Renesas 71V3556SA133BQ8
- Part No.:
- 71V3556SA133BQ8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V3556SA133BQ8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3556SA133BQ8 from IDT (now Renesas) is a 3.3V, 128K × 36-bit synchronous ZBT™ SRAM with zero bus turnaround, 133 MHz operation (7.5 ns clock-to-data), pipelined outputs, and JTAG boundary scan (IEEE 1149.1). It supports interleaved/linear 4-word burst, individual byte write (BW1–BW4), and industrial temperature range (–40°C to +85°C). Used in high-speed network packet buffers and telecom line cards where deterministic latency and bus efficiency are critical.
For engineers reviewing the 71V3556SA133BQ8 datasheet, 71V3556SA133BQ8 pinout, 71V3556SA133BQ8 application, or 71V3556SA133BQ8 equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 3.3V I/O tolerance, burst counter control via ADV/LD and LBO, and JTAG testability for production validation.
Technical Context
The 71V3556SA133BQ8 implements a fully synchronous, positive-edge-triggered architecture with registered address, data, and control inputs. Its ZBT™ feature eliminates dead cycles between read/write transitions by overlapping bus direction changes with valid data transfers - enabled by internal synchronization of OE and burst counter logic.
It integrates a 4-word burst counter with selectable linear/interleaved order (LBO pin), three chip enables (CE1, CE2, CE2) for depth expansion, and optional IEEE 1149.1 JTAG boundary scan (TMS/TDI/TCK/TDO/TRST) for in-system test. Sleep mode (ZZ) reduces power while retaining data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 36-bit wide data path with full word access or per-byte writes. |
| Max Clock Frequency | 133 MHz; enables 7.5 ns clock-to-data access time for predictable pipeline timing in high-throughput systems. |
| Supply Voltage | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; separate core/I/O rails allow clean signal integrity and noise isolation. |
| Burst Capability | 4-word burst (linear or interleaved); reduces address overhead and improves bandwidth in sequential memory accesses. |
| Operating Temperature | –40°C to +85°C industrial grade; qualified for base station, router, and industrial control environments. |
| JTAG Support | IEEE 1149.1 compliant (TMS/TDI/TCK/TDO/TRST); enables boundary scan testing without external test fixtures. |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); compatible with automated SMT assembly and thermal management. |
Pinout & Package
71V3556SA133BQ8 is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14/16/66 tolerate VIH-level input without direct VDD connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous 18-bit address bus; A0–A16 used for 128K×36 configuration; A17 reserved as NC. |
| CLK | System Clock Input | Positive-edge-triggered master clock; all synchronous registers (address, control, data) sample on rising edge. |
| R/W | Read/Write Control | Synchronous signal defining cycle type; sampled with ADV/LD low to initiate load read/write. |
| ADV/LD | Burst Counter Control | Low = load new external address; High = increment internal burst counter; determines burst sequence timing. |
| LBO | Burst Order Select | Static input: Low = linear burst (0,1,2,3), High = interleaved burst (0,2,1,3); must remain stable during operation. |
| BW1–BW4 | Byte Write Enables | Active-low per-byte controls for I/O[0:7]/I/OP1 through I/O[24:31]/I/OP4; enables partial-word writes without masking logic. |
| CE1, CE2, CE2 | Chip Enable Inputs | Three enables for depth expansion: CE1/CE2 active-low, CE2 active-high; any false enable initiates 2-cycle deselect. |
| OE | Output Enable | Asynchronous, active-low; tri-states outputs immediately - no timing dependency on CLK or CEN. |
| CEN | Clock Enable | Synchronous suspend: high blocks CLK propagation; registers retain state, outputs hold last valid value. |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous bus; registered input/output paths ensure setup/hold compliance at 133 MHz. |
| TMS, TDI, TCK, TDO, TRST | JTAG Test Interface | IEEE 1149.1 boundary scan signals; TRST optional asynchronous reset; all have internal pull-ups except TRST (pull-up). |
| ZZ | Sleep Mode Input | Active-high synchronous sleep; gates internal CLK and minimizes power while guaranteeing data retention. |
| VDD, VDDQ, VSS | Power/Ground | VDD = 3.3V core supply; VDDQ = 3.3V I/O supply; VSS = common ground; decoupling required per JEDEC layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between read/write transitions - enabling back-to-back memory operations without bus idle time. |
| Pipelined Output Buffer | Internally synchronized OE removes need for external OE timing control; outputs align deterministically with CLK edge. |
| 4-Word Burst Counter | Reduces address bus activity by 75% for sequential accesses; LBO pin selects linear or interleaved order per system requirement. |
| Individual Byte Write (BW1–BW4) | Enables precise 9-bit sub-word writes without external byte-lane gating; simplifies memory controller logic and saves PCB space. |
| Three Chip Enables (CE1/CE2/CE2) | Supports seamless depth expansion across multiple devices; dual-polarity CE2 allows flexible logic-level interfacing. |
| JTAG Boundary Scan (IEEE 1149.1) | Provides full pin-level interconnect test coverage; eliminates need for bed-of-nails fixtures in high-volume manufacturing. |
Applications
| Network Packet Buffer | Telecom Line Card |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer providing deterministic 7.5 ns read access and zero-turnaround write-read switching. Use Value: Enables wire-speed packet processing at 10 Gbps+ by eliminating bus contention delays between ingress/egress pipelines. |
