Renesas 71V3556SA150BGG
- Part No.:
- 71V3556SA150BGG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V3556SA150BGG.pdf
- Description:
- IC SRAM 4.5MBIT PAR 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3556SA150BGG from IDT (now Renesas) is a 3.3V, 128K × 36-bit synchronous ZBT™ SRAM with zero bus turnaround, 150 MHz clock speed (6.67 ns cycle time), 3.5 ns clock-to-data access, pipelined outputs, and JTAG boundary scan (IEEE 1149.1). It serves as high-speed cache or buffer memory in network switches, telecom line cards, and FPGA co-processor interfaces requiring burst read/write without dead cycles.
For engineers reviewing the 71V3556SA150BGG datasheet, 71V3556SA150BGG pinout, 71V3556SA150BGG application, or 71V3556SA150BGG equivalent, key selection criteria include its ZBT™ architecture eliminating write-read turnaround latency, 4-word interleaved/linear burst capability, individual byte write control (BW1–BW4), triple chip enable for depth expansion, and industrial-grade operation from –40°C to +85°C.
Technical Context
The 71V3556SA150BGG implements a fully synchronous, positive-edge-triggered architecture with registered address, data, and control inputs. Its internal burst counter and ADV/LD logic support both linear and interleaved 4-word burst sequences selected by the LBO pin, while pipelined input/output registers decouple timing from system clock skew.
ZBT™ operation is enabled via synchronized OE elimination and zero-cycle bus turnaround between consecutive reads and writes - achieved through dedicated R/W control, three independent chip enables (CE1, CE2, CE2), and clock-enable (CEN) suspension without output disturbance. The device includes optional IEEE 1149.1 JTAG test interface with TMS/TDI/TCK/TDO/TRST pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 256K × 18-bit via pin-compatible variant |
| Clock Frequency | 150 MHz (6.67 ns cycle time); enables 166 MHz max operation per spec, but this variant rated at 150 MHz |
| Access Time | 3.5 ns clock-to-data (tCD); guarantees deterministic read latency for real-time pipeline alignment |
| Supply Voltage | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate power domains reduce noise coupling |
| Burst Mode | 4-word linear or interleaved burst; LBO pin selects sequence order; ADV/LD controls load vs. increment |
| Operating Temperature | –40°C to +85°C industrial grade; validated for sustained operation in base station and industrial control environments |
| JTAG Support | IEEE 1149.1 compliant boundary scan; TMS/TDI/TCK/TDO/TRST available in BGA package (BGG) |
Pinout & Package
71V3556SA150BGG is packaged in a 119-ball fine-pitch BGA (BGG119), JEDEC-compliant, with 1.0 mm ball pitch and 14 mm × 20 mm footprint. Pinout validated per IDT document 5281 drw 13A (128K×36 BG119 configuration).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit synchronous address bus; latched on rising CLK edge when ADV/LD low and chip enabled |
| CLK | System Clock Input | Primary timing reference; all synchronous signals referenced to rising edge; no internal clock division |
| R/W | Read/Write Control | Synchronous command signal; determines cycle type (read/write) at load phase; drives two-cycle delayed action |
| ADV/LD | Burst Address Control | Loads new external address (low) or increments internal burst counter (high); defines burst initiation and sequencing |
| BW1–BW4 | Byte Write Enables | Four active-low synchronous enables for 9-bit bytes (I/O[0:7]+P1, I/O[8:15]+P2, etc.); supports partial writes without masking logic |
| CE1, CE2, CE2 | Chip Enable Inputs | Three independent enables (CE1/CE2 active-low, CE2 active-high); any false condition initiates 2-cycle deselect and tri-state |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous bus; registered input and output paths ensure clean setup/hold margins |
| TMS, TDI, TCK, TDO, TRST | JTAG Test Interface | IEEE 1149.1 boundary scan signals; TRST is optional asynchronous reset; all sampled synchronously except TRST |
| VDD, VDDQ, VSS | Power & Ground | VDD (core), VDDQ (I/O), and VSS (common ground) require separate decoupling; VDDQ isolation minimizes I/O switching noise |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between read/write transitions - enables back-to-back memory accesses at full clock rate |
| Pipelined Output Buffer | Internally synchronized OE eliminates need for external OE timing control; outputs remain stable across clock edges |
| 4-Word Burst Capability | Reduces address bus traffic by 75% per burst; LBO pin selects linear or interleaved sequence for cache-line alignment |
| Individual Byte Write Control | BW1–BW4 allow granular 9-bit writes without external byte-lane gating; simplifies memory-mapped peripheral interfacing |
| Triple Chip Enable Architecture | CE1, CE2 (active-low), CE2 (active-high) support flexible depth expansion and hierarchical memory decoding |
| Industrial Temperature Range | Rated for –40°C to +85°C operation with full parameter guarantee; suitable for uncontrolled ambient deployments |
Applications
| Network Packet Buffering | FPGA Co-Processor Cache |
|---|---|
|
Use Scenario: High-throughput Ethernet switch ASIC buffering packets between ingress and egress ports. IC Role / Device Role / Timing Role: Dual-port accessible SRAM acting as first-level packet store with zero-turnaround burst reads/writes. Use Value: 3.5 ns tCD and ZBT™ enable sub-10 ns effective latency per 36-bit word, sustaining 150 MT/s line-rate throughput. |
Use Scenario: Offloading compute-intensive tasks from FPGA fabric using tightly coupled memory for instruction/data caching. IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic, low-latency access to FPGA's AXI or Avalon-MM interface. Use Value: Pipelined registers and 150 MHz clocking align with FPGA I/O timing closure; burst mode matches cache-line fetch patterns. |
| Telecom Line Card Memory | Industrial Real-Time Controller Buffer |
|
Use Scenario: Storing frame headers and payload fragments in multi-service access gateways operating at OC-48/STM-16 rates. IC Role / Device Role / Timing Role: High-reliability buffer memory interfaced to DSPs and SerDes controllers via parallel bus. Use Value: Industrial temperature rating and JTAG testability ensure field-deployable robustness; 4-word burst matches ATM/SONET cell structures. |
