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Renesas 71V3557S80BG

Part No.:
71V3557S80BG
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V3557S80BG.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 119PBGA
Quantity:
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Payment
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Inventory:4,482

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Product details

Overview

71V3557S80BG from Integrated Device Technology is a 128K × 36-bit (4.5 Mbit), 3.3V synchronous ZBT™ SRAM with flow-through outputs, 100 MHz clock operation (7.5 ns clock-to-data access), and zero bus turnaround capability. It supports interleaved or linear 4-word burst reads/writes, individual byte write control (BW1–BW4), and JTAG boundary scan (IEEE 1149.1). Used in high-speed packet buffering and network switch fabric memory subsystems.

For engineers reviewing the 71V3557S80BG datasheet, 71V3557S80BG pinout, 71V3557S80BG application, or 71V3557S80BG equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 3.3V core/I/O supply tolerance, burst counter behavior under ADV/LD control, and sleep mode (ZZ) support for low-power standby states.

Technical Context

The 71V3557S80BG implements a synchronous dual-register architecture: address/control signals are latched on the rising edge of CLK when CEN is low and chip enables (CE1, CE2, CE2) are asserted; data input is registered while output is flow-through (no output register). Burst sequencing is controlled by LBO and advanced via ADV/LD, enabling deterministic 4-cycle data transfers per address load.

Its ZBT™ feature eliminates dead cycles between read/write transitions by allowing immediate bus direction reversal without wait states. The device integrates a JTAG TAP controller with optional TRST, supporting IEEE 1149.1 boundary scan for production test - all synchronized to CLK except OE (asynchronous) and TRST (optional asynchronous reset).

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128K × 36-bit (4.5 Mbit); supports 256K × 18-bit configuration via pin strapping
Clock Frequency100 MHz maximum; enables 7.5 ns clock-to-data access time for real-time buffering
Supply VoltagesVDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate power domains reduce noise coupling
Burst Capability4-word burst (linear or interleaved); LBO pin selects sequence order; ADV/LD controls load/advance
Byte Write ControlBW1–BW4 enable independent 9-bit byte writes; allows partial-word updates without read-modify-write
Operating Temperature–40°C to +85°C (industrial grade); validated for embedded telecom and industrial control environments
Sleep ModeZZ pin (active-high) gates internal clock and reduces power consumption while retaining data

Pinout & Package

71V3557S80BG is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 1 is located at top-left corner (marking dot adjacent), with pins numbered counter-clockwise.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address InputsSynchronous inputs latched on rising CLK edge; A0–A16 used for 128K×36, A17 unused in this config
CE1, CE2, CE2Chip EnablesCE1/CE2 active-low, CE2 active-high; any deassertion initiates one-cycle deselect (tri-state I/O)
R/WRead/Write ControlSynchronous signal defining cycle type; determines data direction one clock cycle after load
ADV/LDAddress Load / Burst AdvanceLow = load new external address; High = increment internal burst counter; critical for burst sequencing
LBOBurst Order SelectStatic input: Low = linear burst (0,1,2,3), High = interleaved (0,2,1,3); must remain stable during operation
ZZSleep Mode EnableActive-high synchronous input; gates CLK internally, retains memory contents at minimal power
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional bus; flow-through outputs eliminate OE timing dependency; I/OPx are parity bits
TMS, TDI, TCK, TDO, TRSTJTAG InterfaceIEEE 1149.1-compliant test access port; TRST optional asynchronous reset; all signals synchronous except TRST

Key Features

FeatureDesign Value
ZBT™ Zero Bus TurnaroundEliminates dead cycles between consecutive read/write operations, enabling continuous high-bandwidth data streaming
Flow-Through OutputsRemoves need for external OE timing control; output data appears one clock cycle after read command with no additional latency
4-Word Burst with Configurable OrderReduces address bus traffic by 75% per burst; LBO pin allows runtime selection of linear vs. interleaved addressing
Individual Byte Write (BW1–BW4)Enables precise 9-bit sub-word writes without disturbing adjacent bytes, critical for protocol header manipulation
Integrated JTAG Boundary ScanSupports IEEE 1149.1 for interconnect testing and system-level diagnostics without requiring additional test hardware
Synchronous Sleep Mode (ZZ)Reduces dynamic power by gating internal clock while preserving data integrity - essential for power-managed systems

Applications

Network Packet BufferingTelecom Switch Fabric Memory

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions.

IC Role / Device Role / Timing Role: High-speed, low-latency buffer memory interfacing directly with MAC and switching fabric logic.

Use Value: ZBT™ timing and 100 MHz operation sustain line-rate throughput for 1 Gbps+ interfaces without pipeline stalls.

Use Scenario: Holding cell/packet descriptors and payload fragments in ATM or MPLS switching engines.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as descriptor cache and temporary payload store with deterministic burst access.

Use Value: 4-word burst and flow-through outputs minimize arbitration overhead and maximize fabric utilization efficiency.

Industrial PLC Data LoggingMedical Imaging Frame Store

Use Scenario: Capturing sensor telemetry and control state snapshots at deterministic intervals in programmable logic controllers.

IC Role / Device Role / Timing Role: Local high-reliability memory for timestamped process data with guaranteed retention in ZZ sleep mode.

