Renesas 71V3556SA150BG
- Part No.:
- 71V3556SA150BG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V3556SA150BG.pdf
- Description:
- IC SRAM 4.5MBIT PAR 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3556SA150BG from IDT (now Renesas) is a 3.3V, 128K × 36-bit synchronous ZBT SRAM with Zero Bus Turnaround architecture, 150 MHz clock speed (6.67 ns cycle time), pipelined outputs, and 4-word burst capability. It features synchronous address/control/data registers, individual byte write enables (BW1–BW4), and JTAG boundary scan (IEEE 1149.1). Used in high-speed networking line cards and packet buffer applications requiring zero-latency bus turnaround.
For engineers reviewing the 71V3556SA150BG datasheet, 71V3556SA150BG pinout, 71V3556SA150BG application, or 71V3556SA150BG equivalent, key selection criteria include ZBT timing compliance, 100-pin TQFP package compatibility, 3.3V I/O and core supply requirements, industrial temperature support (–40°C to +85°C), and JTAG test interface availability for system-level validation.
Technical Context
The 71V3556SA150BG implements a fully synchronous, clock-edge-triggered architecture where address, control, and data signals are registered on the rising edge of CLK. Its ZBT feature eliminates dead cycles between read and write operations by enabling immediate bus direction reversal without wait states.
It integrates an on-chip 4-word burst counter controlled by ADV/LD and LBO pins, supporting both linear and interleaved burst sequences. Output enable (OE) is asynchronous, while all other inputs-including CE1/CE2/CE2, R/W, CEN, BWx, and ADV/LD-are synchronous with internal pipelining that delivers data two clock cycles after address load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports depth expansion via three chip enables |
| Clock Frequency | 150 MHz (6.67 ns cycle time); defines maximum sustained throughput for burst and random access |
| Access Time | 3.5 ns clock-to-data (tCD) at 166 MHz; 71V3556SA150BG operates at 150 MHz with guaranteed timing margin |
| Supply Voltage | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate supplies enable noise isolation between logic and I/O domains |
| Burst Mode | 4-word burst (linear or interleaved); reduces address bus traffic and improves bandwidth efficiency in sequential accesses |
| Temperature Range | Industrial: –40°C to +85°C; qualified for embedded telecom and industrial control environments |
| JTAG Support | IEEE 1149.1-compliant boundary scan; enables board-level testability and interconnect verification |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14, 16, and 66 tolerate VIH-level input without direct VDD connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit synchronous address bus; latched on rising CLK edge when ADV/LD low and chip enabled |
| CLK | Clock Input | Rising-edge-triggered master clock; all synchronous timing referenced to this signal |
| R/W | Read/Write Control | Synchronous signal defining operation type for current load cycle; determines data flow direction two cycles later |
| ADV/LD | Advance Burst / Load Address | Controls burst counter increment (HIGH) or external address load (LOW); critical for burst sequencing |
| LBO | Linear/Interleaved Burst Order | Static input selecting burst pattern; LOW = linear, HIGH = interleaved; must remain stable during operation |
| BW1–BW4 | Byte Write Enables | Four independent active-low enables for 9-bit bytes; allow partial-word writes without masking logic |
| CE1, CE2, CE2 | Chip Enables | Three-signal enable scheme (CE1=LOW, CE2=LOW, CE2=HIGH for select); enables depth expansion and power gating |
| OE | Output Enable | Asynchronous control; tri-states I/Os immediately when HIGH-no clock dependency required |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous data bus; input and output paths both registered to CLK |
| TMS, TDI, TCK, TDO, TRST | JTAG Interface | IEEE 1149.1 test access port; TRST optional asynchronous reset; all signals synchronous except TRST |
| ZZ | Sleep Mode | Synchronous HIGH input that gates internal clock and reduces power; retains memory contents |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates bus turnaround dead cycles between reads and writes-enables back-to-back transactions with no latency penalty |
| Pipelined Outputs | Internally synchronized output buffer enable removes need for external OE timing control; simplifies system timing closure |
| 4-Word Burst Counter | Reduces address bus activity by 75% for sequential accesses; configurable linear/interleaved order via LBO pin |
| Individual Byte Write | Four dedicated BWx signals allow precise 9-bit byte targeting-avoids full-word read-modify-write overhead |
| Three Chip Enables | Supports seamless depth expansion across multiple devices without external decoding logic |
| JTAG Boundary Scan | IEEE 1149.1 compliance enables automated PCB test coverage and interconnect fault detection |
Applications
| High-Speed Network Line Cards | Packet Buffering in Switch ASICs |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet line cards. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level packet buffer with deterministic ZBT timing. Use Value: Enables zero-cycle bus turnaround between header lookups (read) and payload writes-maximizing link utilization at 10 Gbps+ rates. | Use Scenario: Temporary storage of fragmented packets during classification and forwarding in Layer 2/3 switches. IC Role / Device Role / Timing Role: Synchronous burst-capable memory interfaced directly to switch fabric controller with pipelined data path. Use Value: 4-word burst mode reduces address bus contention and increases effective bandwidth by 2.8× over single-word access. |
| Industrial PLC Data Logging | Real-Time Video Frame Buffers |
Use Scenario: Cyclic acquisition and timestamped storage of sensor data streams in programmable logic controllers. IC Role / Device Role / Timing Role: Industrial-temperature SRAM providing deterministic write latency and data retention during sleep mode (ZZ). Use Value: Sleep mode (ZZ HIGH) cuts dynamic power >90% while preserving data-extending uptime in battery-backed systems. | Use Scenario: Intermediate frame buffering between image sensor interface and video compression engine in HD surveillance cameras. IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via ZBT architecture, allowing concurrent read (compression) and write (capture) without arbitration. Use Value: Eliminates pipeline stalls during frame handoff-ensuring uninterrupted 60 fps capture and encode with sub-microsecond jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV18-167BZI | 256K × 18-bit organization; 167 MHz max frequency; different burst addressing and no JTAG | Higher density but narrower bus width; suited for systems prioritizing capacity over 36-bit parallelism | Select when 18-bit data path aligns with controller interface and JTAG is not required |
| AS7C33128PFSIG | 128K × 32-bit organization; 165 MHz max frequency; no ZBT, no burst counter, no JTAG | Standard sync SRAM with simpler control; lacks zero-turnaround and burst acceleration features | Select for cost-sensitive designs where ZBT timing and burst efficiency are non-critical |
Compared with CY7C1356BV18-167BZI and AS7C33128PFSIG, the 71V3556SA150BG uniquely delivers 36-bit ZBT operation with integrated burst counter and IEEE 1149.1 testability-making it optimal for high-throughput, testable, industrial-grade memory subsystems demanding deterministic latency.
