Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 71V3556SA150BQ

Part No.:
71V3556SA150BQ
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V3556SA150BQ.pdf
Description:
IC SRAM 4.5MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,284

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

71V3556SA150BQ from IDT (now Renesas) is a 3.3V, 128K × 36-bit synchronous ZBT SRAM with Zero Bus Turnaround architecture, 150 MHz clock speed (6.67 ns cycle time), 3.5 ns clock-to-data access, pipelined outputs, and JTAG boundary scan support. It operates across industrial temperature range (–40°C to +85°C) and is used in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the 71V3556SA150BQ datasheet, 71V3556SA150BQ pinout, 71V3556SA150BQ application, or 71V3556SA150BQ equivalent, key selection criteria include ZBT bus turnaround elimination, 4-word burst capability (linear/interleaved), individual byte write control (BW1–BW4), synchronous OE-free output enable, and JEDEC-standard 165-ball fine-pitch BGA (BQ) packaging.

Technical Context

The 71V3556SA150BQ implements a fully synchronous, pipelined memory interface with address/control/data registers triggered on the positive clock edge. Its ZBT architecture eliminates dead cycles between read and write operations by overlapping bus turnaround with internal memory access.

It integrates an on-chip burst counter controlled by ADV/LD and LBO pins, supports linear or interleaved 4-word bursts, and features three chip enables (CE1, CE2, CE2) for depth expansion. Optional IEEE 1149.1 JTAG boundary scan is implemented via TMS/TDI/TCK/TDO/TRST pins, available only in BGA packages.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128K × 36-bit (4.5 Mbit); supports 256K × 18-bit via pin-compatible variant
Clock Frequency150 MHz - enables 6.67 ns cycle time for high-throughput data buffering
Access Time3.5 ns clock-to-data - guarantees deterministic read latency for real-time traffic handling
Supply VoltageVDD = 3.3 V ±5%, VDDQ = 3.3 V ±5% - dual-rail I/O/core supply ensures signal integrity at 150 MHz
Operating Temperature–40°C to +85°C - qualified for industrial networking equipment deployment
Burst Mode4-word linear or interleaved burst - reduces address bus overhead in sequential access patterns
Byte Write ControlBW1–BW4 active-low enables - allows partial 9-bit byte writes without disturbing adjacent bytes

Pinout & Package

Packaged in a JEDEC-standard 165-ball fine-pitch ball grid array (fBGA), designated BQ165/BQG165 per IDT documentation. Pin pitch is 0.8 mm; package dimensions are 13 mm × 15 mm.

Pin/TerminalCircuit RoleDesign Meaning
A0–A16Address Inputs17-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled
CLKSystem Clock InputPrimary timing reference; all synchronous inputs and outputs referenced to rising edge
R/WRead/Write ControlSynchronous command signal; determines load-cycle operation type (read/write) two cycles later
ADV/LDBurst Address Advance / New Address LoadDrives burst counter increment (HIGH) or loads external address (LOW); controls burst sequence initiation
LBOBurst Order SelectionStatic input selecting linear (LOW) or interleaved (HIGH) 4-word burst addressing pattern
BW1–BW4Byte Write EnablesFour independent active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4)
CE1, CE2, CE2Chip Enable InputsThree synchronous enables (CE1/CE2 active-low, CE2 active-high) for multi-chip depth expansion
I/O0–I/O31, I/OP1–I/OP4Data I/O Pins36-bit bidirectional synchronous data bus; registered input/output paths ensure timing closure at 150 MHz
TMS, TDI, TCK, TDO, TRSTJTAG Boundary Scan InterfaceIEEE 1149.1-compliant test interface; TRST optional asynchronous reset (available only in BGA)
ZZSleep Mode InputActive-high synchronous entry into low-power retention mode; preserves data while gating internal clock

Key Features

FeatureDesign Value
ZBT™ ArchitectureEliminates bus turnaround dead cycles between reads and writes - increases effective bandwidth in burst-intensive applications
Internally Synchronized OEOutput enable is fully registered; removes need for external OE timing control and simplifies system-level timing budget
4-Word Burst CounterReduces address bus activity by 75% during sequential accesses - lowers system power and routing complexity
Individual Byte Write (BW1–BW4)Enables precise 9-bit sub-word writes without read-modify-write - critical for packet header manipulation in networking ASICs
Three Chip EnablesSupports seamless depth expansion across multiple devices using standard logic - no external decode logic required

Applications

High-Speed Packet BufferingTelecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with line-rate throughput.

IC Role / Device Role / Timing Role: Primary data buffer SRAM interfacing directly to switch fabric controller; provides zero-turnaround burst reads/writes synchronized to 150 MHz system clock.

Use Value: 3.5 ns clock-to-data access and ZBT architecture sustain >95% bus utilization under mixed read/write traffic, reducing packet drop rates.

Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line cards requiring deterministic latency and industrial temperature operation.

IC Role / Device Role / Timing Role: Dual-port-capable synchronous SRAM used for ingress/egress FIFOs; leverages ADV/LD and LBO for burst-aligned payload transfers.

Use Value: 4-word burst mode and individual byte write support enable efficient ATM cell and GFP frame handling without bus contention.

Network Processor Co-Processor MemoryIndustrial Real-Time Controller Cache

Use Scenario: Offloading packet classification and lookup table storage from network processors in DPI/firewall appliances.

