My Inquiry
My Account
Renesas 71V3556SA166BGI
- Part No.:
- 71V3556SA166BGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V3556SA166BGI.pdf
- Description:
- IC SRAM 4.5MBIT PAR 119PBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,381
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
71V3556SA166BGI from IDT (now Renesas) is a 3.3V, 128K × 36-bit synchronous ZBT™ SRAM with zero bus turnaround, 166 MHz operation (3.5 ns clock-to-data access), pipelined outputs, and integrated burst counter. It supports interleaved/linear 4-word bursts, individual byte write control (BW1–BW4), and JTAG boundary scan (IEEE 1149.1). Used in high-speed networking line cards and packet buffering systems requiring deterministic latency and no dead cycles between read/write transitions.
For engineers reviewing the 71V3556SA166BGI datasheet, 71V3556SA166BGI pinout, 71V3556SA166BGI application, or 71V3556SA166BGI equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, industrial temperature support (–40°C to +85°C), 3.3V core/I/O supply tolerance, and JTAG-enabled testability for production validation.
Technical Context
The 71V3556SA166BGI implements a fully synchronous, positive-edge-triggered architecture with registered address, data, and control inputs. Its ZBT™ feature eliminates bus turnaround dead cycles by enabling immediate read-after-write or write-after-read transitions without wait states.
It integrates an on-chip burst counter controlled by ADV/LD and LBO pins, supporting both linear and interleaved 4-word sequences. Output enable (OE) is asynchronous, while all other inputs-including three chip enables (CE1, CE2, CE2), clock enable (CEN), and sleep mode (ZZ)-are synchronous with the rising edge of CLK.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 256K × 18-bit via pin-compatible variant |
| Clock Frequency | 166 MHz maximum; enables 3.5 ns clock-to-data access for real-time packet buffering |
| Supply Voltage | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); ensures compatibility with 3.3V logic families |
| Operating Temperature | –40°C to +85°C industrial grade; validated for telecom infrastructure and base station environments |
| Burst Capability | 4-word linear or interleaved burst; reduces address bus traffic and improves throughput in streaming applications |
| JTAG Support | IEEE 1149.1-compliant boundary scan (TMS/TDI/TCK/TDO/TRST); enables in-system test and debug without external probes |
| Package | JEDEC-standard 100-pin TQFP (14 mm × 20 mm); compatible with standard SMT reflow profiles |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm footprint, with exposed thermal pad (not electrically connected). Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14/16/66 tolerate VIH-level input without direct VDD connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous 18-bit address bus; A0–A16 used for 128K×36 configuration; A17 reserved in this variant |
| CE1, CE2, CE2 | Chip Enables | Three independent enables: CE1/CE2 active-low, CE2 active-high; enable depth expansion without external logic |
| R/W | Read/Write Control | Synchronous signal determining cycle type; sampled at rising CLK edge to initiate 2-cycle delayed data transfer |
| ADV/LD | Burst Address Control | Loads new external address when low; advances internal burst counter when high-enables seamless burst sequencing |
| LBO | Burst Order Select | Static input selecting linear (LBO = low) or interleaved (LBO = high) 4-word burst sequence per IEEE Std 1149.1 |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous bus; I/OP1–I/OP4 are parity bits for error detection in telecom applications |
| CLK | System Clock | Primary timing reference; all synchronous inputs latched on rising edge; OE is sole asynchronous signal |
| ZZ | Sleep Mode Input | Synchronous high-active signal gating internal clock to minimize power; guarantees data retention during low-power standby |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between read/write transitions-critical for full-duplex packet buffering in switch fabric ASICs |
| Internally synchronized OE | Removes need for external OE timing control; outputs tri-state automatically after deselect or write completion |
| Individual byte write (BW1–BW4) | Enables selective 9-bit byte updates without disturbing adjacent data-reduces bus contention in multi-processor shared memory |
| Pipelined output registers | Ensures deterministic 2-cycle read latency and eliminates hold-time violations in high-speed backplane interfaces |
| JTAG boundary scan (SA version) | Provides IEEE 1149.1 test access for interconnect verification and fault isolation in dense PCB layouts |
Applications
| High-Speed Network Switching | Telecom Line Card Buffering |
|---|---|
|
Use Scenario: Storing and forwarding Ethernet frames in Layer 2/3 switching ASICs with strict latency budgets. IC Role / Device Role / Timing Role: Primary packet buffer SRAM interfacing directly with switch fabric controller via synchronous 36-bit bus. Use Value: ZBT™ eliminates turnaround delay, enabling sustained 166 MHz throughput without pipeline stalls during mixed read/write traffic. |
Use Scenario: Temporary storage of voice-over-IP (VoIP) packets in carrier-grade DSLAM or OLT line cards. IC Role / Device Role / Timing Role: Burst-mode SRAM providing jitter-free buffering between ATM/PTM framer and DSP subsystem. Use Value: 4-word interleaved burst and pipelined outputs reduce address setup overhead, improving VoIP packet processing efficiency. |
| Industrial Real-Time Control | Radar Signal Processing |
|
Use Scenario: High-reliability data logging and command queuing in programmable logic controller (PLC) backplanes. IC Role / Device Role / Timing Role: Deterministic-access memory for time-critical I/O mapping and motion control instruction buffering. Use Value: Industrial temperature rating (–40°C to +85°C) and ZZ sleep mode ensure stable operation in uncontrolled cabinet environments. |
