Renesas 71V3557S75BGG

Overview

71V3557S75BGG from Integrated Device Technology is a 128K × 36-bit (4.5 Mbit), 3.3V synchronous ZBT™ SRAM with flow-through outputs, 7.5 ns clock-to-data access at 100 MHz, and zero bus turnaround for high-speed memory interfacing in network packet buffers and cache controllers.

For engineers reviewing the 71V3557S75BGG datasheet, 71V3557S75BGG pinout, 71V3557S75BGG application, or 71V3557S75BGG equivalent, key selection criteria include burst mode support (linear/interleaved), individual byte write control (BW1–BW4), JTAG boundary scan compliance, sleep mode (ZZ), and TQFP-100 packaging with verified 3.3V core/I/O supply compatibility.

Technical Context

The 71V3557S75BGG implements a synchronous dual-edge-triggered architecture with address/control registers clocked on the rising edge of CLK. Its internal burst counter advances on ADV/LD = HIGH, enabling four-word bursts without external sequencing logic.

It features flow-through output architecture (no output register), asynchronous OE for tri-state control, and three chip enables (CE1, CE2, CE2) supporting depth expansion. The optional IEEE 1149.1 JTAG interface includes TMS, TDI, TCK, TDO, and TRST pins for boundary scan testing.

Key Specifications

Pinout & Package

71V3557S75BGG is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm pitch leads. Pin 1 is located at top-left corner (notch-marked side).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Compared with CY7C1355BV18-100AXC and IDT71V3559S75BGG, the 71V3557S75BGG uniquely delivers 128K×36 organization with integrated JTAG and ZZ sleep - essential for testability and power management in next-gen networking hardware.

Availability

71V3557S75BGG is available at Aetrix Electronics and suitable for packet buffering, DSP caching, industrial data logging, and medical imaging frame storage requiring stable component supply across extended product lifecycles.

Supply support for 71V3557S75BGG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.

The 71V3557S75BGG belongs to IDT's ZBT™ SRAM product line, engineered specifically for high-performance networking and real-time embedded systems demanding zero bus turnaround, deterministic timing, and industrial temperature reliability.

FAQ

What is the memory organization and total capacity of the 71V3557S75BGG?

The 71V3557S75BGG is organized as 128K × 36 bits, delivering a total capacity of 4,718,592 bits (4.5 Mbit). It supports both 36-bit and 18-bit data interfaces via pin-compatible variants, with A0–A16 used for addressing in the 128K×36 mode. This configuration targets high-bandwidth parallel bus applications such as packet buffering and cache subsystems.

Does the 71V3557S75BGG support burst mode, and how is burst order selected?

Yes, the 71V3557S75BGG supports 4-word burst mode using an internal counter. Burst order is selected via the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW configures linear burst (0,1,2,3), while LBO = HIGH selects interleaved burst (0,1,2,3 per IEEE standard). The ADV/LD signal controls counter advancement - HIGH increments the counter, LOW loads a new external address.

What is the function of the ZZ pin on the 71V3557S75BGG, and how does it affect power consumption?

The ZZ pin on the 71V3557S75BGG is a synchronous sleep mode input. When driven HIGH, it gates the internal clock and places the device in its lowest power state while guaranteeing data retention. This feature reduces dynamic power significantly during idle periods - critical for thermally constrained or battery-backed industrial and networking equipment where the 71V3557S75BGG is deployed.

Is the 71V3557S75BGG compatible with JTAG boundary scan, and which pins are required?

Yes, the 71V3557S75BGG includes optional IEEE 1149.1-compliant JTAG boundary scan. Required pins are TMS (Test Mode Select), TDI (Test Data Input), TCK (Test Clock), TDO (Test Data Output), and TRST (optional asynchronous reset). These are dedicated pins in the 100-pin TQFP package and enable board-level interconnect testing without physical probe access.

How does the 71V3557S75BGG implement zero bus turnaround (ZBT™), and what system-level benefit does it provide?

The 71V3557S75BGG implements ZBT™ by eliminating dead cycles between consecutive read and write operations - the bus remains active with no idle clock cycles required for direction change. This is achieved via synchronized control logic and flow-through outputs. System-level benefit: enables sustained 100 MHz throughput in packet-forwarding engines and cache controllers where alternating read/write sequences would otherwise throttle bandwidth by up to 30%.