Renesas 71V3556SA100BQGI
- Part No.:
- 71V3556SA100BQGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V3556SA100BQGI.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,923
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
71V3556SA100BQGI from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit organization (4.5 Mbit), 100 MHz clock speed, 3.5 ns clock-to-data access time, zero bus turnaround architecture, and JEDEC-standard 100-pin TQFP packaging. It serves as a high-bandwidth, low-latency memory buffer in network packet processors and telecom line cards requiring burst pipelined reads/writes.
For engineers reviewing the 71V3556SA100BQGI datasheet, 71V3556SA100BQGI pinout, 71V3556SA100BQGI application, or 71V3556SA100BQGI equivalent, key selection criteria include ZBT™ dead-cycle elimination, 4-word interleaved/linear burst capability, individual byte write control (BW1–BW4), JTAG boundary scan support, and industrial temperature operation (–40°C to +85°C).
Technical Context
The 71V3556SA100BQGI implements a fully synchronous, pipelined architecture where address/control registration occurs on the rising CLK edge, with data output valid two cycles later. Its ZBT™ feature eliminates bus turnaround latency by enabling immediate read-after-write or write-after-read transitions without idle cycles.
It integrates a synchronous burst counter controlled by ADV/LD and LBO pins, supports linear or interleaved 4-word bursts, and includes three chip enables (CE1, CE2, CE2) for depth expansion. The optional IEEE 1149.1 JTAG interface (TMS/TDI/TCK/TDO/TRST) is implemented in SA variants and available in BGA packages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports high-density data buffering in 36-bit wide bus systems. |
| Clock Frequency | 100 MHz; enables 10 ns clock period for tightly timed memory access in high-speed controllers. |
| Access Time | 3.5 ns clock-to-data; guarantees deterministic read latency critical for real-time packet processing. |
| Supply Voltage | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; compatible with standard 3.3V logic I/O domains and mixed-voltage system design. |
| Burst Mode | 4-word linear or interleaved burst; reduces address overhead and improves throughput in sequential access patterns. |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade deployment in base stations and embedded networking equipment. |
| JTAG Support | IEEE 1149.1 compliant (TMS/TDI/TCK/TDO/TRST); enables in-system test and debug without external test fixtures. |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | Synchronous 17-bit address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled. |
| CLK | System Clock Input | Rising-edge-triggered master timing reference; all synchronous registers (address, control, data I/O) align to this edge. |
| R/W | Read/Write Control | Synchronous signal defining cycle type; determines whether next data transfer is read (H) or write (L). |
| ADV/LD | Burst Counter Control | Loads new external address (LOW) or increments internal burst counter (HIGH); governs burst sequence progression. |
| LBO | Burst Order Select | Static input selecting linear (LOW) or interleaved (HIGH) 4-word burst addressing pattern. |
| BW1–BW4 | Byte Write Enables | Four independent active-low enables for 9-bit bytes; allows partial-word writes without masking logic. |
| CE1, CE2, CE2 | Chip Enables | Three synchronous enables (CE1/CE2 active LOW, CE2 active HIGH); enable depth expansion with no external glue logic. |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous data path; registered inputs/outputs eliminate hold-time violations in high-speed layouts. |
| OE | Output Enable | Asynchronous control; tri-states outputs immediately when HIGH-no timing coordination with CLK required. |
| ZZ | Sleep Mode | Active-HIGH synchronous entry into low-power retention mode; preserves data while reducing dynamic power. |
| TMS, TDI, TCK, TDO, TRST | JTAG Test Interface | Boundary-scan signals per IEEE 1149.1; TRST is optional asynchronous reset (available only in BGA variants). |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Architecture | Eliminates dead bus cycles between read/write transitions-enables back-to-back memory operations at full clock rate. |
| Internally Synchronized OE | Removes need for external OE timing control; outputs remain stable across clock edges during asynchronous OE assertion. |
| 4-Word Burst Capability | Reduces address setup overhead by 75% for sequential accesses-critical for cache-line fills and DMA transfers. |
| Individual Byte Write Control | Enables precise 9-bit sub-word writes (BW1–BW4), avoiding full-word read-modify-write sequences in protocol stack buffers. |
| Three Chip Enables | Supports seamless depth expansion up to 16 devices without address decoding logic or additional control lines. |
| Industrial Temperature Range | Validated operation from –40°C to +85°C ensures reliability in uncontrolled environments like outdoor telecom cabinets. |
Applications
| Packet Buffering in Switch ASICs | Line Card Memory in Telecom Routers |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payload fragments in multi-gigabit Ethernet switch fabric ASICs. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level packet buffer with zero-turnaround burst reads for header inspection and forwarding decisions. Use Value: 3.5 ns clock-to-data access and ZBT™ enable sub-10 ns effective read latency, supporting 10 Gbps+ line rates without pipeline stalls. | Use Scenario: Serving as shared memory for control-plane processors and data-path engines on carrier-grade router line cards. IC Role / Device Role / Timing Role: Synchronous burst SRAM providing deterministic access to routing tables, QoS counters, and statistics buffers across multiple processor cores. Use Value: 4-word interleaved burst mode delivers 144-bit data per cycle, matching 36-bit bus widths of NPU interconnects and minimizing bus arbitration overhead. |
| Protocol Stack Buffering in Baseband Processors | Real-Time Data Logging in Industrial Gateways |
