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Renesas 71V3557S80PFGI8
- Part No.:
- 71V3557S80PFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V3557S80PFGI8.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,325
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Product details
Overview
71V3557S80PFGI8 from Integrated Device Technology is a 128K × 36-bit (4.5 Mbit), 3.3V synchronous ZBT™ SRAM with flow-through outputs, 100 MHz clock speed (7.5 ns clock-to-data access), and zero bus turnaround architecture. It supports interleaved/linear 4-word burst reads/writes, individual byte write control (BW1–BW4), and JTAG boundary scan (IEEE 1149.1). Used in high-speed packet buffering and cache subsystems of network switches and telecom line cards.
For engineers reviewing the 71V3557S80PFGI8 datasheet, 71V3557S80PFGI8 pinout, 71V3557S80PFGI8 application, or 71V3557S80PFGI8 equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 3.3V core/I/O supply tolerance, burst counter synchronization with ADV/LD, and sleep mode (ZZ) support for power-sensitive embedded memory systems.
Technical Context
The 71V3557S80PFGI8 implements a synchronous dual-edge-triggered address/control register pipeline with flow-through output path-no output data register-enabling deterministic 1-cycle latency from address load to data valid. Its burst counter advances on ADV/LD = HIGH and loads new addresses on ADV/LD = LOW, with LBO pin selecting linear or interleaved sequence.
Three chip enables (CE1, CE2, CE2) provide flexible depth expansion; CEN suspends all synchronous operation without affecting output state; OE remains asynchronous for fast output disable. The device integrates IEEE 1149.1 JTAG test logic with optional TRST, supporting boundary scan during system-level validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 256K × 18-bit via pin-compatible variant |
| Clock Frequency | 100 MHz maximum; enables 7.5 ns clock-to-data access time for real-time buffering |
| Supply Voltage | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); decoupling required per JEDEC TQFP layout |
| Burst Capability | 4-word burst (interleaved or linear); reduces address bus cycles by 75% in sequential access patterns |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for sustained operation in telecom chassis environments |
| Package | 100-pin TQFP (14 mm × 20 mm, 0.5 mm pitch); JEDEC standard footprint with thermal pad option |
| Power Management | ZZ pin enables synchronous sleep mode; guarantees data retention at minimum VDD current |
Pinout & Package
71V3557S80PFGI8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm lead pitch, with exposed thermal pad (PFG suffix). Pin 1 marked by dot; top-side marking includes "71V3557S80PFGI8" and date code.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Input | Synchronous 18-bit address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CE1, CE2, CE2 | Chip Enable | CE1/CE2 active-low, CE2 active-high; any false condition initiates one-cycle deselect (I/O tri-state) |
| R/W | Read/Write Control | Synchronous signal defining cycle type; determines data direction one clock cycle after load |
| ADV/LD | Burst Address Control | LOW = load new external address; HIGH = increment internal burst counter; defines burst sequence timing |
| LBO | Burst Order Select | Static input: LOW = linear burst (0,1,2,3), HIGH = interleaved (0,2,1,3); must not toggle mid-burst |
| BW1–BW4 | Byte Write Enable | Active-low per-9-bit byte controls; enables partial writes without masking entire 36-bit word |
| CLK | System Clock | Rising-edge synchronous reference for all registers except OE and TRST; no internal PLL |
| OE | Output Enable | Asynchronous; drives I/O pins to high-Z when HIGH-no timing dependency on CLK |
| ZZ | Sleep Mode | Active-high synchronous input; gates internal CLK and reduces IDD to retention level while preserving data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional bus; inputs registered on CLK rise, outputs flow-through (no register delay) |
| TMS, TDI, TCK, TDO, TRST | JTAG Interface | IEEE 1149.1 compliant test access port; TRST optional asynchronous reset (internal pull-up) |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between read/write transitions-enables back-to-back memory accesses without bus idle time |
| Flow-Through Outputs | No output register; data appears on I/O bus one clock cycle after address/control latch-reduces read latency vs. registered-output SRAMs |
| 4-Word Burst Counter | Hardware-based counter increments automatically on ADV/LD = HIGH; supports both linear and interleaved sequences per LBO |
| Individual Byte Write (BW1–BW4) | Enables granular 9-bit writes without external byte-lane gating-critical for protocol header updates in packet buffers |
| Three Chip Enables | Allows seamless depth expansion across multiple devices using CE1/CE2/CE2 logic-no external decode logic required |
| Optional JTAG Boundary Scan | Fully compliant IEEE 1149.1 interface with TAP controller; supports interconnect testing and in-system programming |
Applications
| Network Packet Buffering | Telecom Line Card Cache |
|---|---|
|
Use Scenario: High-throughput Ethernet switch ASIC interfaces with 10 Gbps+ line rates requiring low-latency, burst-capable memory for frame queuing and scheduling. IC Role / Device Role / Timing Role: Primary buffer SRAM providing zero-turnaround read/write cycles to match ASIC's internal pipeline timing. Use Value: 7.5 ns clock-to-data access and 4-word burst reduce average memory access latency by 40% vs. conventional sync SRAMs in FIFO applications. |
Use Scenario: SONET/SDH add-drop multiplexers performing real-time payload reassembly and overhead processing in carrier-grade optical transport equipment. IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via ZBT™ architecture-enables concurrent read/write arbitration without external glue logic. Use Value: Synchronous sleep mode (ZZ) cuts standby power by >65% during low-traffic intervals while retaining full packet context. |
