Renesas 71V3556SA150BQ
- Part No.:
- 71V3556SA150BQ
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V3556SA150BQ.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,284
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
71V3556SA150BQ from IDT (now Renesas) is a 3.3V, 128K × 36-bit synchronous ZBT SRAM with Zero Bus Turnaround architecture, 150 MHz clock speed (6.67 ns cycle time), 3.5 ns clock-to-data access, pipelined outputs, and JTAG boundary scan support. It operates across industrial temperature range (–40°C to +85°C) and is used in high-bandwidth packet buffering for network switches and routers.
For engineers reviewing the 71V3556SA150BQ datasheet, 71V3556SA150BQ pinout, 71V3556SA150BQ application, or 71V3556SA150BQ equivalent, key selection criteria include ZBT bus turnaround elimination, 4-word burst capability (linear/interleaved), individual byte write control (BW1–BW4), synchronous OE-free output enable, and JEDEC-standard 165-ball fine-pitch BGA (BQ) packaging.
Technical Context
The 71V3556SA150BQ implements a fully synchronous, pipelined memory interface with address/control/data registers triggered on the positive clock edge. Its ZBT architecture eliminates dead cycles between read and write operations by overlapping bus turnaround with internal memory access.
It integrates an on-chip burst counter controlled by ADV/LD and LBO pins, supports linear or interleaved 4-word bursts, and features three chip enables (CE1, CE2, CE2) for depth expansion. Optional IEEE 1149.1 JTAG boundary scan is implemented via TMS/TDI/TCK/TDO/TRST pins, available only in BGA packages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 256K × 18-bit via pin-compatible variant |
| Clock Frequency | 150 MHz - enables 6.67 ns cycle time for high-throughput data buffering |
| Access Time | 3.5 ns clock-to-data - guarantees deterministic read latency for real-time traffic handling |
| Supply Voltage | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5% - dual-rail I/O/core supply ensures signal integrity at 150 MHz |
| Operating Temperature | –40°C to +85°C - qualified for industrial networking equipment deployment |
| Burst Mode | 4-word linear or interleaved burst - reduces address bus overhead in sequential access patterns |
| Byte Write Control | BW1–BW4 active-low enables - allows partial 9-bit byte writes without disturbing adjacent bytes |
Pinout & Package
Packaged in a JEDEC-standard 165-ball fine-pitch ball grid array (fBGA), designated BQ165/BQG165 per IDT documentation. Pin pitch is 0.8 mm; package dimensions are 13 mm × 15 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CLK | System Clock Input | Primary timing reference; all synchronous inputs and outputs referenced to rising edge |
| R/W | Read/Write Control | Synchronous command signal; determines load-cycle operation type (read/write) two cycles later |
| ADV/LD | Burst Address Advance / New Address Load | Drives burst counter increment (HIGH) or loads external address (LOW); controls burst sequence initiation |
| LBO | Burst Order Selection | Static input selecting linear (LOW) or interleaved (HIGH) 4-word burst addressing pattern |
| BW1–BW4 | Byte Write Enables | Four independent active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CE1, CE2, CE2 | Chip Enable Inputs | Three synchronous enables (CE1/CE2 active-low, CE2 active-high) for multi-chip depth expansion |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Pins | 36-bit bidirectional synchronous data bus; registered input/output paths ensure timing closure at 150 MHz |
| TMS, TDI, TCK, TDO, TRST | JTAG Boundary Scan Interface | IEEE 1149.1-compliant test interface; TRST optional asynchronous reset (available only in BGA) |
| ZZ | Sleep Mode Input | Active-high synchronous entry into low-power retention mode; preserves data while gating internal clock |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Architecture | Eliminates bus turnaround dead cycles between reads and writes - increases effective bandwidth in burst-intensive applications |
| Internally Synchronized OE | Output enable is fully registered; removes need for external OE timing control and simplifies system-level timing budget |
| 4-Word Burst Counter | Reduces address bus activity by 75% during sequential accesses - lowers system power and routing complexity |
| Individual Byte Write (BW1–BW4) | Enables precise 9-bit sub-word writes without read-modify-write - critical for packet header manipulation in networking ASICs |
| Three Chip Enables | Supports seamless depth expansion across multiple devices using standard logic - no external decode logic required |
Applications
| High-Speed Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with line-rate throughput. IC Role / Device Role / Timing Role: Primary data buffer SRAM interfacing directly to switch fabric controller; provides zero-turnaround burst reads/writes synchronized to 150 MHz system clock. Use Value: 3.5 ns clock-to-data access and ZBT architecture sustain >95% bus utilization under mixed read/write traffic, reducing packet drop rates. | Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line cards requiring deterministic latency and industrial temperature operation. IC Role / Device Role / Timing Role: Dual-port-capable synchronous SRAM used for ingress/egress FIFOs; leverages ADV/LD and LBO for burst-aligned payload transfers. Use Value: 4-word burst mode and individual byte write support enable efficient ATM cell and GFP frame handling without bus contention. |
| Network Processor Co-Processor Memory | Industrial Real-Time Controller Cache |
Use Scenario: Offloading packet classification and lookup table storage from network processors in DPI/firewall appliances. IC Role / Device Role / Timing Role: High-speed scratchpad memory mapped to NPU's external bus; accessed via pipelined read/write cycles with CEN-controlled clock gating. Use Value: Pipelined outputs and synchronous CEN allow dynamic power management during idle periods while maintaining sub-4 ns read latency on demand. | Use Scenario: Deterministic data logging and motion control loop buffering in PLCs and CNC controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Industrial-grade SRAM providing non-volatile-retentive storage for servo position history and safety-critical state variables. Use Value: –40°C to +85°C qualification and ZZ sleep mode ensure reliable operation during thermal cycling and low-power standby states. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV18-167BZI | 128K × 18-bit organization; 167 MHz max frequency; 3.3V core/I/O; no JTAG; different pinout | Targeted at x18 systems; lacks burst counter and ZBT optimization for x36 bus widths | Select when x18 data path suffices and JTAG testability is not required. |
| AS7C33128PFSIG | 128K × 36-bit; 133 MHz max; 3.3V; no ZBT feature; asynchronous OE; no JTAG or burst counter | General-purpose synchronous SRAM; higher access latency (~5.5 ns); no zero-turnaround capability | Choose for cost-sensitive designs where ZBT performance and burst efficiency are non-critical. |
Compared with CY7C1356BV18-167BZI and AS7C33128PFSIG, the 71V3556SA150BQ uniquely delivers ZBT bus turnaround elimination, integrated 4-word burst counter, and IEEE 1149.1 JTAG - making it optimal for high-efficiency, testable, industrial-grade networking buffers.
Availability
71V3556SA150BQ is available at Aetrix Electronics and suitable for high-speed packet buffering, telecom line card memory, and industrial real-time controller cache requiring stable component supply and long-term lifecycle support.
Supply support for 71V3556SA150BQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.
The 71V3556SA150BQ belongs to IDT's ZBT SRAM product line, engineered specifically for zero-latency bus turnaround in high-throughput packet-switching and telecom applications demanding deterministic timing and industrial reliability.
FAQ
What is the maximum clock frequency supported by the 71V3556SA150BQ?
The 71V3556SA150BQ is rated for a maximum clock frequency of 150 MHz, corresponding to a 6.67 ns clock cycle time. This rating is validated across the full industrial temperature range (–40°C to +85°C) and under specified 3.3 V ±5% supply conditions. Operation beyond this frequency is not guaranteed and may violate setup/hold timing margins.
Does the 71V3556SA150BQ support both linear and interleaved burst modes?
Yes, the 71V3556SA150BQ supports both linear and interleaved 4-word burst sequences. The LBO (Linear Burst Order) pin selects the mode: LBO = LOW configures linear burst order (A0, A0+1, A0+2, A0+3), while LBO = HIGH selects interleaved order (A0, A0+2, A0+1, A0+3). This selection is static and must remain stable during burst operation.
Is JTAG boundary scan functionality available on all 71V3556SA150BQ packages?
JTAG boundary scan (IEEE 1149.1) is available only on BGA packages including the 71V3556SA150BQ (BQ165). The TMS, TDI, TCK, TDO, and optional TRST pins are assigned to dedicated balls in the fBGA layout. JTAG is not implemented in TQFP or standard BGA variants of the 71V3556SA family.
How does the 71V3556SA150BQ eliminate bus turnaround dead cycles?
The 71V3556SA150BQ eliminates bus turnaround dead cycles via its ZBT™ (Zero Bus Turnaround) architecture: read and write operations are overlapped such that the bus direction change occurs concurrently with internal memory access. This is achieved through pipelined address/control registration and synchronized output buffer enable, removing the need for idle cycles between successive read/write commands.
What is the function of the ZZ pin on the 71V3556SA150BQ?
ZZ is the synchronous sleep mode input on the 71V3556SA150BQ. When asserted HIGH, ZZ gates the internal clock and places the device in its lowest power consumption state while guaranteeing data retention. All I/Os enter high-impedance, and the device remains responsive to CE and CEN transitions for wake-up. ZZ has an internal pulldown resistor.
71V3556SA150BQ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V3556SA150BQ FAQ
1.How can I place an order for 71V3556SA150BQ through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3556SA150BQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3556SA150BQ reliable?
The price and inventory of 71V3556SA150BQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556SA150BQ is usually 5 days.
3.What payment methods are accepted for 71V3556SA150BQ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3556SA150BQ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V3556SA150BQ?
71V3556SA150BQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3556SA150BQ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3556SA150BQ?
For technical support, including 71V3556SA150BQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3556SA150BQ requirements.
6.How does Aetrix verify that 71V3556SA150BQ is sourced from the original manufacturer or authorized distributors?
All 71V3556SA150BQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556SA150BQ meets industry standards.
7.What is the process for return or replacement of 71V3556SA150BQ?
All 71V3556SA150BQ units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556SA150BQ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3556SA150BQ part is unused and in its original packaging.
Return procedure for 71V3556SA150BQ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3556SA150BQ Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

