Renesas 71V3556S133PFGI8
- Part No.:
- 71V3556S133PFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V3556S133PFGI8.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,928
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
71V3556S133PFGI8 from IDT (now Renesas) is a 128K × 36-bit, 4.5 Mbit, 3.3V synchronous ZBT™ SRAM with zero bus turnaround, pipelined outputs, and 4-word burst capability. It operates at 133 MHz (7.5 ns clock-to-data access), supports linear/interleaved burst modes via LBO pin, and features individual byte write enables (BW1–BW4) for precise data control in high-speed memory subsystems such as network packet buffers and cache controllers.
For engineers reviewing the 71V3556S133PFGI8 datasheet, 71V3556S133PFGI8 pinout, 71V3556S133PFGI8 application, or 71V3556S133PFGI8 equivalent, key selection considerations include its ZBT™ architecture eliminating dead cycles between read/write transitions, JEDEC-standard 100-pin TQFP package with industrial temperature support (–40°C to +85°C), and integrated JTAG boundary scan (IEEE 1149.1) for testability in dense PCB layouts.
Technical Context
The 71V3556S133PFGI8 implements a fully synchronous, clock-edge-triggered architecture where address, control, and data registers are sampled on the rising edge of CLK. Its internal burst counter advances on ADV/LD = HIGH, enabling four-cycle burst transfers without external sequencing logic.
ZBT™ operation is achieved through internally synchronized output buffer enable-eliminating OE timing constraints-and dual-phase pipelining: address/control latching occurs on cycle N, while data transfer occurs on cycle N+2. The device supports three chip enables (CE1, CE2, CE2) with two-cycle deselect and optional sleep mode (ZZ pin) for power reduction while retaining data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); fixed configuration for high-bandwidth data paths |
| Max Clock Frequency | 133 MHz; enables 532 MB/s peak throughput in burst mode |
| Clock-to-Data Access | 7.5 ns; deterministic latency for real-time memory arbitration |
| Supply Voltage | 3.3 V ±5% (VDD core & VDDQ I/O); compatible with standard 3.3V logic interfaces |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade embedded and telecom systems |
| Burst Capability | 4-word interleaved or linear burst; reduces address bus overhead by 75% per transaction |
| Byte Write Control | Four independent BW1–BW4 signals; enables partial-word writes without read-modify-write |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, with 0.5 mm pitch. Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14, 16, and 66 tolerate VIH-level inputs without direct VDD connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge synchronous reference for all registers; defines timing boundaries for pipelined operation |
| A0–A16 | Address inputs | 17-bit address bus supporting 128K depth; latched synchronously with ADV/LD and CEN |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O (36-bit) | Registered bidirectional bus; full-word or byte-selectable via BWx; tri-stated on deselect or OE high |
| CE1, CE2, CE2 | Chip enables | Three-signal decode (CE1=L, CE2=L, CE2=H required for select); enables depth expansion without glue logic |
| ADV/LD | Advance burst / Load address | Synchronous control: LOW loads new address; HIGH increments internal burst counter |
| LBO | Burst order select | Static input: LOW = linear burst (0,1,2,3), HIGH = interleaved (0,2,1,3); sets burst sequence at initialization |
| ZZ | Sleep mode | Synchronous HIGH gates internal clock and reduces power; data retention guaranteed during sleep |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between consecutive reads/writes-enables back-to-back transactions at full clock rate |
| Internally synchronized OE | Removes timing-critical OE control; outputs automatically enabled/disabled based on internal state |
| 4-word burst counter | Reduces external address generation logic; supports both linear and interleaved sequences via LBO pin |
| Individual byte write (BW1–BW4) | Enables selective 9-bit byte updates without disturbing adjacent bytes-critical for protocol header manipulation |
| JTAG boundary scan (IEEE 1149.1) | Supports automated PCB test and interconnect verification in high-density routing environments |
Applications
| Network Packet Buffer | High-Speed Cache Controller |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches. IC Role / Device Role / Timing Role: Primary buffering element with zero-turnaround read/write for concurrent ingress/egress processing. Use Value: 133 MHz burst transfers sustain line-rate 10Gbps traffic without packet loss under bursty load conditions. |
Use Scenario: Serving as L2 cache tag/data RAM in FPGA-based compute accelerators. IC Role / Device Role / Timing Role: Low-latency, pipelined memory interface synchronized to system clock domain. Use Value: 7.5 ns clock-to-data access and deterministic N+2 pipeline enable tight timing closure in multi-GHz designs. |
| Telecom Line Card Memory | Industrial Real-Time Controller |
|
Use Scenario: Frame buffering in TDM-over-packet gateways requiring jitter-free data alignment. IC Role / Device Role / Timing Role: Synchronous SRAM with burst counter and LBO-configurable addressing for frame reassembly. Use Value: Interleaved burst mode matches TDM slot ordering; industrial temp range ensures reliability in uncontrolled chassis environments. |
Use Scenario: Deterministic data logging in PLC motion control modules with strict cycle-time budgets. IC Role / Device Role / Timing Role: High-reliability memory with ZZ sleep mode for power-gated idle periods. Use Value: Sleep mode reduces active power by >60% while preserving data integrity across 100k+ power cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV33-133BZI | 128K × 32-bit organization; no ZBT™ architecture; 133 MHz max, but requires external OE control | Lacks zero bus turnaround-introduces 1-cycle gap between read/write; unsuitable for back-to-back memory arbitration | Select only if 32-bit data width suffices and ZBT™ is not required for system timing budget |
| AS7C33128PFSI-133 | 128K × 36-bit, 3.3V, 133 MHz; no burst counter or LBO; no JTAG; uses standard asynchronous OE | Requires external burst sequencing logic; lacks IEEE 1149.1 testability; limited industrial qualification | Consider for cost-sensitive designs where JTAG and burst autonomy are non-critical |
Compared with CY7C1356BV33-133BZI and AS7C33128PFSI-133, the 71V3556S133PFGI8 uniquely delivers ZBT™-enabled zero-gap memory access, integrated burst control, and production-ready JTAG-making it the only option for deterministic, high-throughput, testable SRAM in telecom and industrial control.