| Industrial Control Data Logging | Avionics Data Acquisition Buffer |
|
Use Scenario: Ruggedized PLC modules capturing sensor streams (e.g., vibration, temperature) at 100 kHz sample rates with deterministic timestamping. IC Role / Device Role / Timing Role: High-reliability SRAM acting as circular buffer with burst writes aligned to ADC DMA triggers. Use Value: Industrial temperature range (–40°C to +85°C) and 3.3V supply tolerance ensure stable operation in unregulated field enclosures. |
Use Scenario: Flight data recorder subsystems acquiring ARINC 429/664 avionics bus traffic under DO-254 safety-critical constraints. IC Role / Device Role / Timing Role: JTAG-enabled SRAM supporting structural test coverage and configuration verification per RTCA DO-254 Annex A. Use Value: IEEE 1149.1 boundary scan allows 100% interconnect test coverage without physical probe access-reducing certification effort. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371DV33-100BGXI | 128K × 32-bit (4 Mbit), 100 MHz, QDR-II architecture with separate read/write ports; no ZBT™ or burst counter | Requires external arbitration logic for read/write coexistence; suited for dual-ported buffer designs where simultaneous access is mandatory | Select when true dual-port behavior outweighs ZBT™ latency benefits and board space permits larger BGA package |
| AS7C3128PFS-10BIN | 128K × 32-bit (4 Mbit), 100 MHz, standard sync SRAM with registered outputs; no burst, no JTAG, no ZZ pin | Lacks flow-through outputs and burst capability-adds 1-cycle read latency and requires external burst logic | Choose for cost-sensitive industrial applications where ZBT™ and JTAG are non-essential and PCB layout favors pin-compatible drop-in |
Compared with CY7C1371DV33-100BGXI and AS7C3128PFS-10BIN, the 71V3557S80PFGI8 uniquely delivers zero-turnaround timing with integrated burst sequencing and IEEE 1149.1 testability-making it optimal for latency-constrained, safety-auditable, and high-density telecom memory subsystems.
Availability
71V3557S80PFGI8 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card caching, and industrial data logging requiring stable component supply across extended product lifecycles.
Supply support for 71V3557S80PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications and computing infrastructure.
The 71V3557S80PFGI8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for high-speed networking and telecom equipment where deterministic latency, burst efficiency, and JTAG testability are critical design requirements.
FAQ
What is the maximum clock frequency supported by the 71V3557S80PFGI8?
The 71V3557S80PFGI8 supports a maximum clock frequency of 100 MHz, corresponding to a guaranteed 7.5 ns clock-to-data access time under industrial temperature conditions (–40°C to +85°C) and 3.3 V ±5% supply. This timing is validated across process, voltage, and temperature corners per IDT DSC-5282 specification.
Does the 71V3557S80PFGI8 support both linear and interleaved burst modes?
Yes, the 71V3557S80PFGI8 supports both linear and interleaved 4-word burst sequences via the LBO (Linear/Interleaved Burst Order) pin. When LBO = LOW, the burst order is linear (0,1,2,3); when LBO = HIGH, it is interleaved (0,2,1,3). LBO is a static input and must remain stable during burst operation.
How does the ZBT™ feature eliminate dead cycles in the 71V3557S80PFGI8?
The ZBT™ (Zero Bus Turnaround) feature in the 71V3557S80PFGI8 eliminates dead cycles by allowing immediate transition between read and write operations without bus idle time. This is achieved through separate address/control registration and flow-through outputs-enabling back-to-back cycles with no turnaround penalty.
What is the function of the ZZ pin on the 71V3557S80PFGI8?
The ZZ pin on the 71V3557S80PFGI8 is an active-high synchronous sleep mode input. When asserted, it gates the internal clock and reduces core current to data-retention levels while preserving all stored memory contents. ZZ operates synchronously with CLK and requires proper setup/hold timing relative to the clock edge.
Is JTAG boundary scan supported on the 71V3557S80PFGI8, and which pins are used?
Yes, the 71V3557S80PFGI8 includes optional IEEE 1149.1-compliant JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and optional TRST (with internal pull-up) implement the test access port. JTAG functionality is present in the "S" version per IDT documentation and does not require SA suffix for basic boundary scan support.
71V3557S80PFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V3557S80PFGI8 FAQ
1.How can I place an order for 71V3557S80PFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3557S80PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3557S80PFGI8 reliable?
The price and inventory of 71V3557S80PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3557S80PFGI8 is usually 5 days.
3.What payment methods are accepted for 71V3557S80PFGI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3557S80PFGI8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V3557S80PFGI8?
71V3557S80PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3557S80PFGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3557S80PFGI8?
For technical support, including 71V3557S80PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3557S80PFGI8 requirements.
6.How does Aetrix verify that 71V3557S80PFGI8 is sourced from the original manufacturer or authorized distributors?
All 71V3557S80PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3557S80PFGI8 meets industry standards.
7.What is the process for return or replacement of 71V3557S80PFGI8?
All 71V3557S80PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3557S80PFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3557S80PFGI8 part is unused and in its original packaging.
Return procedure for 71V3557S80PFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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