Use Scenario: Intermediate storage of digitized RF samples in phased-array radar front-end modules. IC Role / Device Role / Timing Role: Low-latency buffer synchronizing ADC output with FPGA-based beamforming engine. Use Value: 3.5 ns clock-to-data access and synchronous burst capability meet sub-microsecond timing constraints for pulse-Doppler processing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV18-166BZI | 256K × 18-bit organization; same 166 MHz speed, but narrower data bus and no JTAG | Requires two devices for 36-bit width; lacks boundary scan-less suitable for high-assurance telecom test | Select only if system uses 18-bit datapath or prioritizes cost over testability and ZBT™ optimization |
| AS7C33128P-166BIN | 128K × 32-bit (no parity pins); no burst counter, no JTAG, commercial temp only (0°C to +70°C) | Cannot support parity-based error detection; unsuitable for industrial/telecom deployments requiring extended temperature range | Consider only for non-critical embedded control where parity and JTAG are unnecessary and cost is primary driver |
Compared with CY7C1356BV18-166BZI and AS7C33128P-166BIN, the 71V3556SA166BGI uniquely delivers 36-bit width with parity, ZBT™-optimized timing, industrial temperature support, and IEEE 1149.1 testability-making it the only option meeting full telecom line card qualification requirements.
Availability
71V3556SA166BGI is available at Aetrix Electronics and suitable for high-speed network switching, telecom line card buffering, and industrial real-time control applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for 71V3556SA166BGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.
The 71V3556SA166BGI belongs to IDT's ZBT™ SRAM product line, designed specifically for applications demanding zero-bus-turnaround performance, deterministic latency, and robust testability in mission-critical networking and telecom equipment.
FAQ
What does the "SA" suffix indicate in 71V3556SA166BGI?
The "SA" suffix denotes the JTAG-enabled version of the 71V3556SA166BGI, featuring full IEEE 1149.1 boundary scan support with dedicated TMS, TDI, TCK, TDO, and optional TRST pins. This distinguishes it from the base "S" variant, which omits JTAG functionality and routes those pins as no-connects. The SA version is required for production testability in high-reliability telecom systems.
Does the 71V3556SA166BGI support both 128K×36 and 256K×18 configurations?
The 71V3556SA166BGI is specifically configured as 128K × 36-bit. While the underlying family includes the pin-compatible 71V3558SA166BGI for 256K × 18-bit, the 71V3556SA166BGI's address mapping and functional behavior are fixed to the 128K×36 organization. A0–A16 are active; A17 is unused in this variant, and the memory array is physically sized accordingly.
How does the ZZ (Sleep Mode) pin function in the 71V3556SA166BGI?
The ZZ pin on the 71V3556SA166BGI is a synchronous high-active input that internally gates the clock distribution network, reducing dynamic power consumption to minimum levels while preserving data integrity. When asserted, it places the device in low-power retention mode with guaranteed data hold across the full industrial temperature range (–40°C to +85°C), making it ideal for energy-sensitive telecom standby states.
Can the 71V3556SA166BGI operate without actively controlling OE (Output Enable)?
Yes-the 71V3556SA166BGI allows OE to be tied permanently low because its output buffers are internally synchronized and tri-state automatically upon chip deselect, write initiation, or CEN assertion. This eliminates external OE timing constraints and simplifies PCB layout, especially in systems where deterministic bus release is managed via CE or R/W signals instead of OE.
What is the significance of the "BGI" suffix in 71V3556SA166BGI?
The "BGI" suffix indicates the 71V3556SA166BGI is packaged in a 100-pin TQFP (thin quad flatpack) with industrial temperature grade (–40°C to +85°C) and lead-free, RoHS-compliant construction. The "G" confirms green (halogen-free) materials, and "I" designates industrial temperature screening-critical for deployment in base stations, industrial controllers, and outdoor networking hardware.
71V3556SA166BGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V3556SA166BGI FAQ
1.How can I place an order for 71V3556SA166BGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3556SA166BGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3556SA166BGI reliable?
The price and inventory of 71V3556SA166BGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556SA166BGI is usually 5 days.
3.What payment methods are accepted for 71V3556SA166BGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3556SA166BGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V3556SA166BGI?
71V3556SA166BGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3556SA166BGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3556SA166BGI?
For technical support, including 71V3556SA166BGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3556SA166BGI requirements.
6.How does Aetrix verify that 71V3556SA166BGI is sourced from the original manufacturer or authorized distributors?
All 71V3556SA166BGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556SA166BGI meets industry standards.
7.What is the process for return or replacement of 71V3556SA166BGI?
All 71V3556SA166BGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556SA166BGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3556SA166BGI part is unused and in its original packaging.
Return procedure for 71V3556SA166BGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3556SA166BGI Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
