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Renesas 71V3556S133PFGI8

Part No.:
71V3556S133PFGI8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V3556S133PFGI8.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,928

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Product details

Overview

71V3556S133PFGI8 from IDT (now Renesas) is a 128K × 36-bit, 4.5 Mbit, 3.3V synchronous ZBT™ SRAM with zero bus turnaround, pipelined outputs, and 4-word burst capability. It operates at 133 MHz (7.5 ns clock-to-data access), supports linear/interleaved burst modes via LBO pin, and features individual byte write enables (BW1–BW4) for precise data control in high-speed memory subsystems such as network packet buffers and cache controllers.

For engineers reviewing the 71V3556S133PFGI8 datasheet, 71V3556S133PFGI8 pinout, 71V3556S133PFGI8 application, or 71V3556S133PFGI8 equivalent, key selection considerations include its ZBT™ architecture eliminating dead cycles between read/write transitions, JEDEC-standard 100-pin TQFP package with industrial temperature support (–40°C to +85°C), and integrated JTAG boundary scan (IEEE 1149.1) for testability in dense PCB layouts.

Technical Context

The 71V3556S133PFGI8 implements a fully synchronous, clock-edge-triggered architecture where address, control, and data registers are sampled on the rising edge of CLK. Its internal burst counter advances on ADV/LD = HIGH, enabling four-cycle burst transfers without external sequencing logic.

ZBT™ operation is achieved through internally synchronized output buffer enable-eliminating OE timing constraints-and dual-phase pipelining: address/control latching occurs on cycle N, while data transfer occurs on cycle N+2. The device supports three chip enables (CE1, CE2, CE2) with two-cycle deselect and optional sleep mode (ZZ pin) for power reduction while retaining data.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36-bit (4.5 Mbit); fixed configuration for high-bandwidth data paths
Max Clock Frequency 133 MHz; enables 532 MB/s peak throughput in burst mode
Clock-to-Data Access 7.5 ns; deterministic latency for real-time memory arbitration
Supply Voltage 3.3 V ±5% (VDD core & VDDQ I/O); compatible with standard 3.3V logic interfaces
Operating Temperature –40°C to +85°C; qualified for industrial-grade embedded and telecom systems
Burst Capability 4-word interleaved or linear burst; reduces address bus overhead by 75% per transaction
Byte Write Control Four independent BW1–BW4 signals; enables partial-word writes without read-modify-write

Pinout & Package

Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, with 0.5 mm pitch. Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14, 16, and 66 tolerate VIH-level inputs without direct VDD connection.

Pin/Terminal Circuit Role Design Meaning
CLK Clock input Rising-edge synchronous reference for all registers; defines timing boundaries for pipelined operation
A0–A16 Address inputs 17-bit address bus supporting 128K depth; latched synchronously with ADV/LD and CEN
I/O0–I/O31, I/OP1–I/OP4 Data I/O (36-bit) Registered bidirectional bus; full-word or byte-selectable via BWx; tri-stated on deselect or OE high
CE1, CE2, CE2 Chip enables Three-signal decode (CE1=L, CE2=L, CE2=H required for select); enables depth expansion without glue logic
ADV/LD Advance burst / Load address Synchronous control: LOW loads new address; HIGH increments internal burst counter
LBO Burst order select Static input: LOW = linear burst (0,1,2,3), HIGH = interleaved (0,2,1,3); sets burst sequence at initialization
ZZ Sleep mode Synchronous HIGH gates internal clock and reduces power; data retention guaranteed during sleep

Key Features

Feature Design Value
ZBT™ Zero Bus Turnaround Eliminates dead cycles between consecutive reads/writes-enables back-to-back transactions at full clock rate
Internally synchronized OE Removes timing-critical OE control; outputs automatically enabled/disabled based on internal state
4-word burst counter Reduces external address generation logic; supports both linear and interleaved sequences via LBO pin
Individual byte write (BW1–BW4) Enables selective 9-bit byte updates without disturbing adjacent bytes-critical for protocol header manipulation
JTAG boundary scan (IEEE 1149.1) Supports automated PCB test and interconnect verification in high-density routing environments

Applications

Network Packet Buffer High-Speed Cache Controller

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches.

IC Role / Device Role / Timing Role: Primary buffering element with zero-turnaround read/write for concurrent ingress/egress processing.

Use Value: 133 MHz burst transfers sustain line-rate 10Gbps traffic without packet loss under bursty load conditions.

Use Scenario: Serving as L2 cache tag/data RAM in FPGA-based compute accelerators.

IC Role / Device Role / Timing Role: Low-latency, pipelined memory interface synchronized to system clock domain.

Use Value: 7.5 ns clock-to-data access and deterministic N+2 pipeline enable tight timing closure in multi-GHz designs.

Telecom Line Card Memory Industrial Real-Time Controller

Use Scenario: Frame buffering in TDM-over-packet gateways requiring jitter-free data alignment.

