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Renesas 71V3556S166PFG8

Part No.:
71V3556S166PFG8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V3556S166PFG8.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,745

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Product details

Overview

71V3556S166PFG8 from IDT (now Renesas) is a 128K × 36-bit, 4.5-Mbit, 3.3V synchronous ZBT™ SRAM with zero bus turnaround, pipelined outputs, and 166 MHz operation (3.5 ns clock-to-data access). It features 4-word burst capability (linear/interleaved), individual byte write control (BW1–BW4), and three chip enables for depth expansion - deployed in high-speed networking buffers, packet switching ASIC interfaces, and real-time DSP memory subsystems.

For engineers reviewing the 71V3556S166PFG8 datasheet, 71V3556S166PFG8 pinout, 71V3556S166PFG8 application, or 71V3556S166PFG8 equivalent, key selection criteria include ZBT™ bus turnaround elimination, 166 MHz synchronous timing compliance, TQFP-100 packaging with verified 100-pin JEDEC footprint, industrial temperature support (–40°C to +85°C), and JTAG boundary-scan readiness (IEEE 1149.1).

Technical Context

The 71V3556S166PFG8 implements a fully pipelined architecture with positive-edge-triggered address, data, and control registers synchronized to CLK. Its internal burst counter advances on ADV/LD = HIGH, while external address loading occurs on ADV/LD = LOW - enabling seamless interleaving between load and burst cycles without dead cycles.

ZBT™ operation eliminates bus turnaround latency by allowing immediate read-after-write or write-after-read transitions via dedicated R/W control and synchronized OE-independent output buffering. The device supports both linear and interleaved burst sequences selected by static LBO input, with all I/O paths registered for deterministic 3.5 ns tCD timing at 166 MHz.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36-bit (4.5 Mbit); supports full-word or individual byte writes via BW1–BW4
Max Clock Frequency 166 MHz; enables 6.0 ns cycle time for high-throughput packet buffering in switch fabric designs
Clock-to-Data Access 3.5 ns; guarantees deterministic read latency for real-time control loops and time-critical DMA transfers
Supply Voltage VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; dual-rail I/O allows independent noise isolation of core and interface domains
Operating Temperature –40°C to +85°C (industrial grade); validated for deployment in telecom line cards and base station equipment
Burst Mode 4-word linear or interleaved burst; reduces address bus traffic by 75% per memory transaction in streaming applications
Package 100-pin TQFP (14 mm × 20 mm, JEDEC standard); compatible with automated SMT assembly and thermal management in dense PCB layouts

Pinout & Package

71V3556S166PFG8 is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm pitch leads. Pin 1 is located at top-left corner (notch-mark side), and pin numbering proceeds counterclockwise.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs Synchronous inputs; 18-bit address bus supporting 128K × 36 configuration (A0–A16 used; A17 reserved)
CLK Clock Input Primary timing reference; all synchronous operations triggered on rising edge; no internal clock division
R/W Read/Write Control Single-pin command determining cycle direction; sampled synchronously with CLK to initiate read or write two cycles later
ADV/LD Advance Burst / Load Address Controls burst counter (HIGH) or loads new external address (LOW); critical for burst sequence continuity and address transition integrity
BW1–BW4 Byte Write Enables Active-low per-byte controls for I/O[0:7]/I/OP1 through I/O[24:31]/I/OP4; enables partial writes without masking logic
CE1, CE2, CE2 Chip Enables Three independent enables (CE1/CE2 active-low, CE2 active-high); allow flexible depth expansion and hierarchical memory decoding
I/O0–I/O31, I/OP1–I/OP4 Data I/O 36-bit bidirectional synchronous bus; registered input/output paths ensure clean setup/hold margins at 166 MHz
OE Output Enable Asynchronous control; tri-states outputs immediately when HIGH - useful for bus arbitration without clock dependency
LBO Linear/Interleaved Burst Order Static selection pin; LOW = linear (0,1,2,3), HIGH = interleaved (0,2,1,3); must remain stable during burst execution
ZZ Sleep Mode Active-high synchronous entry into low-power retention mode; preserves data while reducing dynamic power consumption

Key Features

Feature Design Value
ZBTTM Zero Bus Turnaround Eliminates dead cycles between read/write transitions - enables continuous 166 MHz bus utilization in full-duplex memory controllers
Pipelined Output Buffer Internally synchronized OE-free output enable; removes external timing constraints on output gating and simplifies PCB layout
4-Word Burst Counter Reduces address bus activity by 75% per transaction; supports both linear and interleaved sequences for cache-line-aligned access
Individual Byte Write Control Four independent BWx pins allow selective 9-bit byte updates without read-modify-write overhead - critical for protocol header manipulation
JTAG Boundary Scan (IEEE 1149.1) Optional test interface available in BGA variants; not present in TQFP-100 (PFG8) package - confirmed by pinout documentation
Industrial Temperature Range Validated operation from –40°C to +85°C; qualified for deployment in uncontrolled ambient environments like outdoor wireless infrastructure

Applications

High-Speed Packet Switching Real-Time DSP Memory Subsystem

Use Scenario: Line-rate buffering in Layer 2/3 Ethernet switches handling 10 Gbps+ traffic with strict latency budgets.

IC Role / Device Role / Timing Role: Primary data buffer for ingress/egress packet queues, interfacing directly with MAC and switch fabric controllers via synchronous 166 MHz bus.

Use Value: ZBT™ zero turnaround enables back-to-back read/write bursts without pipeline stalls, sustaining >95% bus utilization under worst-case traffic patterns.

Use Scenario: Real-time audio/video processing in broadcast encoders requiring deterministic memory access for FFT and FIR filter coefficient tables.

IC Role / Device Role / Timing Role: Low-latency scratchpad memory for DSP cores executing time-critical algorithms with tight jitter requirements.