Availability
71V3556SA150BG is available at Aetrix Electronics and suitable for high-speed networking equipment, industrial PLCs, and real-time video processing systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for 71V3556SA150BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V3556SA150BG belongs to IDT's ZBT SRAM product line, engineered specifically for zero-latency bus turnaround in high-speed packet processing, network switching, and real-time control applications demanding deterministic timing and burst efficiency.
FAQ
What is the memory configuration and total capacity of the 71V3556SA150BG?
The 71V3556SA150BG is configured as 128K × 36 bits, delivering a total capacity of 4,718,592 bits (4.5 Mbit). This organization supports 36-bit parallel data transfers and is optimized for systems requiring wide data paths and high bandwidth, such as network processors and digital signal controllers. The device does not support 256K × 18-bit mode-only the 128K × 36-bit variant is implemented in the 71V3556SA150BG.
Does the 71V3556SA150BG support JTAG boundary scan, and which pins are used?
Yes, the 71V3556SA150BG supports IEEE 1149.1-compliant JTAG boundary scan. The dedicated pins are TMS (Test Mode Select), TDI (Test Data Input), TCK (Test Clock), TDO (Test Data Output), and optional TRST (JTAG Reset). These signals are assigned to specific pins in the 100-pin TQFP package (e.g., TMS on pin A11, TDI on pin A12 per BGA mapping), and TRST is optional with internal pull-up. JTAG functionality is confirmed for the "SA" suffix variant.
How does the ZBTTM feature eliminate dead cycles in the 71V3556SA150BG?
The ZBTTM (Zero Bus Turnaround) feature in the 71V3556SA150BG allows immediate transition between read and write operations without inserting idle cycles. When a read completes and a write is initiated in the next cycle, the bus direction changes synchronously within the same clock domain-enabled by internal pipelining and dual-phase control logic. This eliminates the traditional dead cycle required for bus stabilization, increasing effective bandwidth by up to 25% in mixed-access workloads.
What is the function of the ADV/LD and LBO pins in burst operation of the 71V3556SA150BG?
In the 71V3556SA150BG, ADV/LD controls burst counter behavior: sampled LOW at CLK rise, it loads a new external address; sampled HIGH, it advances the internal 4-word burst counter. LBO selects burst order-LOW enables linear sequence (A0, A1, A2, A3), HIGH enables interleaved (A0, A2, A1, A3). Both pins must be stable before and during burst execution; LBO is static and must not toggle mid-burst.
Can the 71V3556SA150BG operate in sleep mode, and how is it activated?
Yes, the 71V3556SA150BG supports synchronous sleep mode via the ZZ pin. When ZZ is driven HIGH (VIH ≥ 2.0 V), the internal clock is gated, reducing dynamic power consumption significantly while guaranteeing data retention. Sleep mode activation requires CEN = LOW and valid chip enables; the device exits sleep on the next valid CLK edge after ZZ returns LOW. This feature is validated for industrial temperature range operation.
71V3556SA150BG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V3556SA150BG FAQ
1.How can I place an order for 71V3556SA150BG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3556SA150BG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3556SA150BG reliable?
The price and inventory of 71V3556SA150BG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556SA150BG is usually 5 days.
3.What payment methods are accepted for 71V3556SA150BG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3556SA150BG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V3556SA150BG?
71V3556SA150BG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3556SA150BG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3556SA150BG?
For technical support, including 71V3556SA150BG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3556SA150BG requirements.
6.How does Aetrix verify that 71V3556SA150BG is sourced from the original manufacturer or authorized distributors?
All 71V3556SA150BG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556SA150BG meets industry standards.
7.What is the process for return or replacement of 71V3556SA150BG?
All 71V3556SA150BG units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556SA150BG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3556SA150BG part is unused and in its original packaging.
Return procedure for 71V3556SA150BG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3556SA150BG Tags

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