Renesas 71V3556SA100BGI
- Part No.:
- 71V3556SA100BGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V3556SA100BGI.pdf
- Description:
- IC SRAM 4.5MBIT PAR 119PBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,082
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
71V3556SA100BGI from IDT (now Renesas) is a 128K × 36-bit, 4.5 Mbit, 3.3V synchronous ZBT™ SRAM with zero bus turnaround, pipelined outputs, and 4-word burst capability. It operates at 166 MHz with 3.5 ns clock-to-data access, supports linear/interleaved burst via LBO pin, and features individual byte write (BW1–BW4), JTAG boundary scan (IEEE 1149.1), and sleep mode (ZZ). It is used in high-speed networking packet buffers and telecom line card data path memory.
For engineers reviewing the 71V3556SA100BGI datasheet, 71V3556SA100BGI pinout, 71V3556SA100BGI application, or 71V3556SA100BGI equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, burst counter behavior under ADV/LD control, and JTAG test interface availability for system-level validation.
Technical Context
The 71V3556SA100BGI implements a fully synchronous, positive-edge-triggered architecture with registered address, control, and data paths. Its ZBT™ feature eliminates dead cycles between read/write transitions by decoupling bus direction control from OE-output enable is asynchronous but internally synchronized via clocked output registers.
It integrates a 4-word burst counter driven by ADV/LD and LBO, supporting both linear and interleaved sequences. The device uses three chip enables (CE1, CE2, CE2) with two-cycle deselect timing and includes optional IEEE 1149.1 JTAG for boundary scan testing-available only in BGA variants, not in this TQFP-100 variant.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); fixed configuration for this part number |
| Max Clock Frequency | 166 MHz; enables 6 ns cycle time in pipelined systems |
| Clock-to-Data Access | 3.5 ns; measured from CLK rising edge to valid Q output |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate power domains |
| Burst Capability | 4-word burst (linear or interleaved); controlled by LBO pin and ADV/LD state |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for extended thermal environments |
| Package | JEDEC-standard 100-pin TQFP (14 mm × 20 mm); lead-free and RoHS-compliant |
Pinout & Package
71V3556SA100BGI is packaged in a 100-pin thin quad flatpack (TQFP), JEDEC MO-145AC, 14 mm × 20 mm body, 0.5 mm pitch. Pin 1 is located at bottom-left corner when notch faces up; top-side marking includes "71V3556SA100BGI" and date code.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit synchronous address bus; latched on rising CLK edge with ADV/LD low and CEN low |
| CLK | System Clock Input | Primary timing reference; all synchronous inputs sampled on rising edge |
| R/W | Read/Write Control | Synchronous signal defining load-cycle operation type; determines read vs. write two cycles later |
| ADV/LD | Burst Counter Control | Loads new external address (low) or advances internal burst counter (high); defines burst sequence start point |
| LBO | Burst Order Select | Static input selecting linear (LBO = low) or interleaved (LBO = high) 4-word burst sequence |
| BW1–BW4 | Byte Write Enables | Four independent active-low enables for 9-bit bytes; support partial writes without masking logic |
| CE1, CE2, CE2 | Chip Enable Inputs | Three enables with mixed polarity (CE2 active-high); enable depth expansion with two-cycle deselect |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous bus; registered input/output paths eliminate external latch requirements |
| OE | Output Enable | Asynchronous control; tri-states outputs immediately when high-no clock dependency |
| ZZ | Sleep Mode Input | Active-high synchronous entry into low-power retention mode; clocks gated internally, data retained |
| VDD, VDDQ, VSS | Power/Ground | VDD = 3.3 V core supply; VDDQ = 3.3 V I/O supply; VSS = common ground; decoupling required per pin |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between consecutive reads and writes-enables continuous 166 MHz bus utilization without turnaround overhead |
| Pipelined Output Registers | Internally synchronized output buffer eliminates need for external OE timing control; simplifies PCB layout and timing closure |
| 4-Word Burst Counter | Reduces address bus traffic by 75% during sequential accesses; configurable linear/interleaved order via LBO pin |
| Individual Byte Write (BW1–BW4) | Enables granular 9-bit writes without external byte-enable logic-reduces FPGA/CPLD resource usage in controller designs |
| Three Chip Enables with Depth Expansion | Supports seamless memory depth scaling using CE1/CE2/CE2 logic-no external decoding needed for multi-chip configurations |
Applications
| High-Speed Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in network switches/routers before forwarding decisions. IC Role / Device Role / Timing Role: Primary data path SRAM providing low-latency, burst-capable storage with deterministic 3.5 ns read access and zero-turnaround write-read transitions. Use Value: Enables full-line-rate packet buffering at 10 Gbps+ with no bus idle cycles-critical for jitter-sensitive telecom applications. | Use Scenario: Holding real-time voice/video payload in DSLAMs, OLTs, or base station controllers where deterministic latency is mandatory. IC Role / Device Role / Timing Role: Synchronous SRAM acting as dual-port-accessible frame buffer, interfaced to DSPs or ASICs via 166 MHz clock domain. Use Value: 128K × 36 organization matches standard ATM/PTM cell sizes; burst mode reduces controller address generation overhead by 4×. |
| Industrial PLC Data Logging | Test Equipment Pattern Memory |
