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Renesas 71V3557S80PFGI

Part No.:
71V3557S80PFGI
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V3557S80PFGI.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,674

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Product details

Overview

71V3557S80PFGI from Integrated Device Technology is a 128K × 36-bit (4.5 Mbit), 3.3V synchronous ZBT™ SRAM with flow-through outputs, 100 MHz clock speed, 7.5 ns clock-to-data access, and linear/interleaved 4-word burst capability. It serves as high-bandwidth buffer memory in network packet processors and telecom line cards requiring zero bus turnaround between read/write cycles.

For engineers reviewing the 71V3557S80PFGI datasheet, 71V3557S80PFGI pinout, 71V3557S80PFGI application, or 71V3557S80PFGI equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, industrial temperature support (–40°C to +85°C), and JTAG boundary-scan testability for production validation.

Technical Context

The 71V3557S80PFGI implements a synchronous dual-edge-triggered architecture with registered address/control inputs and unregistered (flow-through) data outputs. Its internal burst counter advances on ADV/LD = HIGH, supporting both linear and interleaved sequences selected by the static LBO pin.

Three chip enables (CE1, CE2, CE2) provide flexible depth expansion, while CEN suspends all synchronous operation without affecting output state. The device integrates IEEE 1149.1-compliant JTAG for boundary-scan testing, with optional TRST and dedicated TMS/TDI/TCK/TDO pins.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128K × 36-bit (4.5 Mbit); supports 256K × 18-bit via pin-compatible variant
Clock Frequency100 MHz - enables 10 ns cycle time for high-throughput buffering in packet-switching ASIC interfaces
Access Time7.5 ns clock-to-data - guarantees deterministic read latency critical for real-time traffic shaping
Supply VoltageVDD = 3.3 V ±5%, VDDQ = 3.3 V ±5% - requires separate core/I/O rail regulation per JEDEC spec
Burst Mode4-word burst (linear or interleaved) - reduces address bus overhead by 75% per memory transaction
Operating Temperature–40°C to +85°C - qualified for industrial-grade telecom and base station equipment
JTAG SupportIEEE 1149.1-compliant boundary scan - enables automated PCB test coverage without physical probe access

Pinout & Package

71V3557S80PFGI is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 1 marked with dot; top-side marking includes "71V3557S80PFGI" and date code.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address InputsSynchronous inputs latched on rising CLK edge when ADV/LD = LOW and chip enabled
CE1, CE2, CE2Chip EnablesCE1/CE2 active-low; CE2 active-high - three-signal decode allows hierarchical memory banking
R/WRead/Write ControlSynchronous signal defining load-cycle direction; determines burst mode behavior at first address
ADV/LDAdvance Burst / Load AddressLOW loads external address; HIGH increments internal burst counter - enables seamless burst sequencing
LBOLinear/Interleaved Burst OrderStatic input selecting burst pattern; must remain stable during operation to avoid sequence corruption
ZZSleep Mode InputActive-HIGH synchronous entry into low-power retention mode; data preserved, clock gated internally
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional flow-through bus; no output register - eliminates output timing skew vs. registered SRAMs
TMS, TDI, TCK, TDO, TRSTJTAG Test InterfaceIEEE 1149.1 boundary-scan chain - supports production ICT and interconnect verification

Key Features

FeatureDesign Value
ZBT™ Zero Bus TurnaroundEliminates dead cycles between consecutive reads/writes - sustains full 100 MHz throughput without bus idle periods
Flow-Through Output ArchitectureUnregistered outputs reduce read latency by ~2 ns vs. pipelined SRAMs - critical for latency-sensitive packet buffering
Individual Byte Write (BW1–BW4)Four independent 9-bit write masks - enables partial-word updates without read-modify-write, preserving adjacent data
Asynchronous OE with Tri-State HoldOE can be tied LOW permanently; outputs remain valid during deselect - simplifies control logic in burst-heavy systems
Three-Chip-Enable Depth ExpansionCE1/CE2/CE2 decoding supports up to 8× depth stacking without external logic - reduces BOM count in large memory banks

Applications

Packet Buffering in Switch ASICsTelecom Line Card Data Buffers

Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: High-speed, low-latency shared memory buffer interfacing directly with switch fabric controller.

Use Value: ZBT™ timing ensures back-to-back read/write bursts sustain 800 MB/s bandwidth without pipeline stalls.

Use Scenario: Temporary storage of voice-over-IP frames and signaling messages in carrier-grade DSLAMs.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as jitter buffer and frame reassembly memory.

Use Value: Industrial temperature rating (–40°C to +85°C) and flow-through outputs guarantee deterministic delay under thermal stress.

Baseband Processor Memory CacheIndustrial PLC Real-Time FIFO

Use Scenario: Holding intermediate FFT and channel estimation results in LTE femtocell baseband processors.

IC Role / Device Role / Timing Role: Low-latency scratchpad memory co-located with DSP cores for burst-intensive compute kernels.

