Renesas 71V3556S133PFG
- Part No.:
- 71V3556S133PFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V3556S133PFG.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3556S133PFG from IDT (now Renesas) is a 128K × 36-bit, 4.5 Mbit, 3.3V synchronous ZBT™ SRAM with zero bus turnaround, pipelined outputs, and 133 MHz operation (7.5 ns clock-to-data access). It features 4-word burst capability (linear/interleaved), individual byte write control (BW1–BW4), and three chip enables for depth expansion. Used in high-speed networking line cards and packet buffering where deterministic latency and bus efficiency are critical.
For engineers reviewing the 71V3556S133PFG datasheet, 71V3556S133PFG pinout, 71V3556S133PFG application, or 71V3556S133PFG equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, industrial temperature support (–40°C to +85°C), and JTAG boundary-scan availability in SA variants.
Technical Context
The 71V3556S133PFG implements a fully synchronous, positive-edge-triggered architecture with registered address, data, and control inputs. Its ZBT™ feature eliminates dead cycles between read/write transitions by overlapping bus turnaround with internal memory access.
It integrates a 4-word burst counter controlled by ADV/LD and LBO pins, supports pipelined output enable (OE asynchronous), and includes optional IEEE 1149.1 JTAG test logic. The device uses dual power domains: VDD (3.3V ±5%) for core logic and VDDQ (3.3V ±5%) for I/O buffers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 256K × 18-bit via pin-compatible variant |
| Max Clock Frequency | 133 MHz - guarantees ≤7.5 ns clock-to-data access time under specified conditions |
| Supply Voltage | VDD = 3.3V ±5% (core), VDDQ = 3.3V ±5% (I/O); no power sequencing required |
| Burst Mode | 4-word linear or interleaved burst; initiated by ADV/LD high; LBO selects order |
| Operating Temperature | –40°C to +85°C (industrial grade); validated across full voltage and frequency range |
| Package | JEDEC-standard 100-pin TQFP (14 mm × 20 mm); lead-free and RoHS-compliant |
| Input Capacitance | ≤5 pF (TQFP); ensures signal integrity at 133 MHz with minimal loading |
Pinout & Package
Packaged in a 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch, JEDEC MO-140 standard. Pin 1 marked by corner notch; top-side marking includes "71V3556S133PFG" and date code.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit synchronous address bus; latched on rising CLK edge with ADV/LD low and CE asserted |
| CLK | System Clock Input | Primary timing reference; all synchronous operations triggered on rising edge; OE is sole asynchronous signal |
| R/W | Read/Write Control | Synchronous command; determines cycle type (read/write) at load phase; data transfer occurs two clocks later |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 active-low, CE2 active-high); any false condition initiates 2-cycle deselect and tri-state |
| BW1–BW4 | Byte Write Enables | Four active-low signals controlling 9-bit bytes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4); all may be tied low for full-word writes |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous bus; input and output paths both registered on CLK rising edge |
| ADV/LD | Burst Counter Control | Load new external address (ADV/LD = LOW) or increment internal burst counter (ADV/LD = HIGH) |
| LBO | Burst Order Select | Static input: LBO = LOW → linear burst; LBO = HIGH → interleaved burst; must remain stable during operation |
| OE | Output Enable | Asynchronous; drives I/O pins to high-Z when HIGH; may be tied LOW for continuous read operation |
| ZZ | Sleep Mode | Synchronous active-HIGH input; gates internal CLK and reduces power; retains data in sleep state |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between consecutive reads/writes - enables back-to-back memory transactions without bus idle time |
| Pipelined Output Buffer Enable | Internally synchronized OE removes need for external timing control; simplifies system-level bus arbitration |
| 4-Word Burst Counter | Reduces address bus traffic by 75% per burst; LBO pin selects linear/interleaved sequence for cache-line alignment |
| Individual Byte Write Control | Enables partial-word updates without read-modify-write; BW1–BW4 map directly to 9-bit data subwords |
| Three Chip Enables | Supports seamless depth expansion (e.g., 2× 128K×36 → 256K×36) using CE1/CE2/CE2 logic combinations |
| JTAG Boundary Scan (SA version) | IEEE 1149.1-compliant test interface; available only in SA variants; supports production test and board-level diagnostics |
Applications
| High-Speed Packet Buffering | Network Processor Interface |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in 10G/25G Ethernet switch ASICs. IC Role / Device Role / Timing Role: Primary data buffer with deterministic 2-cycle latency and zero-turnaround bus protocol. Use Value: Enables full utilization of 133 MHz bus bandwidth without wait states; supports 4-word bursts matching typical cache line sizes. |
Use Scenario: Interfacing between multi-core network processors and external memory subsystems in telecom baseband units. IC Role / Device Role / Timing Role: Synchronous SRAM acting as low-latency scratchpad for instruction/data caching. Use Value: Pipelined outputs and registered controls reduce setup/hold timing margins, easing PCB layout for high-speed traces. |
| Industrial PLC Data Logging | Medical Imaging Frame Buffer |
|
Use Scenario: Real-time logging of sensor data streams in ruggedized programmable logic controllers. IC Role / Device Role / Timing Role: Industrial-grade SRAM providing reliable, fast-access storage over –40°C to +85°C. Use Value: ZZ sleep mode reduces standby power while retaining data - critical for battery-backed or energy-constrained deployments. |