Use Scenario: Frame buffering in SONET/SDH add-drop multiplexers requiring burst-mode data handling and JTAG testability. IC Role / Device Role / Timing Role: Synchronous SRAM acting as frame store with 4-word burst support for ATM cell or GFP frame alignment. Use Value: Reduces external address generation logic and supports IEEE 1149.1 scan for field-replaceable module validation. |
| Industrial PLC Controller | Radar Signal Processing |
|
Use Scenario: Real-time I/O mapping and program execution cache in programmable logic controllers operating in harsh environments. IC Role / Device Role / Timing Role: Industrial-grade memory providing guaranteed data retention in sleep mode (ZZ) and –40°C to +85°C operation. Use Value: Ensures deterministic scan cycle timing and supports fail-safe shutdown with data preservation during brownouts. |
Use Scenario: Intermediate storage for FFT and CFAR processing stages in phased-array radar systems with burst-intensive data flow. IC Role / Device Role / Timing Role: Pipelined SRAM delivering 133 MHz throughput and synchronized burst reads/writes aligned to DSP clock domains. Use Value: Matches ADC/DAC sampling rates up to 100 MSPS and enables real-time beamforming with minimal latency jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV18-133BZI | 256K × 18-bit organization; same 133 MHz speed, but narrower 18-bit bus and no JTAG interface. | Requires two devices for 36-bit width; lacks boundary scan - unsuitable for high-reliability test-critical designs. | Select when cost-per-bit is prioritized over testability and 36-bit native width. |
| AS7C33128PFSIG | 128K × 32-bit (no parity pins); 133 MHz, but no ZBT™ feature - introduces 1-cycle dead time between read/write. | Not suitable for zero-turnaround protocols like RapidIO or custom bus architectures requiring back-to-back transactions. | Choose only if ZBT™ timing is not required and I/O count reduction (32-bit vs 36-bit) is beneficial. |
Compared with CY7C1356BV18-133BZI and AS7C33128PFSIG, the 71V3556SA133BQ8 uniquely delivers native 36-bit width, ZBT™ timing, and integrated JTAG - making it optimal for telecom infrastructure and test-driven industrial designs where bus efficiency and production validation are non-negotiable.
Availability
71V3556SA133BQ8 is available at Aetrix Electronics and suitable for network packet buffers, telecom line cards, industrial PLC controllers, and radar signal processing systems requiring stable component supply, long-term lifecycle support, and industrial temperature qualification.
Supply support for 71V3556SA133BQ8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing markets.
The 71V3556SA133BQ8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for high-speed networking, telecom infrastructure, and real-time embedded systems demanding deterministic latency and bus efficiency.
FAQ
What is the memory organization and bus width of the 71V3556SA133BQ8?
The 71V3556SA133BQ8 is configured as 128K × 36-bit, providing a native 36-bit data bus with four 9-bit byte lanes (I/O0–I/O31 plus I/OP1–I/OP4). This organization supports full-word access or granular byte writes using BW1–BW4, and is optimized for systems requiring high throughput without external data-width conversion logic.
Does the 71V3556SA133BQ8 support burst mode, and how is burst order controlled?
Yes, the 71V3556SA133BQ8 supports 4-word burst mode with selectable linear or interleaved sequences. Burst order is controlled by the static LBO pin: tied low for linear (0,1,2,3), high for interleaved (0,2,1,3). The ADV/LD signal advances the internal counter synchronously on each rising CLK edge when sampled high.
What is the role of the ZZ pin on the 71V3556SA133BQ8, and does it retain data in sleep mode?
The ZZ pin is the synchronous sleep mode input on the 71V3556SA133BQ8. When driven high, it gates the internal clock and reduces power consumption to its minimum level while guaranteeing full data retention - critical for industrial and telecom applications requiring low-power standby without data loss.
How does the ZBT™ feature eliminate dead cycles in the 71V3556SA133BQ8?
The ZBT™ (Zero Bus Turnaround) feature in the 71V3556SA133BQ8 eliminates dead cycles by overlapping bus direction changes with valid data transfers. Unlike conventional SRAMs that require idle cycles between read/write transitions, the 71V3556SA133BQ8 uses internally synchronized output enable and burst counter logic to enable immediate back-to-back operations.
Is JTAG boundary scan supported on the 71V3556SA133BQ8, and which pins are used?
Yes, the 71V3556SA133BQ8 includes IEEE 1149.1-compliant JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and optional TRST are dedicated to this function. All JTAG pins have internal pull-ups (TRST pull-up), and the feature is active in the "SA" variant - confirmed by the "SA" suffix in the 71V3556SA133BQ8 part number.
71V3556SA133BQ8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V3556SA133BQ8 FAQ
1.How can I place an order for 71V3556SA133BQ8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3556SA133BQ8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3556SA133BQ8 reliable?
The price and inventory of 71V3556SA133BQ8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556SA133BQ8 is usually 5 days.
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6.How does Aetrix verify that 71V3556SA133BQ8 is sourced from the original manufacturer or authorized distributors?
All 71V3556SA133BQ8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556SA133BQ8 meets industry standards.
7.What is the process for return or replacement of 71V3556SA133BQ8?
All 71V3556SA133BQ8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556SA133BQ8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3556SA133BQ8 part is unused and in its original packaging.
Return procedure for 71V3556SA133BQ8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3556SA133BQ8 Tags

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