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Renesas 71V3557S75PFG8

Part No.:
71V3557S75PFG8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V3557S75PFG8.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,359

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Product details

Overview

71V3557S75PFG8 from Integrated Device Technology is a 128K × 36-bit, 4.5 Mbit synchronous ZBT™ SRAM with 3.3V core/I/O supply, 100 MHz operation (7.5 ns clock-to-data), flow-through outputs, and 4-word burst capability. It supports linear/interleaved burst order via LBO pin and eliminates bus turnaround dead cycles between reads and writes. Used in high-speed networking packet buffers and telecom line-card memory subsystems.

For engineers reviewing the 71V3557S75PFG8 datasheet, 71V3557S75PFG8 pinout, 71V3557S75PFG8 application, or 71V3557S75PFG8 equivalent, key selection criteria include ZBT™ zero-turnaround timing, TQFP-100 packaging, JTAG IEEE 1149.1 support, individual byte write enables (BW1–BW4), and synchronous chip enable architecture with CE1/CE2/CE2 logic.

Technical Context

The 71V3557S75PFG8 implements a synchronous dual-edge-triggered address/control register interface with flow-through output path-no output data register-enabling deterministic 1-cycle read latency after address load. Its internal burst counter advances on ADV/LD = HIGH and loads new addresses on ADV/LD = LOW, with burst sequence controlled by static LBO pin level.

It features three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion, Clock Enable (CEN) to suspend all synchronous operations without affecting output state, and optional boundary-scan JTAG (TMS/TDI/TCK/TDO/TRST) compliant with IEEE 1149.1. Sleep mode (ZZ) gates internal clock and reduces power while retaining data.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36 bits (4.5 Mbit); supports 256K × 18 via pin-compatible variant
Clock Frequency 100 MHz maximum - enables 10 ns cycle time for high-throughput burst transfers
Access Time 7.5 ns clock-to-data - defines minimum latency from CLK rise to valid I/O output
Supply Voltage VDD = VDDQ = 3.3 V ±5% - requires separate 3.3V core and I/O rails
Burst Length 4-word fixed burst - reduces address bus traffic during sequential accesses
Byte Write Control BW1–BW4 active-low enables - allows independent 9-bit byte writes without masking logic
Operating Temperature –40°C to +85°C industrial grade - qualified for embedded telecom and industrial control

Pinout & Package

71V3557S75PFG8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm. Pin 1 marked by dot; top-side marking includes "71V3557S75PFG8" and date code.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs Synchronous inputs latched on rising CLK edge when ADV/LD = LOW and chip enabled
CE1, CE2, CE2 Chip Enables Three-input enable logic: CE1 = L, CE2 = L, CE2 = H selects device; any violation deselects in one cycle
R/W Read/Write Control Synchronous signal defining access type; determines direction of I/O[0:31]/I/OP[1:4] one cycle later
ADV/LD Advance Burst / Load Address LOW loads external address; HIGH increments internal burst counter - controls burst sequencing
LBO Linear/Interleaved Burst Order Static input: LOW = linear (0,1,2,3), HIGH = interleaved (0,2,1,3) - must remain stable during operation
BW1–BW4 Byte Write Enables Active-low per-byte controls for 9-bit segments; ignored during reads; required valid on burst write cycles
CLK System Clock Input Rising-edge-triggered master clock; all synchronous timing referenced to this edge
OE Asynchronous Output Enable Active-low; tri-states I/O pins immediately - no setup/hold relative to CLK required
ZZ Sleep Mode Input Active-high synchronous input that gates internal clock and minimizes power while retaining memory contents
I/O0–I/O31, I/OP1–I/OP4 Data I/O 36-bit bidirectional bus; input path registered, output path flow-through (no output register)
VDD, VDDQ, VSS Power/Ground VDD = 3.3V core supply; VDDQ = 3.3V I/O supply; VSS = common ground - decoupling required per JEDEC layout guidelines
TMS, TDI, TCK, TDO, TRST JTAG Boundary Scan IEEE 1149.1-compliant test interface; TRST optional asynchronous reset; internal pull-ups on TMS/TDI/TCK

Key Features

Feature Design Value
ZBT™ Zero Bus Turnaround Eliminates dead cycles between read/write transitions - enables back-to-back memory accesses without bus idle time
Flow-Through Outputs No output register; data appears on I/O bus one clock cycle after read initiation - simplifies timing closure in high-speed designs
4-Word Burst with Selectable Order Reduces address bus bandwidth by 75% for sequential access; LBO pin selects linear or interleaved addressing pattern
Individual Byte Write (BW1–BW4) Enables partial-word writes without external byte-lane gating - supports efficient protocol header updates and field edits
Three Chip Enables for Depth Expansion Allows stacking multiple devices without external logic - CE1/CE2/CE2 combination supports hierarchical memory mapping
Optional IEEE 1149.1 JTAG Enables boundary-scan testing and in-system programming - TRST optional; internal pull-ups simplify board design

Applications

Packet Buffer Memory Network Processor Interface

Use Scenario: Storing ingress/egress packet headers and payload fragments in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level packet buffer with burst-aligned DMA transfers.

Use Value: 100 MHz clock rate and 4-word burst reduce memory controller overhead by 60% vs. discrete address cycles.

Use Scenario: Interfacing with network processors requiring zero-turnaround memory for descriptor table lookups.

IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic 7.5 ns read access to queue management structures.

Use Value: ZBT™ architecture eliminates inter-access gaps, enabling sustained 800 MB/s throughput at 100 MHz.

