critical for real-time packet and signal processing where dead cycles degrade throughput.
Availability
71V3556S100PFGI8 is available at Aetrix Electronics and suitable for packet buffering, network line card design, and industrial motion control applications requiring stable component supply, long-term lifecycle support, and industrial-temperature qualification.
Supply support for 71V3556S100PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory, and interface solutions for communications and computing infrastructure.
The 71V3556S100PFGI8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency bus turnaround in high-speed packet-switching, baseband processing, and real-time control systems.
FAQ
What is the memory organization and total capacity of the 71V3556S100PFGI8?
The 71V3556S100PFGI8 is configured as 128K × 36 bits, delivering a total capacity of 4,718,592 bits (4.5 Mbit). This organization supports 36-bit wide data paths ideal for networking and DSP applications requiring parallel word access without external width expansion.
Does the 71V3556S100PFGI8 support burst read and write operations?
Yes, the 71V3556S100PFGI8 supports 4-word synchronous burst operations in both linear and interleaved sequences, selected via the LBO pin. Burst mode is initiated by sampling ADV/LD high after initial address load, and each burst cycle advances the internal counter automatically.
What is the role of the ADV/LD pin in the 71V3556S100PFGI8?
The ADV/LD pin serves a dual function: when sampled LOW at the rising CLK edge, it loads a new external address into the internal register; when sampled HIGH, it advances the burst counter. This single pin enables flexible address management for both random and sequential access patterns in the 71V3556S100PFGI8.
How does the ZBTTM feature improve system performance in the 71V3556S100PFGI8?
The ZBTTM (Zero Bus Turnaround) feature in the 71V3556S100PFGI8 eliminates idle bus cycles between consecutive read and write operations. By internally synchronizing output enable and removing OE timing constraints, it enables back-to-back transactions-increasing effective bus bandwidth by up to 30% in burst-intensive workloads.
Is JTAG boundary scan supported on the 71V3556S100PFGI8 package?
No, JTAG boundary scan (IEEE 1149.1) is not supported on the 71V3556S100PFGI8. The TQFP package lacks dedicated TMS, TDI, TCK, TDO, and TRST pins-these are only available in BGA variants (e.g., "SA" suffix parts). The 71V3556S100PFGI8 is the "S" version, confirming absence of JTAG functionality.
71V3556S100PFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V3556S100PFGI8 FAQ
1.How can I place an order for 71V3556S100PFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3556S100PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3556S100PFGI8 reliable?
The price and inventory of 71V3556S100PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556S100PFGI8 is usually 5 days.
3.What payment methods are accepted for 71V3556S100PFGI8?
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4.How is shipping managed for 71V3556S100PFGI8?
71V3556S100PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3556S100PFGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3556S100PFGI8?
For technical support, including 71V3556S100PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3556S100PFGI8 requirements.
6.How does Aetrix verify that 71V3556S100PFGI8 is sourced from the original manufacturer or authorized distributors?
All 71V3556S100PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556S100PFGI8 meets industry standards.
7.What is the process for return or replacement of 71V3556S100PFGI8?
All 71V3556S100PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556S100PFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3556S100PFGI8 part is unused and in its original packaging.
Return procedure for 71V3556S100PFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3556S100PFGI8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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