Use Scenario: Holding TCP/IP, LTE, or 5G NR protocol state variables and fragmented message segments in wireless baseband SoCs. IC Role / Device Role / Timing Role: Pipelined SRAM with individual byte write (BW1–BW4) supporting concurrent updates to different protocol layers without bus contention. Use Value: Independent 9-bit byte enables allow simultaneous MAC-layer timestamp update and IP-layer checksum recalculation-reducing software overhead by 40% vs. full-word writes. | Use Scenario: Capturing sensor fusion data streams (CAN, RS-485, analog ADC) in ruggedized industrial IoT gateways operating in harsh environments. IC Role / Device Role / Timing Role: Industrial-temperature SRAM with sleep mode (ZZ) and JTAG debug support serving as nonvolatile-cached logging buffer. Use Value: –40°C to +85°C rating and ZZ pin enable reliable long-term data capture during thermal cycling, while JTAG simplifies field firmware validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-100BGXI | 128K × 32-bit, 100 MHz, 3.3V, no ZBT™, no JTAG, 119-ball BGA only | Lacks zero bus turnaround and burst counter; requires external OE timing control and address sequencing logic | Select when ZBT™ is unnecessary and BGA footprint is preferred over TQFP; verify burst handling in controller firmware. |
| AS7C33128PFSIG | 128K × 32-bit, 100 MHz, 3.3V, asynchronous OE, no JTAG, 100-pin TQFP | No ZBT™, no burst counter, no byte write enables-requires full-word writes and external burst management | Choose for cost-sensitive designs where pipelined burst performance is not required and legacy controller interfaces exist. |
Compared with CY7C1362BV33-100BGXI and AS7C33128PFSIG, the 71V3556SA100BQGI uniquely delivers ZBT™ dead-cycle elimination, integrated 4-word burst counter, and JTAG testability in a 100-pin TQFP-making it optimal for new high-performance networking and telecom designs demanding deterministic latency and debug flexibility.
Availability
71V3556SA100BQGI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial networking, and embedded computing applications requiring stable component supply, long-lifecycle support, and industrial-temperature qualification.
Supply support for 71V3556SA100BQGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.
The 71V3556SA100BQGI belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency memory subsystems in packet-switched networks, baseband processors, and high-end FPGA-based accelerators.
FAQ
What is the memory organization and total capacity of the 71V3556SA100BQGI?
The 71V3556SA100BQGI is organized as 128K × 36 bits, delivering a total capacity of 4,718,592 bits (4.5 Mbit). This configuration supports 36-bit wide data buses common in network processors and DSPs, and is distinct from the 256K × 18 variant offered in the same family. The 71V3556SA100BQGI uses all 17 address lines (A0–A16) to access the full 128K depth.
Does the 71V3556SA100BQGI support JTAG boundary scan, and which pins implement it?
Yes, the 71V3556SA100BQGI supports IEEE 1149.1-compliant JTAG boundary scan as an optional feature. In the 100-pin TQFP package, JTAG signals are assigned to pins NC/TMS, NC/TDI, NC/TCK, NC/TDO, and NC/TRST (pins R5, R6, R7, R8, and R9 per BGA pinout mapping-confirmed via IDT documentation for SA variants). TRST is optional and internally pulled up; if unused, it may be left floating.
How does the ZBT™ feature in the 71V3556SA100BQGI eliminate dead cycles between read and write operations?
The ZBT™ (Zero Bus Turnaround) feature in the 71V3556SA100BQGI removes idle cycles by allowing immediate transition from a write to a read (or vice versa) without bus direction settling time. This is achieved through internal synchronization of OE and directional control, enabling back-to-back operations at full clock rate. The 71V3556SA100BQGI achieves this without external OE timing management-unlike conventional SRAMs that require explicit bus turnaround delays.
What are the burst addressing modes supported by the 71V3556SA100BQGI, and how is selection controlled?
The 71V3556SA100BQGI supports both linear and interleaved 4-word burst sequences, selected via the LBO (Linear Burst Order) pin: LBO = LOW selects linear mode (A0, A1, A2, A3), while LBO = HIGH selects interleaved mode (A0, A2, A1, A3). Burst progression is managed entirely by the internal counter advanced on each rising CLK edge when ADV/LD = HIGH, eliminating external address generation logic.
Can the 71V3556SA100BQGI operate in low-power mode, and how is it activated?
Yes, the 71V3556SA100BQGI supports a synchronous sleep mode activated by driving the ZZ pin HIGH. When asserted, ZZ gates the internal clock and reduces power consumption to its minimum while guaranteeing data retention. This mode is fully compatible with the industrial temperature range (–40°C to +85°C) and requires no additional voltage rails or sequencing-making the 71V3556SA100BQGI suitable for energy-conscious telecom and gateway applications.
71V3556SA100BQGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V3556SA100BQGI FAQ
1.How can I place an order for 71V3556SA100BQGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3556SA100BQGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3556SA100BQGI reliable?
The price and inventory of 71V3556SA100BQGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556SA100BQGI is usually 5 days.
3.What payment methods are accepted for 71V3556SA100BQGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3556SA100BQGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V3556SA100BQGI?
71V3556SA100BQGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3556SA100BQGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3556SA100BQGI?
For technical support, including 71V3556SA100BQGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3556SA100BQGI requirements.
6.How does Aetrix verify that 71V3556SA100BQGI is sourced from the original manufacturer or authorized distributors?
All 71V3556SA100BQGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556SA100BQGI meets industry standards.
7.What is the process for return or replacement of 71V3556SA100BQGI?
All 71V3556SA100BQGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556SA100BQGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3556SA100BQGI part is unused and in its original packaging.
Return procedure for 71V3556SA100BQGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3556SA100BQGI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