IC Role / Device Role / Timing Role: High-speed scratchpad memory mapped to NPU's external bus; accessed via pipelined read/write cycles with CEN-controlled clock gating.

Use Value: Pipelined outputs and synchronous CEN allow dynamic power management during idle periods while maintaining sub-4 ns read latency on demand.

Use Scenario: Deterministic data logging and motion control loop buffering in PLCs and CNC controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Industrial-grade SRAM providing non-volatile-retentive storage for servo position history and safety-critical state variables.

Use Value: –40°C to +85°C qualification and ZZ sleep mode ensure reliable operation during thermal cycling and low-power standby states.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1356BV18-167BZI128K × 18-bit organization; 167 MHz max frequency; 3.3V core/I/O; no JTAG; different pinoutTargeted at x18 systems; lacks burst counter and ZBT optimization for x36 bus widthsSelect when x18 data path suffices and JTAG testability is not required.
AS7C33128PFSIG128K × 36-bit; 133 MHz max; 3.3V; no ZBT feature; asynchronous OE; no JTAG or burst counterGeneral-purpose synchronous SRAM; higher access latency (~5.5 ns); no zero-turnaround capabilityChoose for cost-sensitive designs where ZBT performance and burst efficiency are non-critical.

Compared with CY7C1356BV18-167BZI and AS7C33128PFSIG, the 71V3556SA150BQ uniquely delivers ZBT bus turnaround elimination, integrated 4-word burst counter, and IEEE 1149.1 JTAG - making it optimal for high-efficiency, testable, industrial-grade networking buffers.

Availability

71V3556SA150BQ is available at Aetrix Electronics and suitable for high-speed packet buffering, telecom line card memory, and industrial real-time controller cache requiring stable component supply and long-term lifecycle support.

Supply support for 71V3556SA150BQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.

The 71V3556SA150BQ belongs to IDT's ZBT SRAM product line, engineered specifically for zero-latency bus turnaround in high-throughput packet-switching and telecom applications demanding deterministic timing and industrial reliability.

FAQ

What is the maximum clock frequency supported by the 71V3556SA150BQ?

The 71V3556SA150BQ is rated for a maximum clock frequency of 150 MHz, corresponding to a 6.67 ns clock cycle time. This rating is validated across the full industrial temperature range (–40°C to +85°C) and under specified 3.3 V ±5% supply conditions. Operation beyond this frequency is not guaranteed and may violate setup/hold timing margins.

Does the 71V3556SA150BQ support both linear and interleaved burst modes?

Yes, the 71V3556SA150BQ supports both linear and interleaved 4-word burst sequences. The LBO (Linear Burst Order) pin selects the mode: LBO = LOW configures linear burst order (A0, A0+1, A0+2, A0+3), while LBO = HIGH selects interleaved order (A0, A0+2, A0+1, A0+3). This selection is static and must remain stable during burst operation.

Is JTAG boundary scan functionality available on all 71V3556SA150BQ packages?

JTAG boundary scan (IEEE 1149.1) is available only on BGA packages including the 71V3556SA150BQ (BQ165). The TMS, TDI, TCK, TDO, and optional TRST pins are assigned to dedicated balls in the fBGA layout. JTAG is not implemented in TQFP or standard BGA variants of the 71V3556SA family.

How does the 71V3556SA150BQ eliminate bus turnaround dead cycles?

The 71V3556SA150BQ eliminates bus turnaround dead cycles via its ZBT™ (Zero Bus Turnaround) architecture: read and write operations are overlapped such that the bus direction change occurs concurrently with internal memory access. This is achieved through pipelined address/control registration and synchronized output buffer enable, removing the need for idle cycles between successive read/write commands.

What is the function of the ZZ pin on the 71V3556SA150BQ?

ZZ is the synchronous sleep mode input on the 71V3556SA150BQ. When asserted HIGH, ZZ gates the internal clock and places the device in its lowest power consumption state while guaranteeing data retention. All I/Os enter high-impedance, and the device remains responsive to CE and CEN transitions for wake-up. ZZ has an internal pulldown resistor.

71V3556SA150BQ Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
150 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V3556SA150BQ FAQ

1.How can I place an order for 71V3556SA150BQ through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3556SA150BQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3556SA150BQ reliable?

The price and inventory of 71V3556SA150BQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556SA150BQ is usually 5 days.

3.What payment methods are accepted for 71V3556SA150BQ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3556SA150BQ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V3556SA150BQ?

71V3556SA150BQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3556SA150BQ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3556SA150BQ?

For technical support, including 71V3556SA150BQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3556SA150BQ requirements.

6.How does Aetrix verify that 71V3556SA150BQ is sourced from the original manufacturer or authorized distributors?

All 71V3556SA150BQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556SA150BQ meets industry standards.

7.What is the process for return or replacement of 71V3556SA150BQ?

All 71V3556SA150BQ units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556SA150BQ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3556SA150BQ part is unused and in its original packaging.

Return procedure for 71V3556SA150BQ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

71V3556SA150BQ Tags

  • 71V3556SA150BQ
  • 71V3556SA150BQ PDF
  • 71V3556SA150BQ Datasheet
  • 71V3556SA150BQ Specifications
  • 71V3556SA150BQ Images
  • Renesas
  • Renesas 71V3556SA150BQ
  • Buy 71V3556SA150BQ
  • 71V3556SA150BQ Price
  • 71V3556SA150BQ Distributor
  • 71V3556SA150BQ Supplier
  • 71V3556SA150BQ Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER