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Renesas 71V3556SA100BQGI8

Part No.:
71V3556SA100BQGI8
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V3556SA100BQGI8.pdf
Description:
IC SRAM 4.5MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,546

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Product details

Overview

71V3556SA100BQGI8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit organization (4.5 Mbit), 100 MHz clock speed, 3.5 ns clock-to-data access time, zero bus turnaround architecture, and pipelined outputs in a 100-pin TQFP package. It serves as high-speed buffer memory in network packet processors and telecom line cards requiring deterministic read/write interleaving without dead cycles.

For engineers reviewing the 71V3556SA100BQGI8 datasheet, 71V3556SA100BQGI8 pinout, 71V3556SA100BQGI8 application, or 71V3556SA100BQGI8 equivalent, key selection criteria include burst mode support (linear/interleaved), individual byte write control (BW1–BW4), JTAG boundary scan compliance (IEEE 1149.1), and industrial temperature operation (–40°C to +85°C).

Technical Context

The 71V3556SA100BQGI8 implements a fully synchronous, positive-edge-triggered architecture with registered address, data, and control inputs. Its ZBT™ core eliminates bus turnaround latency by enabling immediate read-after-write or write-after-read transitions using an internal burst counter and ADV/LD-controlled address sequencing.

It integrates pipelined input/output registers, asynchronous OE for output tri-state control, and optional IEEE 1149.1 JTAG test interface with TMS/TDI/TCK/TDO/TRST pins. The device supports 4-word burst transfers and individual byte write enables-critical for cache coherency and partial-word updates in high-throughput data paths.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128K × 36-bit (4.5 Mbit); supports high-bandwidth parallel data paths in telecom and networking ASIC interfaces.
Clock Frequency100 MHz; enables 10 ns clock period timing for tightly synchronized system buses.
Access Time3.5 ns clock-to-data; guarantees deterministic output valid window for downstream latch capture.
Supply VoltageVDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; dual-rail I/O/core separation reduces noise coupling in mixed-signal systems.
Operating Temperature–40°C to +85°C; qualified for industrial-grade deployment in base station and router hardware.
Burst Capability4-word linear or interleaved burst; reduces address bus traffic and improves throughput in sequential access patterns.
JTAG SupportIEEE 1149.1 compliant with TMS/TDI/TCK/TDO/TRST; enables in-system test and debug without external probes.

Pinout & Package

Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14/16/66 tolerate VIH-level voltage without direct VDD connection.

Pin/TerminalCircuit RoleDesign Meaning
A0–A16Address InputsSynchronous 17-bit address bus; latched on rising CLK edge when ADV/LD low and chip enabled.
CLKSystem Clock InputPrimary timing reference; all synchronous operations aligned to rising edge; OE remains asynchronous.
R/WRead/Write ControlSynchronous signal defining cycle type; determines data direction two clocks after load.
ADV/LDBurst Counter ControlLoads new external address (LOW) or increments internal burst counter (HIGH); governs burst sequence flow.
BW1–BW4Byte Write EnablesActive-low per-byte controls for 9-bit segments; enables partial-word writes without masking logic.
CE1, CE2, CE2Chip Enable InputsThree-input enable scheme (CE1=L, CE2=L, CE2=H) allows flexible depth expansion and hierarchical memory mapping.
LBOBurst Order SelectStatic input selecting linear (LBO=L) or interleaved (LBO=H) burst addressing per JEDEC standard.
TMS/TDI/TCK/TDO/TRSTJTAG Test InterfaceBoundary scan pins supporting IEEE 1149.1; TRST is optional asynchronous reset (internal pullup).
ZZSleep Mode InputActive-high synchronous entry into low-power retention mode; data preserved, CLK gated internally.
I/O0–I/O31, I/OP1–I/OP4Data I/O Bus36-bit bidirectional synchronous data path; registered inputs/outputs eliminate hold-time violations.

Key Features

FeatureDesign Value
ZBT™ Zero Bus TurnaroundEliminates dead cycles between read/write transitions-enables back-to-back memory accesses at full clock rate.
4-Word Burst with LBO ControlReduces address bus activity by 75% during sequential reads/writes; selectable linear or interleaved order matches CPU cache line formats.
Individual Byte Write (BW1–BW4)Permits granular 9-bit updates without full-word overwrite-critical for protocol header manipulation and error correction.
Internally Synchronized OERemoves need for external OE timing control; outputs tri-state asynchronously while all other signals remain synchronous.
Three Chip Enables (CE1/CE2/CE2)Supports seamless memory depth expansion across multiple devices without external decode logic.
Industrial Temperature RangeValidated operation from –40°C to +85°C ensures reliability in uncontrolled environments like outdoor telecom cabinets.

Applications

Packet Buffering in Network SwitchesCache Memory in Baseband Processors

Use Scenario: Storing ingress/egress Ethernet frames in multi-gigabit switch fabric with strict latency budgets.

IC Role / Device Role / Timing Role: High-speed dual-port buffer providing zero-turnaround read/write for cut-through forwarding engines.

Use Value: 3.5 ns access time and pipelined outputs ensure frame metadata and payload are available within one clock cycle of request.

Use Scenario: Acting as L1 instruction/data cache for DSP cores in 4G/5G baseband ICs handling real-time FFT and channel estimation.