Use Value: 4-word burst mode cuts address bus activity by 75%, reducing EMI and routing congestion on dense PCBs.

Use Scenario: Buffering sensor acquisition streams and motion control commands in programmable logic controllers.

IC Role / Device Role / Timing Role: Deterministic FIFO memory with guaranteed worst-case access time for hard real-time scheduling.

Use Value: Sleep mode (ZZ) enables <100 µA standby current - extends uptime in battery-backed industrial edge nodes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1371BV33-100AXC128K × 32-bit organization; no ZBT™ feature; 100 MHz max but 8 ns access; QDR-II interfaceDesigned for QDR-II protocol stack; lacks burst counter and ADV/LD control; requires external sequencer logicSelect only if QDR-II compatibility is required and ZBT™ timing is not critical
AS7C33128PFSIG128K × 36-bit; asynchronous interface; 15 ns access; no burst, no JTAG, no sleep modeLegacy async SRAM footprint; no clock domain control; unsuitable for burst-heavy or test-critical designsConsider only for cost-sensitive, non-burst, non-industrial applications where timing margin >7.5 ns exists

Compared with CY7C1371BV33-100AXC and AS7C33128PFSIG, the 71V3557S80PFGI uniquely delivers ZBT™-optimized zero-turnaround timing, integrated burst sequencing, and IEEE 1149.1 testability - making it the only choice for high-reliability, high-throughput synchronous memory subsystems.

Availability

71V3557S80PFGI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and network equipment requiring stable component supply across extended product lifecycles.

Supply support for 71V3557S80PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications and computing markets.

The 71V3557S80PFGI belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency memory buffering in high-speed packet processing and switching applications where bus efficiency and deterministic timing are mandatory.

FAQ

What is the maximum operating frequency of the 71V3557S80PFGI?

The 71V3557S80PFGI operates at a maximum clock frequency of 100 MHz, corresponding to a 10 ns clock period. This is validated under industrial temperature conditions (–40°C to +85°C) and 3.3 V ±5% supply, with guaranteed 7.5 ns clock-to-data access time for read operations. The device meets this specification using its synchronous flow-through output architecture without pipeline staging.

Does the 71V3557S80PFGI support both linear and interleaved burst modes?

Yes, the 71V3557S80PFGI supports both linear and interleaved 4-word burst sequences. The LBO (Linear/Interleaved Burst Order) pin selects the mode: LBO = LOW enables linear addressing (A0, A0+1, A0+2, A0+3), while LBO = HIGH enables interleaved order (A0, A0+2, A0+1, A0+3). This selection is static and must remain stable during burst execution to prevent address misalignment.

How does the ZBT™ feature improve system performance in the 71V3557S80PFGI?

The ZBT™ (Zero Bus Turnaround) feature in the 71V3557S80PFGI eliminates dead cycles between consecutive read and write operations. Unlike standard synchronous SRAMs that require bus idle time for direction change, the 71V3557S80PFGI allows immediate back-to-back read/write bursts - sustaining full 100 MHz throughput and enabling efficient use of shared data buses in packet processors and switch fabrics.

What is the function of the ZZ pin on the 71V3557S80PFGI?

The ZZ pin on the 71V3557S80PFGI is a synchronous sleep mode input. When asserted HIGH, it gates the internal clock and places the device in its lowest power consumption state while retaining memory contents. Data retention is guaranteed across the full industrial temperature range (–40°C to +85°C), and wake-up occurs synchronously on the next valid clock edge after ZZ returns LOW.

Is JTAG boundary-scan supported on the 71V3557S80PFGI, and what pins are used?

Yes, the 71V3557S80PFGI includes IEEE 1149.1-compliant JTAG boundary-scan functionality. It uses dedicated pins TMS, TDI, TCK, TDO, and optional TRST (active-low asynchronous reset). These signals are routed to the 100-pin TQFP package per the official pinout - TMS (Pin 89), TDI (Pin 88), TCK (Pin 87), TDO (Pin 86), TRST (Pin 85) - enabling full interconnect test coverage without modifying the 71V3557S80PFGI's functional operation.

71V3557S80PFGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V3557S80PFGI FAQ

1.How can I place an order for 71V3557S80PFGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3557S80PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3557S80PFGI reliable?

The price and inventory of 71V3557S80PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3557S80PFGI is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3557S80PFGI transactions.

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71V3557S80PFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3557S80PFGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3557S80PFGI?

For technical support, including 71V3557S80PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3557S80PFGI requirements.

6.How does Aetrix verify that 71V3557S80PFGI is sourced from the original manufacturer or authorized distributors?

All 71V3557S80PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3557S80PFGI meets industry standards.

7.What is the process for return or replacement of 71V3557S80PFGI?

All 71V3557S80PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V3557S80PFGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3557S80PFGI part is unused and in its original packaging.

Return procedure for 71V3557S80PFGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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