Use Scenario: Buffering sensor fusion data streams in programmable logic controllers with deterministic I/O response requirements. IC Role / Device Role / Timing Role: Deterministic-access SRAM used for cyclic data exchange between CPU and motion control peripherals. Use Value: CEN pin allows synchronous clock gating during idle cycles; ZZ sleep mode reduces standby power to <100 µA. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV18-167BZI | 256K × 18-bit, 167 MHz, 3.3V, no JTAG, different pinout (100-TQFP only) | Lacks ZBT™ and burst counter; requires external OE control and has higher latency (4.5 ns tCD) | Choose for cost-sensitive designs where burst and zero-turnaround are not required and TQFP packaging is preferred. |
| AS7C33128PFSI-15 | 128K × 32-bit, 150 MHz, 3.3V, no JTAG, no ZBT™, no burst counter, 100-TQFP | Non-ZBT architecture; asynchronous OE; no ADV/LD or LBO; 4-bit narrower data bus | Choose when JTAG and ZBT™ are unnecessary and board layout must reuse existing 100-TQFP footprint with 32-bit interface. |
Compared with CY7C1356BV18-167BZI and AS7C33128PFSI-15, the 71V3556SA150BGG uniquely delivers ZBT™-enabled zero-cycle turnaround, integrated burst counter, and IEEE 1149.1 testability in a 119-ball BGA - making it optimal for high-performance, test-critical, space-constrained networking and telecom modules.
Availability
71V3556SA150BGG is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, telecom line card memory, industrial real-time controller buffering, and high-speed test equipment requiring stable component supply and long-term lifecycle support.
Supply support for 71V3556SA150BGG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V3556SA150BGG belongs to IDT's ZBT™ SRAM product line, designed specifically for high-bandwidth, low-latency memory subsystems in networking infrastructure, telecom equipment, and real-time embedded systems demanding deterministic access and zero bus turnaround.
FAQ
What is the maximum guaranteed clock frequency for the 71V3556SA150BGG?
The 71V3556SA150BGG is rated for 150 MHz operation (6.67 ns cycle time) across the full industrial temperature range (–40°C to +85°C). While the ZBT™ family supports up to 166 MHz in faster speed grades, this specific variant (150BGG) is characterized and guaranteed at 150 MHz with all parameters met under worst-case voltage and temperature conditions. The 71V3556SA150BGG datasheet specifies tCYC = 6.67 ns as the minimum clock period.
Does the 71V3556SA150BGG support true ZBT™ operation with no dead cycles between reads and writes?
Yes, the 71V3556SA150BGG implements true ZBT™ (Zero Bus Turnaround) functionality as defined by IDT. It eliminates dead cycles between consecutive read and write operations by using synchronized R/W control, pipelined registers, and internal bus arbitration - enabling back-to-back accesses at full clock rate. This behavior is confirmed in the functional truth table and timing diagrams of the 71V3556SA150BGG datasheet, where burst read immediately followed by burst write incurs zero wait states.
How is burst addressing controlled on the 71V3556SA150BGG?
Burst addressing on the 71V3556SA150BGG is controlled by the ADV/LD and LBO pins. When ADV/LD is sampled high at the rising clock edge, the internal burst counter advances; when sampled low, a new external address is loaded. LBO selects burst order: low for linear (0,1,2,3), high for interleaved (0,2,3,1). The 71V3556SA150BGG supports both modes with hardware-defined sequence tables and no software overhead.
Is JTAG boundary scan supported on the 71V3556SA150BGG, and which pins are used?
Yes, the 71V3556SA150BGG includes optional IEEE 1149.1-compliant JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and TRST are assigned to balls A6, A5, A4, A3, and A2 respectively in the BGG119 package (per IDT doc 5281 drw 13A). TRST is optional and internally pulled up; if unused, it may be left floating. JTAG functionality is exclusive to the "SA" variant, and the 71V3556SA150BGG is explicitly an SA-series part.
What is the purpose of the ZZ (sleep mode) pin on the 71V3556SA150BGG?
The ZZ pin on the 71V3556SA150BGG is a synchronous sleep mode input. When driven high, it gates the internal clock and reduces core power consumption to its lowest level while maintaining full data retention. ZZ is sampled synchronously on the rising CLK edge and has an internal pulldown resistor. In sleep mode, the 71V3556SA150BGG draws <100 µA typical standby current, making it suitable for power-aware systems requiring rapid wake-up (<100 ns) without data loss.
71V3556SA150BGG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V3556SA150BGG FAQ
1.How can I place an order for 71V3556SA150BGG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3556SA150BGG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3556SA150BGG reliable?
The price and inventory of 71V3556SA150BGG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556SA150BGG is usually 5 days.
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Once your 71V3556SA150BGG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3556SA150BGG?
For technical support, including 71V3556SA150BGG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3556SA150BGG requirements.
6.How does Aetrix verify that 71V3556SA150BGG is sourced from the original manufacturer or authorized distributors?
All 71V3556SA150BGG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556SA150BGG meets industry standards.
7.What is the process for return or replacement of 71V3556SA150BGG?
All 71V3556SA150BGG units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556SA150BGG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3556SA150BGG part is unused and in its original packaging.
Return procedure for 71V3556SA150BGG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3556SA150BGG Tags

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M24C02-WMN6TP
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