Use Value: 3.5 ns clock-to-data access and pipelined outputs guarantee sub-6 ns read latency - meeting <10 ns jitter thresholds for professional media timing.

Telecom Baseband Processing Industrial PLC Data Logging

Use Scenario: Channel bonding and OFDM symbol buffering in LTE/5G remote radio units with multi-carrier aggregation.

IC Role / Device Role / Timing Role: High-bandwidth intermediate storage between ADC/DAC interfaces and baseband processors, operating at 166 MHz DDR-equivalent throughput.

Use Value: 4-word burst mode aligns with 128-bit wide datapaths in modem SoCs, cutting address decode overhead and improving effective bandwidth by 3× vs. single-word access.

Use Scenario: Deterministic cyclic data capture in programmable logic controllers logging sensor inputs at 1 kHz with guaranteed timestamp accuracy.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM buffer holding last 10 seconds of process data, accessible via deterministic 166 MHz synchronous reads.

Use Value: Industrial temperature rating (–40°C to +85°C) and sleep mode (ZZ pin) ensure reliable operation in harsh factory environments with minimal power draw during idle periods.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-166AXC 128K × 32-bit organization; no ZZ sleep mode; 165-ball fBGA only; lacks BWx granularity (quad-word write only) Requires data bus width adaptation (32-bit vs. 36-bit); unsuitable for protocols requiring 36-bit alignment (e.g., IEEE 1588 timestamp fields) Select only if system uses 32-bit data path and does not require per-byte write control or industrial temp support.
AS7C33128PFS-166BIN 128K × 36-bit; same TQFP-100 package; no JTAG; lacks ADV/LD dual-mode burst control (fixed linear burst only) Cannot emulate interleaved burst sequences needed for cache-line-miss optimization in certain ASIC interfaces Valid drop-in replacement for linear-burst-only systems; verify ADV/LD timing compatibility before substitution.

Compared with CY7C1362BV33-166AXC and AS7C33128PFS-166BIN, the 71V3556S166PFG8 uniquely delivers 36-bit width with per-byte write enables, true ZBT™ bus turnaround elimination, and industrial-grade reliability in TQFP - making it optimal for telecom and industrial control where deterministic timing and protocol alignment are non-negotiable.

Availability

71V3556S166PFG8 is available at Aetrix Electronics and suitable for high-speed packet switching, real-time DSP memory subsystems, and industrial PLC data logging requiring stable component supply across extended product lifecycles.

Supply support for 71V3556S166PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.

The 71V3556S166PFG8 belongs to IDT's ZBT™ SRAM family, engineered specifically for zero-latency memory subsystems in network processors, switch fabrics, and real-time signal processing platforms demanding deterministic 166 MHz throughput.

FAQ

What is the memory organization and total capacity of the 71V3556S166PFG8?

The 71V3556S166PFG8 is configured as 128K × 36-bit, delivering a total capacity of 4,718,592 bits (4.5 Mbit). This organization supports full 36-bit word access or granular 9-bit byte writes using BW1–BW4 signals - essential for protocol-aware memory systems where field-level updates are required without full-word overwrites.

Does the 71V3556S166PFG8 support burst mode, and how is burst order controlled?

Yes, the 71V3556S166PFG8 supports 4-word burst mode with selectable linear or interleaved sequencing. Burst order is determined by the static LBO pin: LOW selects linear (0,1,2,3), HIGH selects interleaved (0,2,1,3). The ADV/LD pin controls whether the internal burst counter advances (HIGH) or loads a new external address (LOW), enabling seamless burst chaining.

What is the function of the ZZ pin on the 71V3556S166PFG8, and how does it affect power consumption?

The ZZ pin on the 71V3556S166PFG8 is a synchronous sleep mode input. When driven HIGH, it gates the internal clock and reduces dynamic power consumption to its lowest level while maintaining full data retention. This feature is critical for energy-sensitive applications such as battery-backed industrial controllers or fanless telecom modules where thermal headroom is constrained.

Is JTAG boundary scan supported on the 71V3556S166PFG8 in its TQFP-100 package?

No, JTAG boundary scan (IEEE 1149.1) is not supported on the 71V3556S166PFG8 in the PFG8 (TQFP-100) package. JTAG signals (TMS, TDI, TCK, TDO, TRST) are only available in BGA variants (e.g., BG119, BQ165) and marked as NC (no connect) in TQFP pinouts. The 71V3556S166PFG8 datasheet explicitly confirms JTAG is optional and package-dependent.

How does the 71V3556S166PFG8 achieve zero bus turnaround, and what design benefit does this provide?

The 71V3556S166PFG8 achieves zero bus turnaround (ZBTTM) through dedicated R/W control and internally synchronized output buffering that eliminates the need for external OE timing coordination. This allows immediate read-after-write or write-after-read transitions without dead cycles - sustaining >95% bus utilization in high-throughput applications like packet switching and real-time DSP, where traditional SRAMs incur 1–2 cycle penalties per direction change.

71V3556S166PFG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V3556S166PFG8 FAQ

1.How can I place an order for 71V3556S166PFG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3556S166PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3556S166PFG8 reliable?

The price and inventory of 71V3556S166PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556S166PFG8 is usually 5 days.

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71V3556S166PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3556S166PFG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3556S166PFG8?

For technical support, including 71V3556S166PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3556S166PFG8 requirements.

6.How does Aetrix verify that 71V3556S166PFG8 is sourced from the original manufacturer or authorized distributors?

All 71V3556S166PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556S166PFG8 meets industry standards.

7.What is the process for return or replacement of 71V3556S166PFG8?

All 71V3556S166PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556S166PFG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3556S166PFG8 part is unused and in its original packaging.

Return procedure for 71V3556S166PFG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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