Telecom Line Card Buffer Industrial Real-Time Controller Cache

Use Scenario: Temporary storage of voice/data frames in TDM-over-IP gateways operating across –40°C to +85°C.

IC Role / Device Role / Timing Role: Industrial-grade SRAM buffering frame payloads with byte-write granularity for header modification.

Use Value: BW1–BW4 enables selective 9-bit writes to frame headers without full-word overwrite or external masking logic.

Use Scenario: Caching sensor fusion results and motion control command queues in programmable logic controllers.

IC Role / Device Role / Timing Role: Deterministic-access memory supporting hard real-time response under jitter-sensitive interrupt loads.

Use Value: Flow-through outputs guarantee sub-8 ns read latency; ZZ sleep mode cuts standby power to <5 mW during idle intervals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1355BV18-100BGXI 256K × 18 organization, 100 MHz, same TQFP-100 package but no JTAG or ZZ sleep mode Optimized for x18 systems with simpler control; lacks burst order selection and byte-write flexibility Choose when memory width matches 18-bit bus and JTAG/test capability is unnecessary
AS7C31025B-10JIN 128K × 32 organization, 10 ns access, no burst counter or ADV/LD logic; asynchronous OE only Legacy SRAM interface - requires external address sequencing logic for burst-like behavior Choose only for drop-in replacement where ZBT™ and burst features are unused and timing margin permits 2.5 ns slower access

Compared with CY7C1355BV18-100BGXI and AS7C31025B-10JIN, the 71V3557S75PFG8 uniquely delivers 36-bit width with ZBT™ zero-turnaround, selectable burst order, and integrated JTAG - making it optimal for next-generation packet processing where deterministic latency and testability are critical.

Availability

71V3557S75PFG8 is available at Aetrix Electronics and suitable for high-speed networking equipment, telecom infrastructure, industrial PLCs, and real-time embedded controllers requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature operation.

Supply support for 71V3557S75PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and high-performance interconnect solutions for communications and computing markets.

The IDT71V3557 family was designed specifically for zero-turnaround memory subsystems in packet-switched networks, where eliminating bus idle time between read/write operations directly improves system throughput and reduces controller complexity.

FAQ

What is the maximum clock frequency supported by the 71V3557S75PFG8?

The 71V3557S75PFG8 supports a maximum clock frequency of 100 MHz, corresponding to a 10 ns clock period. This is validated across the full industrial temperature range (–40°C to +85°C) and ensures reliable 7.5 ns clock-to-data access time under specified VDD/VDDQ conditions. The 71V3557S75PFG8 achieves this performance using IDT's high-speed CMOS process and flow-through output architecture.

Does the 71V3557S75PFG8 support both linear and interleaved burst sequences?

Yes, the 71V3557S75PFG8 supports both linear and interleaved burst orders via the LBO (Linear/Interleaved Burst Order) pin. When LBO = LOW, the burst sequence follows linear order (0,1,2,3); when LBO = HIGH, it follows interleaved order (0,2,1,3). The LBO pin is static and must remain stable during burst operation - changing it mid-burst may cause undefined address sequencing in the 71V3557S75PFG8.

How does the ZBT™ feature eliminate bus turnaround dead cycles in the 71V3557S75PFG8?

The ZBT™ (Zero Bus Turnaround) feature in the 71V3557S75PFG8 removes dead cycles by allowing immediate transition between read and write operations without bus idle time. This is achieved through separate R/W control and flow-through outputs - the device accepts a new address/control word on the same clock edge that delivers the previous read result, enabling back-to-back accesses. No external turnaround logic is needed in the 71V3557S75PFG8.

Can the 71V3557S75PFG8 be used in systems requiring IEEE 1149.1 boundary-scan testing?

Yes, the 71V3557S75PFG8 includes an optional IEEE 1149.1-compliant JTAG boundary-scan interface with TMS, TDI, TCK, TDO, and optional TRST pins. All JTAG signals have internal pull-ups, simplifying PCB routing. The 71V3557S75PFG8 supports standard boundary-scan instructions including SAMPLE/PRELOAD, EXTEST, and BYPASS - verified in the official IDT documentation for this part number.

What is the function of the ZZ (Sleep Mode) pin on the 71V3557S75PFG8?

The ZZ pin on the 71V3557S75PFG8 is a synchronous active-high input that gates the internal clock and places the device into low-power sleep mode. In this state, dynamic power drops significantly while data retention is guaranteed across the full industrial temperature range. The 71V3557S75PFG8 resumes normal operation synchronously upon ZZ returning LOW, with no reset or initialization sequence required.

71V3557S75PFG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
7.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V3557S75PFG8 FAQ

1.How can I place an order for 71V3557S75PFG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3557S75PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3557S75PFG8 reliable?

The price and inventory of 71V3557S75PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3557S75PFG8 is usually 5 days.

3.What payment methods are accepted for 71V3557S75PFG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3557S75PFG8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V3557S75PFG8?

71V3557S75PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3557S75PFG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3557S75PFG8?

For technical support, including 71V3557S75PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3557S75PFG8 requirements.

6.How does Aetrix verify that 71V3557S75PFG8 is sourced from the original manufacturer or authorized distributors?

All 71V3557S75PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3557S75PFG8 meets industry standards.

7.What is the process for return or replacement of 71V3557S75PFG8?

All 71V3557S75PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3557S75PFG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3557S75PFG8 part is unused and in its original packaging.

Return procedure for 71V3557S75PFG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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