Renesas 71V3556SA100BQG
- Part No.:
- 71V3556SA100BQG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V3556SA100BQG.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3556SA100BQG from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit organization (4.5 Mbit), 100 MHz clock speed, 3.5 ns clock-to-data access, zero bus turnaround architecture, and JEDEC-standard 100-pin TQFP package. It serves as a high-bandwidth, low-latency memory buffer in network packet processors and telecom line cards requiring burst pipelined reads/writes without dead cycles.
For engineers reviewing the 71V3556SA100BQG datasheet, 71V3556SA100BQG pinout, 71V3556SA100BQG application, or 71V3556SA100BQG equivalent, key selection criteria include ZBT™ burst timing compliance, 3.3V I/O voltage tolerance, industrial temperature support (–40°C to +85°C), JTAG IEEE 1149.1 test interface availability, and 4-word linear/interleaved burst mode configuration via LBO pin.
Technical Context
The 71V3556SA100BQG implements a fully pipelined synchronous architecture with positive-edge-triggered address, data, and control registers. Its ZBT™ feature eliminates bus turnaround latency by enabling immediate read-after-write or write-after-read transitions without wait states.
It integrates an on-chip 4-word burst counter, selectable linear or interleaved sequence via static LBO input, and three chip enables (CE1, CE2, CE2) for depth expansion. The device supports individual byte write control (BW1–BW4), asynchronous OE, and optional boundary-scan JTAG (TMS/TDI/TCK/TDO/TRST) compliant with IEEE 1149.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports high-density buffering in 32-bit+ data path systems |
| Clock Frequency | 100 MHz; enables 10 ns cycle time for sustained burst throughput in real-time packet processing |
| Access Time | 3.5 ns clock-to-data; guarantees deterministic output timing for synchronous system-level timing closure |
| Supply Voltage | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; compatible with standard 3.3V logic families and mixed-voltage SoC interfaces |
| Burst Mode | 4-word linear or interleaved burst; reduces address bus overhead and improves bandwidth efficiency in sequential access patterns |
| Operating Temperature | –40°C to +85°C industrial grade; validated for deployment in base station and carrier-grade equipment |
| JTAG Support | IEEE 1149.1 compliant (TMS/TDI/TCK/TDO/TRST); enables in-system testability and debug without external probes |
Pinout & Package
71V3556SA100BQG is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm. Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14, 16, and 66 require ≥VIH but need not be tied directly to VDD.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock Input | Positive-edge-triggered master timing reference; all synchronous inputs sampled on rising edge |
| A0–A17 | Address Inputs | 18-bit address bus supporting full 128K × 36 addressing; registered on CLK rising edge with ADV/LD and CEN |
| R/W | Read/Write Control | Synchronous signal defining cycle type; data transfer occurs two clocks later |
| ADV/LD | Burst Address Advance / Load | High = increment internal burst counter; Low = load new external address; determines burst vs. single-cycle operation |
| LBO | Burst Order Select | Static input: Low = linear burst (0,1,2,3), High = interleaved burst (0,2,1,3); must remain stable during operation |
| BW1–BW4 | Byte Write Enables | Active-low per-byte controls for 36-bit word; BW1 covers I/O[0:7]+I/OP1, BW4 covers I/O[24:31]+I/OP4 |
| CE1, CE2, CE2 | Chip Enables | Three independent enables: CE1/CE2 active-low, CE2 active-high; any false enable deselects device in two cycles |
| OE | Output Enable | Asynchronous; drives I/O pins to high-Z when high; may be tied low for simplified read-only use |
| ZZ | Sleep Mode | Active-high synchronous input; gates internal clock and reduces power while retaining data |
| TMS/TDI/TCK/TDO/TRST | JTAG Test Interface | IEEE 1149.1 boundary scan signals; TRST is optional asynchronous reset; available in BGA variants and SA versions |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between read/write transitions, enabling continuous 100% bus utilization in burst streaming applications |
| Pipelined Output Buffer | Internally synchronized OE eliminates need for external OE timing control; simplifies PCB layout and timing margining |
| 4-Word Burst Counter | Reduces address bus activity by 75% for sequential accesses; supports both linear and interleaved sequences via LBO pin |
| Individual Byte Write | Enables precise 9-bit subword updates without masking logic; BW1–BW4 allow partial writes to any byte group |
| Three Chip Enables | Supports seamless depth expansion across multiple devices without external decoding logic or glue logic |
Applications
| Packet Buffer in Network Switch ASIC | Line Card Memory in Telecom Equipment |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payload fragments in multi-gigabit Ethernet switch fabric. IC Role / Device Role / Timing Role: High-speed dual-port buffer providing zero-turnaround burst reads/writes synchronized to switch fabric clock. Use Value: 3.5 ns access and 100 MHz clock sustain >3.2 Gbps sustained throughput per device, reducing packet loss under burst traffic. | Use Scenario: Frame buffering and header processing in OC-192/STM-64 SONET/SDH line cards. IC Role / Device Role / Timing Role: Synchronous SRAM acting as pipeline stage between framer and DSP, operating at line-rate timing. Use Value: Industrial temperature rating (–40°C to +85°C) and JTAG test support ensure reliability and field-debug capability in carrier-class chassis. |
| Real-Time Signal Processing Buffer | Industrial PLC Data Exchange Memory |
Use Scenario: Temporary storage of sensor samples and control coefficients in FPGA-based motor control loop. IC Role / Device Role / Timing Role: Deterministic-latency memory interfaced to FPGA fabric via dedicated 36-bit bus with pipelined handshake. Use Value: Clock-enable (CEN) and sleep mode (ZZ) enable dynamic power gating during idle intervals without losing context. | Use Scenario: Shared memory between dual-core safety controller and I/O module in SIL2-certified programmable logic controller. IC Role / Device Role / Timing Role: Dual-access buffer supporting simultaneous read/write from CPU and peripheral DMA engines. Use Value: Three chip enables and byte-write granularity allow safe concurrent access with hardware-enforced data integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV18-100BZI | 256K × 18-bit organization, 100 MHz, same 100-pin TQFP, no JTAG, no ZZ sleep mode | Higher density but narrower data bus; requires external byte merging logic for 36-bit interface compatibility | Select when 18-bit data path suffices and JTAG/testability is non-critical |
| AS7C33128P-10TIN | 128K × 32-bit, 10 ns access, 3.3V, no burst counter, no ZBT™, no JTAG, commercial temp only (0°C to +70°C) | Lacks zero-turnaround and pipelined burst; suitable only for non-real-time buffering where latency variability is acceptable | Select only for cost-sensitive, non-industrial applications with relaxed timing and test requirements |
Compared with CY7C1356BV18-100BZI and AS7C33128P-10TIN, the 71V3556SA100BQG uniquely delivers ZBT™-enabled deterministic burst timing, industrial temperature support, and integrated JTAG-making it the sole option for carrier-grade, real-time, and test-critical deployments.
Availability
71V3556SA100BQG is available at Aetrix Electronics and suitable for network infrastructure, telecom line cards, and industrial control systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for 71V3556SA100BQG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing markets.
The 71V3556SA100BQG belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency, high-throughput memory buffering in packet-switched networks and real-time signal processing systems.
FAQ
What is the memory organization and total capacity of the 71V3556SA100BQG?
The 71V3556SA100BQG is configured as 128K × 36-bit, delivering 4,718,592 bits (4.5 Mbit) of synchronous SRAM. This organization supports 36-bit data paths common in network processors and DSPs, and is distinct from the 256K × 18-bit variant offered in the same family. The device uses a high-performance CMOS process and is optimized for burst-mode operation.
Does the 71V3556SA100BQG support JTAG boundary scan, and which pins are used?
Yes, the 71V3556SA100BQG supports IEEE 1149.1-compliant JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and optional TRST are assigned for this function. These pins are NC in non-SA versions but enabled in the "SA" suffix variant like the 71V3556SA100BQG. TRST is optional and internally pulled up; if unused, it may be left floating.
How does the ZBT™ feature improve system performance in the 71V3556SA100BQG?
The ZBT™ (Zero Bus Turnaround) feature in the 71V3556SA100BQG eliminates dead cycles between consecutive read and write operations. Unlike conventional SRAMs that require bus turnaround time, the 71V3556SA100BQG allows immediate back-to-back access-e.g., a write followed instantly by a read-enabling 100% bus utilization and predictable latency critical for packet buffering and real-time control loops.
What is the role of the ADV/LD and LBO pins in burst operation of the 71V3556SA100BQG?
In the 71V3556SA100BQG, ADV/LD controls burst initiation: sampled low to load a new external address, sampled high to advance the internal 4-word burst counter. LBO selects burst order-low for linear (0,1,2,3), high for interleaved (0,2,1,3). Both signals are synchronous and must remain stable during burst execution to prevent address misalignment or data corruption.
Can the 71V3556SA100BQG operate in low-power mode, and how is it controlled?
Yes, the 71V3556SA100BQG supports low-power sleep mode via the synchronous ZZ pin. When ZZ is driven high, the internal clock is gated and core logic is powered down while retaining memory contents. Power consumption drops significantly, and the device resumes normal operation on the next valid CLK edge after ZZ returns low-no initialization or retraining is required.
71V3556SA100BQG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V3556SA100BQG FAQ
1.How can I place an order for 71V3556SA100BQG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3556SA100BQG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3556SA100BQG reliable?
The price and inventory of 71V3556SA100BQG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556SA100BQG is usually 5 days.
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Once your 71V3556SA100BQG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3556SA100BQG?
For technical support, including 71V3556SA100BQG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3556SA100BQG requirements.
6.How does Aetrix verify that 71V3556SA100BQG is sourced from the original manufacturer or authorized distributors?
All 71V3556SA100BQG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556SA100BQG meets industry standards.
7.What is the process for return or replacement of 71V3556SA100BQG?
All 71V3556SA100BQG units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556SA100BQG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3556SA100BQG part is unused and in its original packaging.
Return procedure for 71V3556SA100BQG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3556SA100BQG Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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