Use Scenario: Temporary frame storage in digital X-ray and ultrasound systems requiring rapid pixel data access. IC Role / Device Role / Timing Role: High-bandwidth buffer supporting parallel 36-bit pixel word transfers at >100 MB/s. Use Value: 3.3V I/O compatibility with modern FPGA I/O banks; low input capacitance (<5 pF) preserves signal integrity at 133 MHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV133BXC | 128K × 36-bit QDR SRAM; 133 MHz; differential clock; no ZBT™ or burst counter | Requires separate read/write ports and clocking scheme; suited for dual-port streaming, not ZBT™-optimized buses | Select when system uses QDR protocol and requires simultaneous read/write; avoid if ZBT™ timing or burst addressing is required. |
| AS7C33128PFSIG | 128K × 36-bit sync SRAM; 100 MHz max; no JTAG; no ZZ sleep; only commercial temp (0°C to +70°C) | Lacks industrial temp rating, sleep mode, and boundary scan - unsuitable for harsh or test-critical environments | Use only in cost-sensitive commercial designs with relaxed timing and environmental requirements; verify thermal derating at 100 MHz. |
Compared with CY7C1356BV133BXC and AS7C33128PFSIG, the 71V3556S133PFG uniquely delivers ZBT™-enabled zero-turnaround operation, integrated burst counter, industrial temperature support, and optional JTAG - making it optimal for deterministic, high-throughput embedded memory interfaces.
Availability
71V3556S133PFG is available at Aetrix Electronics and suitable for high-speed networking equipment, industrial automation controllers, and medical imaging subsystems requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.
Supply support for 71V3556S133PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications, computing, and industrial markets.
The 71V3556S133PFG belongs to IDT's ZBT™ SRAM product line, engineered specifically for applications demanding zero-bus-turnaround timing, burst efficiency, and robust synchronous operation in bandwidth-constrained systems.
FAQ
What is the maximum operating frequency and corresponding access time for the 71V3556S133PFG?
The 71V3556S133PFG is rated for 133 MHz operation, with a guaranteed clock-to-data access time of ≤7.5 ns under industrial temperature and voltage conditions. This timing is achieved using registered inputs and pipelined outputs, and assumes proper setup/hold compliance on all synchronous signals relative to the CLK rising edge.
Does the 71V3556S133PFG support burst mode, and how is it configured?
Yes, the 71V3556S133PFG supports 4-word burst mode. Burst operation is enabled via the ADV/LD pin: sampling ADV/LD HIGH advances the internal counter, while sampling it LOW loads a new external address. The LBO pin selects linear (LBO = LOW) or interleaved (LBO = HIGH) burst order - a static configuration that must remain stable during burst sequences.
What is the function of the ZZ pin on the 71V3556S133PFG, and does it retain data in sleep mode?
The ZZ pin on the 71V3556S133PFG is a synchronous active-HIGH sleep mode input. When asserted, it gates the internal clock and reduces power consumption to its lowest level while guaranteeing full data retention. This makes the 71V3556S133PFG suitable for power-sensitive applications such as battery-backed industrial loggers or portable medical devices.
How many chip enable signals does the 71V3556S133PFG have, and what are their polarities?
The 71V3556S133PFG has three chip enable signals: CE1 and CE2 are active-low, while CE2 is active-high. All three must be simultaneously asserted (CE1 = LOW, CE2 = LOW, CE2 = HIGH) to select the device. Deselection occurs if any one is deasserted, initiating a 2-cycle tri-state transition on the data bus.
Is JTAG boundary scan available on the 71V3556S133PFG, and which package options support it?
JTAG boundary scan (IEEE 1149.1) is available only on the "SA" variant suffix (e.g., 71V3556SA), not on the base "S" version like the 71V3556S133PFG. It is supported in BGA packages (119-ball and 165-fBGA), but not in the TQFP-100 package used by the 71V3556S133PFG. TRST is optional and internally pulled up.
71V3556S133PFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V3556S133PFG FAQ
1.How can I place an order for 71V3556S133PFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3556S133PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3556S133PFG reliable?
The price and inventory of 71V3556S133PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556S133PFG is usually 5 days.
3.What payment methods are accepted for 71V3556S133PFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3556S133PFG transactions.
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4.How is shipping managed for 71V3556S133PFG?
71V3556S133PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3556S133PFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3556S133PFG?
For technical support, including 71V3556S133PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3556S133PFG requirements.
6.How does Aetrix verify that 71V3556S133PFG is sourced from the original manufacturer or authorized distributors?
All 71V3556S133PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556S133PFG meets industry standards.
7.What is the process for return or replacement of 71V3556S133PFG?
All 71V3556S133PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556S133PFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3556S133PFG part is unused and in its original packaging.
Return procedure for 71V3556S133PFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3556S133PFG Tags

-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
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