Availability
71V3556S133PFGI8 is available at Aetrix Electronics and suitable for network packet buffering, high-speed cache controllers, and industrial real-time controllers requiring stable component supply across extended product lifecycles.
Supply support for 71V3556S133PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V3556S133PFGI8 belongs to IDT's ZBT™ SRAM product line, designed specifically for zero-latency memory subsystems in high-speed networking, telecom infrastructure, and real-time embedded systems demanding deterministic access and burst efficiency.
FAQ
What does the 'S' suffix in 71V3556S133PFGI8 indicate?
The 'S' denotes the standard version of the IDT71V3556 family-non-JTAG (no TMS/TDI/TDO/TRST pins activated). This distinguishes it from the 'SA' variant, which includes full IEEE 1149.1 boundary scan functionality. The 71V3556S133PFGI8 retains all core ZBT™ SRAM features including burst counter, byte write, and sleep mode, but omits optional JTAG test circuitry.
Does 71V3556S133PFGI8 support both linear and interleaved burst modes?
Yes, the 71V3556S133PFGI8 supports both burst sequences via the LBO (Linear Burst Order) pin. When LBO is driven LOW, the device executes linear bursts (e.g., addresses 0,1,2,3); when HIGH, it performs interleaved bursts (e.g., 0,2,1,3). This static configuration is set at power-up and remains fixed during operation-no runtime switching is supported.
How does the ZBT™ feature eliminate dead cycles in 71V3556S133PFGI8?
The ZBT™ architecture in the 71V3556S133PFGI8 eliminates dead cycles by internally synchronizing output buffer enable-removing the need for external OE timing control-and using pipelined register stages so that the next memory access (read or write) can begin immediately after the previous one completes. This enables true back-to-back transactions at full clock rate without bus turnaround gaps.
What is the function of the ZZ pin on 71V3556S133PFGI8?
The ZZ pin on the 71V3556S133PFGI8 is a synchronous sleep mode input. When asserted HIGH, it gates the internal clock and places the device into its lowest-power state while guaranteeing data retention. The 71V3556S133PFGI8 exits sleep mode synchronously on the next valid CLK edge after ZZ returns LOW, with no reset or initialization sequence required.
Can 71V3556S133PFGI8 be used in place of 71V3556SA133PFGI8?
No-71V3556S133PFGI8 and 71V3556SA133PFGI8 are not pin-compatible replacements. While both share identical memory organization, timing, and core functionality, the 'SA' variant activates JTAG pins (TMS, TDI, TCK, TDO, TRST) that are NC (no-connect) on the 'S' version. Substituting them requires PCB layout changes and firmware validation of JTAG functionality.
71V3556S133PFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V3556S133PFGI8 FAQ
1.How can I place an order for 71V3556S133PFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3556S133PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3556S133PFGI8 reliable?
The price and inventory of 71V3556S133PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556S133PFGI8 is usually 5 days.
3.What payment methods are accepted for 71V3556S133PFGI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3556S133PFGI8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V3556S133PFGI8?
71V3556S133PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3556S133PFGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3556S133PFGI8?
For technical support, including 71V3556S133PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3556S133PFGI8 requirements.
6.How does Aetrix verify that 71V3556S133PFGI8 is sourced from the original manufacturer or authorized distributors?
All 71V3556S133PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556S133PFGI8 meets industry standards.
7.What is the process for return or replacement of 71V3556S133PFGI8?
All 71V3556S133PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556S133PFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3556S133PFGI8 part is unused and in its original packaging.
Return procedure for 71V3556S133PFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3556S133PFGI8 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

