Renesas 71V3556SA166BQ8
- Part No.:
- 71V3556SA166BQ8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V3556SA166BQ8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3556SA166BQ8 from IDT (now Renesas) is a 3.3V, 128K × 36-bit synchronous ZBT™ SRAM with zero bus turnaround, 166 MHz operation, 3.5 ns clock-to-data access, pipelined outputs, and JTAG boundary scan (IEEE 1149.1). It serves as high-speed cache or buffer memory in network packet processors and telecom line cards requiring deterministic burst read/write without dead cycles.
For engineers reviewing the 71V3556SA166BQ8 datasheet, 71V3556SA166BQ8 pinout, 71V3556SA166BQ8 application, or 71V3556SA166BQ8 equivalent, key selection criteria include its 100-pin TQFP package, 4-word interleaved/linear burst capability, individual byte write control (BW1–BW4), industrial temperature support (–40°C to +85°C), and optional JTAG test interface for system-level validation.
Technical Context
The 71V3556SA166BQ8 implements a fully synchronous, pipelined architecture where address/control signals are registered on the rising edge of CLK, and data transfers occur two cycles later. Its ZBT™ feature eliminates bus turnaround latency by enabling immediate read-after-write or write-after-read transitions without idle cycles.
It integrates an on-chip burst counter controlled by ADV/LD and LBO pins, supporting both linear and interleaved 4-word sequences. The device uses separate VDD (3.3V core) and VDDQ (3.3V I/O) supplies, includes three chip enables (CE1, CE2, CE2) for depth expansion, and features asynchronous OE for output tri-state control independent of clock timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports high-bandwidth data paths in 36-bit bus systems. |
| Max Clock Frequency | 166 MHz; enables 166 million memory transactions per second with full pipelining. |
| Clock-to-Data Access | 3.5 ns; guarantees deterministic data valid window for timing-critical synchronous interfaces. |
| Burst Capability | 4-word burst (interleaved or linear); reduces address overhead and improves throughput in sequential access patterns. |
| Supply Voltages | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; dual-rail design isolates core logic noise from I/O switching transients. |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade embedded systems including base station hardware. |
| JTAG Support | IEEE 1149.1 compliant; enables board-level test, debug, and in-system programming without dedicated test pads. |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14, 16, and 66 tolerate VIH-level input without direct VDD connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous inputs registering full 18-bit address space; A0–A16 used for 128K×36 configuration. |
| CLK | System Clock Input | Rising-edge-triggered master timing reference; all synchronous registers (address, control, data) align to this edge. |
| R/W | Read/Write Control | Synchronous signal defining transaction type; sampled with ADV/LD low to initiate load cycle. |
| ADV/LD | Burst Counter Control | Loads new external address when low; advances internal counter when high-enables seamless burst sequencing. |
| BW1–BW4 | Byte Write Enables | Independent active-low controls for four 9-bit bytes; allows partial-word writes without masking logic. |
| CE1, CE2, CE2 | Chip Enable Inputs | Three enables (CE1/CE2 active-low, CE2 active-high) support flexible depth expansion and hierarchical deselect. |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous bus; registered input/output paths ensure clean setup/hold timing at 166 MHz. |
| OE | Output Enable | Asynchronous control; tri-states outputs immediately regardless of clock state-simplifies bus arbitration. |
| LBO | Burst Order Select | Static input selecting linear (LBO = low) or interleaved (LBO = high) 4-word burst sequence per IEEE Std 1149.1. |
| TMS, TDI, TCK, TDO, TRST | JTAG Test Interface | Boundary-scan chain for interconnect testing; TRST is optional asynchronous reset (available in BGA only). |
| ZZ | Sleep Mode Input | Synchronous high-active signal gating internal clock and reducing power while retaining memory contents. |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between consecutive reads/writes-enables continuous 166 MHz bus utilization without wait states. |
| Internally Synchronized OE | Removes need for external OE timing control; outputs remain stable during clock enable suspension or chip deselect. |
| Pipelined Address/Data Registers | Two-cycle latency from address/control registration to data transfer-ensures predictable timing for FPGA/ASIC glue logic. |
| Individual Byte Write (BW1–BW4) | Enables precise 9-bit sub-word updates without read-modify-write cycles-critical for protocol header manipulation. |
| Three Chip Enables (CE1/CE2/CE2) | Supports multi-device depth expansion with independent select/deselect control-simplifies memory bank management in large systems. |
| Optional JTAG Boundary Scan | Provides IEEE 1149.1-compliant test access for PCB interconnect verification-reduces test fixture cost and time. |
Applications
| High-Speed Network Switching | Telecom Line Card Buffering |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-throughput packet buffer memory interfacing directly to MAC controllers via 36-bit synchronous bus. Use Value: 166 MHz operation and ZBT™ enable sustained 5.98 Gbps (36-bit × 166 MHz) bandwidth with zero turnaround penalty between frame segments. |
Use Scenario: Temporary storage of ATM cells or SONET/SDH payloads in optical transport equipment. IC Role / Device Role / Timing Role: Burst-mode FIFO buffer supporting 4-word interleaved reads for cell header processing pipelines. Use Value: Linear/interleaved burst modes match standard telecom payload alignment; 3.5 ns clock-to-data ensures deterministic jitter-free timing. |
| Industrial PLC Data Logging | Radar Signal Processing Buffer |
|
Use Scenario: Cyclic acquisition and timestamped storage of sensor data streams in programmable logic controllers. IC Role / Device Role / Timing Role: Deterministic-access scratchpad memory for real-time firmware executing on ARM Cortex-M7 or similar. Use Value: Industrial temperature range (–40°C to +85°C) and dual-supply isolation (VDD/VDDQ) ensure reliability in harsh factory environments. |
Use Scenario: Intermediate buffering of digitized RF samples before FFT computation in phased-array radar front ends. IC Role / Device Role / Timing Role: Low-latency, pipelined memory stage synchronizing ADC output with DSP engine clock domains. Use Value: Pipelined outputs and clock enable (CEN) allow precise synchronization with sampling clocks; ZZ sleep mode reduces standby power during idle intervals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV18-167BZI | 256K × 18-bit organization, 167 MHz max, no JTAG, different pinout (119-ball BGA) | Higher density but narrower bus width; requires PCB redesign and layout changes for 36-bit interface. | Select when 18-bit data path suffices and JTAG is unnecessary; verify thermal performance in industrial ambient. |
| AS7C33128PFSI-166BIN | 128K × 32-bit, 166 MHz, no burst counter or ZBT™, no JTAG, 100-pin TQFP | Lacks zero-turnaround and burst capability; limited to simple random-access use cases without sequential optimization. | Choose for cost-sensitive designs where burst efficiency and bus turnaround elimination are not required. |
Compared with CY7C1356BV18-167BZI and AS7C33128PFSI-166BIN, the 71V3556SA166BQ8 uniquely delivers 128K×36-bit density with ZBT™, 4-word burst, and integrated JTAG-all in a drop-in compatible 100-pin TQFP package-making it optimal for upgrade paths in legacy telecom and networking hardware.
Availability
71V3556SA166BQ8 is available at Aetrix Electronics and suitable for high-speed network switching, telecom line card buffering, industrial PLC data logging, radar signal processing, and JTAG-enabled system validation requiring stable component supply across extended product lifecycles.
Supply support for 71V3556SA166BQ8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V3556SA166BQ8 belongs to IDT's ZBT™ SRAM product line, designed specifically for applications demanding deterministic, low-latency memory access with zero bus turnaround-targeting network infrastructure, telecom equipment, and real-time embedded systems.
FAQ
What is the memory organization and bus width of the 71V3556SA166BQ8?
The 71V3556SA166BQ8 is configured as 128K × 36-bit, providing a total capacity of 4.5 Mbit. It supports a 36-bit data bus with four 9-bit byte lanes (I/O0–I/O31 plus I/OP1–I/OP4), enabling full-word or selective byte writes via BW1–BW4 signals. This organization matches common packet-processing and telecom payload widths.
Does the 71V3556SA166BQ8 support burst read and write operations?
Yes, the 71V3556SA166BQ8 supports 4-word burst operations in both linear and interleaved sequences, selected by the LBO pin. Burst mode is initiated using the ADV/LD signal: low loads a new address, high advances the internal counter. Burst reads/writes complete in four consecutive cycles without reissuing addresses, improving throughput in sequential access scenarios.
What is the role of the ZZ pin on the 71V3556SA166BQ8?
The ZZ pin on the 71V3556SA166BQ8 is a synchronous sleep mode input. When driven high, it internally gates the clock and places the device in its lowest power consumption state while guaranteeing data retention. This feature is especially valuable in radar or portable telecom equipment where periodic low-power operation is required without losing buffered content.
Is JTAG boundary scan available on the 71V3556SA166BQ8, and which pins implement it?
Yes, the 71V3556SA166BQ8 includes optional IEEE 1149.1-compliant JTAG boundary scan. In the 100-pin TQFP package, TMS, TDI, TCK, and TDO are assigned to pins R1, P1, R2, and P2 respectively; TRST is not implemented in TQFP but appears in BGA variants. All JTAG pins have internal pull-ups except TRST (pull-up) and ZZ (pull-down).
How does the ZBT™ feature eliminate bus turnaround latency in the 71V3556SA166BQ8?
The ZBT™ (Zero Bus Turnaround) feature in the 71V3556SA166BQ8 removes dead cycles between successive read and write operations by allowing immediate transition from one to the other on the same bus. Unlike conventional SRAMs requiring bus release/reacquisition, the 71V3556SA166BQ8 uses internal pipelining and synchronized control to maintain continuous data flow-achieving 100% bus utilization at 166 MHz.
71V3556SA166BQ8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V3556SA166BQ8 FAQ
1.How can I place an order for 71V3556SA166BQ8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3556SA166BQ8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3556SA166BQ8 reliable?
The price and inventory of 71V3556SA166BQ8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3556SA166BQ8 is usually 5 days.
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Once your 71V3556SA166BQ8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3556SA166BQ8?
For technical support, including 71V3556SA166BQ8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3556SA166BQ8 requirements.
6.How does Aetrix verify that 71V3556SA166BQ8 is sourced from the original manufacturer or authorized distributors?
All 71V3556SA166BQ8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3556SA166BQ8 meets industry standards.
7.What is the process for return or replacement of 71V3556SA166BQ8?
All 71V3556SA166BQ8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3556SA166BQ8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3556SA166BQ8 part is unused and in its original packaging.
Return procedure for 71V3556SA166BQ8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3556SA166BQ8 Tags

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