Use Scenario: Capturing sensor data streams from high-speed analog front-ends in programmable logic controllers operating in harsh industrial environments. IC Role / Device Role / Timing Role: Industrial-grade (–40°C to +85°C) SRAM serving as volatile pattern store with guaranteed data retention in ZZ sleep mode. Use Value: Sleep mode (ZZ) reduces standby power to <100 µA while preserving contents-extends battery life in portable diagnostic tools. | Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) for semiconductor wafer probing and functional validation. IC Role / Device Role / Timing Role: High-reliability SRAM providing glitch-free, JTAG-testable memory for vector playback at 166 MHz clock rates. Use Value: Optional JTAG boundary scan (though not implemented in this TQFP variant) supports production test coverage; robust 3.3V I/O ensures noise immunity in noisy lab environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV18-167BZI | 256K × 18-bit organization; 167 MHz max frequency; different burst addressing scheme (no LBO pin) | Requires redesign of address mapping and burst control logic; not drop-in compatible | Select only if 18-bit bus width and higher density are required, and controller can adapt to Cypress burst protocol |
| AS7C33128PFSIG | 128K × 32-bit organization; no ZBT™ or burst counter; asynchronous OE; no JTAG or ZZ pin | Lacks zero-turnaround timing and burst capability-unsuitable for high-throughput streaming applications | Consider only for cost-sensitive, non-pipelined systems where 4-bit width reduction and simplified interface outweigh performance loss |
Compared with CY7C1356BV18-167BZI and AS7C33128PFSIG, the 71V3556SA100BGI uniquely delivers ZBT™-enabled continuous bus utilization, 36-bit width matching legacy bus architectures, and industrial temperature support-all in a TQFP package with proven reliability in telecom infrastructure.
Availability
71V3556SA100BGI is available at Aetrix Electronics and suitable for high-speed packet buffering, telecom line card memory, and industrial PLC data logging requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 71V3556SA100BGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V3556SA100BGI belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency bus turnaround in high-speed data path applications such as network processors, switch fabric controllers, and real-time signal processing systems.
FAQ
What is the maximum operating frequency of the 71V3556SA100BGI?
The 71V3556SA100BGI is rated for a maximum clock frequency of 166 MHz. This specification is validated under industrial temperature conditions (–40°C to +85°C) and 3.3 V ±5% supply, with timing margins meeting JEDEC TQFP-100 package constraints. At this rate, the device achieves 3.5 ns clock-to-data access, enabling deterministic pipelined operation in high-speed systems.
Does the 71V3556SA100BGI support JTAG boundary scan?
No, the 71V3556SA100BGI in the TQFP-100 package does not implement JTAG boundary scan. While the SA suffix indicates JTAG capability in BGA variants (e.g., BG119 or BQ165), the TQFP-100 pinout omits TMS, TDI, TCK, TDO, and TRST pins-confirmed by the PKG100 pin configuration diagrams. JTAG is physically unavailable on this package variant.
How does the ZBT™ feature eliminate dead cycles in the 71V3556SA100BGI?
The ZBT™ feature in the 71V3556SA100BGI removes bus turnaround delays by decoupling direction control from OE. Unlike conventional SRAMs requiring OE deassertion before changing R/W state, the 71V3556SA100BGI uses internally synchronized output registers-so read-to-write or write-to-read transitions occur without inserting idle cycles, sustaining 100% bus utilization at 166 MHz.
What is the function of the ADV/LD and LBO pins on the 71V3556SA100BGI?
On the 71V3556SA100BGI, ADV/LD controls the burst counter: low loads a new external address, high advances the internal counter. LBO selects burst order-low enables linear sequence (0,1,2,3), high enables interleaved (0,2,3,1). Both signals are sampled synchronously on the rising CLK edge and define how the 4-word burst accesses memory without external address generation.
Can the 71V3556SA100BGI operate with different supply voltages for core and I/O?
Yes-the 71V3556SA100BGI requires separate 3.3 V ±5% supplies: VDD for core logic and VDDQ for I/O drivers. This dual-supply architecture allows independent noise management and voltage optimization. Both rails must be within specification simultaneously; VDDQ must not exceed VDD +0.3 V, and VDD must remain ≥ VDDQ −0.3 V to ensure signal integrity and latch-up immunity.
71V3556SA100BGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V3556SA100BGI FAQ
1.How can I place an order for 71V3556SA100BGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3556SA100BGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3556SA100BGI reliable?
The price and inventory of 71V3556SA100BGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556SA100BGI is usually 5 days.
3.What payment methods are accepted for 71V3556SA100BGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3556SA100BGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V3556SA100BGI?
71V3556SA100BGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3556SA100BGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3556SA100BGI?
For technical support, including 71V3556SA100BGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3556SA100BGI requirements.
6.How does Aetrix verify that 71V3556SA100BGI is sourced from the original manufacturer or authorized distributors?
All 71V3556SA100BGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556SA100BGI meets industry standards.
7.What is the process for return or replacement of 71V3556SA100BGI?
All 71V3556SA100BGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556SA100BGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3556SA100BGI part is unused and in its original packaging.
Return procedure for 71V3556SA100BGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3556SA100BGI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