IC Role / Device Role / Timing Role: Synchronous SRAM with burst counter and LBO-configurable addressing for frame reassembly.

Use Value: Interleaved burst mode matches TDM slot ordering; industrial temp range ensures reliability in uncontrolled chassis environments.

Use Scenario: Deterministic data logging in PLC motion control modules with strict cycle-time budgets.

IC Role / Device Role / Timing Role: High-reliability memory with ZZ sleep mode for power-gated idle periods.

Use Value: Sleep mode reduces active power by >60% while preserving data integrity across 100k+ power cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1356BV33-133BZI 128K × 32-bit organization; no ZBT™ architecture; 133 MHz max, but requires external OE control Lacks zero bus turnaround-introduces 1-cycle gap between read/write; unsuitable for back-to-back memory arbitration Select only if 32-bit data width suffices and ZBT™ is not required for system timing budget
AS7C33128PFSI-133 128K × 36-bit, 3.3V, 133 MHz; no burst counter or LBO; no JTAG; uses standard asynchronous OE Requires external burst sequencing logic; lacks IEEE 1149.1 testability; limited industrial qualification Consider for cost-sensitive designs where JTAG and burst autonomy are non-critical

Compared with CY7C1356BV33-133BZI and AS7C33128PFSI-133, the 71V3556S133PFGI8 uniquely delivers ZBT™-enabled zero-gap memory access, integrated burst control, and production-ready JTAG-making it the only option for deterministic, high-throughput, testable SRAM in telecom and industrial control.

Availability

71V3556S133PFGI8 is available at Aetrix Electronics and suitable for network packet buffering, high-speed cache controllers, and industrial real-time controllers requiring stable component supply across extended product lifecycles.

Supply support for 71V3556S133PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 71V3556S133PFGI8 belongs to IDT's ZBT™ SRAM product line, designed specifically for zero-latency memory subsystems in high-speed networking, telecom infrastructure, and real-time embedded systems demanding deterministic access and burst efficiency.

FAQ

What does the 'S' suffix in 71V3556S133PFGI8 indicate?

The 'S' denotes the standard version of the IDT71V3556 family-non-JTAG (no TMS/TDI/TDO/TRST pins activated). This distinguishes it from the 'SA' variant, which includes full IEEE 1149.1 boundary scan functionality. The 71V3556S133PFGI8 retains all core ZBT™ SRAM features including burst counter, byte write, and sleep mode, but omits optional JTAG test circuitry.

Does 71V3556S133PFGI8 support both linear and interleaved burst modes?

Yes, the 71V3556S133PFGI8 supports both burst sequences via the LBO (Linear Burst Order) pin. When LBO is driven LOW, the device executes linear bursts (e.g., addresses 0,1,2,3); when HIGH, it performs interleaved bursts (e.g., 0,2,1,3). This static configuration is set at power-up and remains fixed during operation-no runtime switching is supported.

How does the ZBT™ feature eliminate dead cycles in 71V3556S133PFGI8?

The ZBT™ architecture in the 71V3556S133PFGI8 eliminates dead cycles by internally synchronizing output buffer enable-removing the need for external OE timing control-and using pipelined register stages so that the next memory access (read or write) can begin immediately after the previous one completes. This enables true back-to-back transactions at full clock rate without bus turnaround gaps.

What is the function of the ZZ pin on 71V3556S133PFGI8?

The ZZ pin on the 71V3556S133PFGI8 is a synchronous sleep mode input. When asserted HIGH, it gates the internal clock and places the device into its lowest-power state while guaranteeing data retention. The 71V3556S133PFGI8 exits sleep mode synchronously on the next valid CLK edge after ZZ returns LOW, with no reset or initialization sequence required.

Can 71V3556S133PFGI8 be used in place of 71V3556SA133PFGI8?

No-71V3556S133PFGI8 and 71V3556SA133PFGI8 are not pin-compatible replacements. While both share identical memory organization, timing, and core functionality, the 'SA' variant activates JTAG pins (TMS, TDI, TCK, TDO, TRST) that are NC (no-connect) on the 'S' version. Substituting them requires PCB layout changes and firmware validation of JTAG functionality.

71V3556S133PFGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V3556S133PFGI8 FAQ

1.How can I place an order for 71V3556S133PFGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3556S133PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3556S133PFGI8 reliable?

The price and inventory of 71V3556S133PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556S133PFGI8 is usually 5 days.

3.What payment methods are accepted for 71V3556S133PFGI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3556S133PFGI8 transactions.

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71V3556S133PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3556S133PFGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3556S133PFGI8?

For technical support, including 71V3556S133PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3556S133PFGI8 requirements.

6.How does Aetrix verify that 71V3556S133PFGI8 is sourced from the original manufacturer or authorized distributors?

All 71V3556S133PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556S133PFGI8 meets industry standards.

7.What is the process for return or replacement of 71V3556S133PFGI8?

All 71V3556S133PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556S133PFGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3556S133PFGI8 part is unused and in its original packaging.

Return procedure for 71V3556S133PFGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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