Use Value: Industrial temperature range (–40°C to +85°C) and synchronous sleep ensure robust operation in uncontrolled cabinet environments.

Use Scenario: Temporary storage of uncompressed DICOM image tiles during real-time ultrasound or MRI reconstruction.

IC Role / Device Role / Timing Role: Low-latency frame buffer feeding FPGA-based image processing pipelines.

Use Value: 36-bit wide interface and 7.5 ns clock-to-data access enable pixel-aligned streaming without FIFO bottlenecks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1355BV18-100BZI128K × 18-bit (2.25 Mbit), 100 MHz, 3.3V; no ZBT™, uses pipelined outputs instead of flow-throughLower density and narrower bus; requires external OE management and suffers bus turnaround penaltySelect only if 18-bit interface suffices and ZBT™ timing is not required for system-level throughput targets
AS7C3256B-10JIN32K × 8-bit (256 Kbit), 10 ns async access; asynchronous SRAM, no burst, no JTAG, no sleep modeAsynchronous interface limits max system clock synchronization; lacks burst, ZBT™, and diagnostic featuresConsider only for legacy designs where synchronous timing and advanced features are unnecessary

Compared with CY7C1355BV18-100BZI and AS7C3256B-10JIN, the 71V3557S80BG delivers higher bandwidth via 36-bit ZBT™ operation, deterministic burst control, and integrated JTAG - making it uniquely suited for modern high-speed packet-processing architectures requiring zero-wait-state memory access.

Availability

71V3557S80BG is available at Aetrix Electronics and suitable for network packet buffering, telecom switch fabric memory, and industrial PLC data logging requiring stable component supply across extended product lifecycles.

Supply support for 71V3557S80BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT) is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.

The 71V3557S80BG belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency, high-throughput memory subsystems in networking and telecom infrastructure where deterministic burst access and bus turnaround elimination are critical.

FAQ

What is the memory organization and density of the 71V3557S80BG?

The 71V3557S80BG is organized as 128K × 36 bits, delivering 4.5 Mbit (4,718,592-bit) total capacity. It supports an alternative 256K × 18-bit configuration via pin strapping, maintaining identical timing and feature set. This dual-configuration flexibility allows system designers to optimize bus width versus depth based on controller interface requirements without changing the 71V3557S80BG footprint or firmware.

Does the 71V3557S80BG support true zero bus turnaround (ZBT™) operation?

Yes, the 71V3557S80BG implements ZBT™ (Zero Bus Turnaround) functionality, eliminating dead cycles between consecutive read and write operations. This is achieved through its synchronous dual-register architecture and flow-through outputs, allowing immediate bus direction reversal on the next clock edge. Verified timing diagrams confirm no wait states are inserted during read-to-write or write-to-read transitions - a key differentiator from standard synchronous SRAMs like the AS7C3256B-10JIN.

What package type and pin count does the 71V3557S80BG use?

The 71V3557S80BG uses a JEDEC-standard 100-pin thin quad flatpack (TQFP) package, measuring 14 mm × 20 mm with 0.5 mm lead pitch. Pin 1 is marked by a dot in the top-left corner, and the pinout includes dedicated address (A0–A17), control (CE1/CE2/CE2, R/W, ADV/LD, LBO, ZZ), data (I/O0–I/O31, I/OP1–I/OP4), and JTAG (TMS/TDI/TCK/TDO/TRST) terminals - fully documented in the IDT DSC-5282 datasheet.

How does the burst counter operate in the 71V3557S80BG?

The 71V3557S80BG's burst counter advances on each rising CLK edge when ADV/LD is high, generating four sequential addresses per initial load. Burst order (linear or interleaved) is selected by the static LBO pin. During burst reads/writes, data transfers occur one cycle after the counter advances - ensuring predictable 4-word sequences without external address generation. The counter wraps automatically after the fourth word, enabling seamless streaming.

Is JTAG boundary scan supported on the 71V3557S80BG, and what signals are required?

Yes, the 71V3557S80BG includes IEEE 1149.1-compliant JTAG boundary scan. Required signals are TMS (Test Mode Select), TDI (Test Data In), TCK (Test Clock), TDO (Test Data Out), and optional TRST (JTAG Reset). All JTAG pins are synchronous to CLK except TRST, which is asynchronous. The TAP controller is fully integrated and functional in both commercial and industrial temperature grades - confirmed in the DSC-5282 datasheet section "Functional Block Diagram" and "Pin Definitions".

71V3557S80BG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V3557S80BG FAQ

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The price and inventory of 71V3557S80BG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3557S80BG is usually 5 days.

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5.How can I obtain technical support or documentation for 71V3557S80BG?

For technical support, including 71V3557S80BG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3557S80BG requirements.

6.How does Aetrix verify that 71V3557S80BG is sourced from the original manufacturer or authorized distributors?

All 71V3557S80BG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3557S80BG meets industry standards.

7.What is the process for return or replacement of 71V3557S80BG?

All 71V3557S80BG units undergo pre-shipment inspection (PSI). If there is an issue with 71V3557S80BG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3557S80BG part is unused and in its original packaging.

Return procedure for 71V3557S80BG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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