IC Role / Device Role / Timing Role: Synchronous SRAM delivering burst-aligned instructions to superscalar pipelines with no wait states.

Use Value: 4-word interleaved burst mode matches 128-bit wide instruction fetch width, doubling effective bandwidth over single-word access.

Line Card Memory in Telecom RoutersReal-Time Protocol Stack Buffering

Use Scenario: Buffering SONET/SDH overhead bytes and payload in OC-192 line cards requiring deterministic jitter-free access.

IC Role / Device Role / Timing Role: Deterministic latency SRAM interfacing directly to SerDes PHYs and framer ASICs.

Use Value: Clock-enable (CEN) and sleep mode (ZZ) allow dynamic power gating during idle periods without losing context.

Use Scenario: Holding TCP/IP stack state variables and reassembly buffers in embedded network processors running RTOS.

IC Role / Device Role / Timing Role: Low-latency shared memory accessed concurrently by multiple DMA channels and CPU cores.

Use Value: Individual byte write enables (BW1–BW4) permit atomic updates to TCP sequence numbers and flags without corrupting adjacent fields.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1356KV18-100BZXI256K × 18-bit organization, same 100 MHz speed, but no JTAG; uses different burst control (BWS vs ADV/LD).Optimized for x18 data paths; requires PCB redesign for x36 interface; lacks boundary scan for production test.Select when x18 bus width suffices and JTAG is unnecessary; verify ADV/LD replacement logic compatibility.
AS7C33128PFSIG-100128K × 36-bit, 100 MHz, but asynchronous OE and no ZBT™-introduces 1-cycle turnaround penalty.Suitable for non-real-time buffering where deterministic zero-turnaround is not required.Choose only if system timing budget accommodates added latency; not drop-in compatible due to missing ZBT™ behavior.

Compared with CY7C1356KV18-100BZXI and AS7C33128PFSIG-100, the 71V3556SA100BQGI8 uniquely delivers zero bus turnaround, JTAG testability, and full x36 burst support-making it irreplaceable in latency-critical telecom and packet-processing designs.

Availability

71V3556SA100BQGI8 is available at Aetrix Electronics and suitable for network packet processors, telecom line cards, and baseband processors requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.

Supply support for 71V3556SA100BQGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.

The 71V3556SA100BQGI8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency memory subsystems in high-speed networking, wireless infrastructure, and real-time signal processing applications.

FAQ

What is the memory configuration and total capacity of the 71V3556SA100BQGI8?

The 71V3556SA100BQGI8 is configured as 128K × 36 bits, delivering a total capacity of 4,718,592 bits (4.5 Mbit). This organization supports 36-bit parallel data paths commonly used in network processors and DSP interfaces, and is distinct from the 256K × 18 variant offered in the same family.

Does the 71V3556SA100BQGI8 support JTAG boundary scan, and which pins are used?

Yes, the 71V3556SA100BQGI8 supports IEEE 1149.1-compliant JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and optional TRST are dedicated to this function and appear on the 100-pin TQFP package. TRST has an internal pullup and may be left floating if unused.

How does the ZBT™ feature eliminate bus turnaround cycles in the 71V3556SA100BQGI8?

The ZBT™ feature in the 71V3556SA100BQGI8 removes dead cycles between read and write operations by using an internal burst counter and synchronized control logic. When ADV/LD advances the counter, the next access occurs immediately-no clock cycle is wasted waiting for bus direction settling, enabling true back-to-back transactions.

What is the role of the ADV/LD and LBO pins in burst operation of the 71V3556SA100BQGI8?

In the 71V3556SA100BQGI8, ADV/LD loads a new external address when LOW or increments the internal burst counter when HIGH. LBO selects burst order: LOW enables linear addressing (0,1,2,3), HIGH enables interleaved (0,2,3,1)-matching common CPU cache line layouts and optimizing sequential throughput.

Can the 71V3556SA100BQGI8 operate in low-power mode, and how is it controlled?

Yes, the 71V3556SA100BQGI8 supports low-power sleep mode via the synchronous ZZ pin. When ZZ is driven HIGH, the internal clock is gated and core power drops to minimum while retaining memory contents. This mode is fully compatible with industrial temperature operation and requires no external circuitry.

71V3556SA100BQGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V3556SA100BQGI8 FAQ

1.How can I place an order for 71V3556SA100BQGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3556SA100BQGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3556SA100BQGI8 reliable?

The price and inventory of 71V3556SA100BQGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556SA100BQGI8 is usually 5 days.

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4.How is shipping managed for 71V3556SA100BQGI8?

71V3556SA100BQGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3556SA100BQGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3556SA100BQGI8?

For technical support, including 71V3556SA100BQGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3556SA100BQGI8 requirements.

6.How does Aetrix verify that 71V3556SA100BQGI8 is sourced from the original manufacturer or authorized distributors?

All 71V3556SA100BQGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556SA100BQGI8 meets industry standards.

7.What is the process for return or replacement of 71V3556SA100BQGI8?

All 71V3556SA100BQGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556SA100BQGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3556SA100BQGI8 part is unused and in its original packaging.

Return procedure for 71V3556SA100BQGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

71V3556SA100BQGI8 Tags

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