Renesas 71V3557S85BGI8
- Part No.:
- 71V3557S85BGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V3557S85BGI8.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3557S85BGI8 from Integrated Device Technology is a 128K × 36-bit (4.5 Mbit), 3.3V synchronous ZBT™ SRAM with flow-through outputs, 100 MHz operation (7.5 ns clock-to-data access), and zero bus turnaround architecture. It supports interleaved/linear 4-word burst reads/writes, individual byte write control (BW1–BW4), and JTAG boundary scan (IEEE 1149.1). Used in high-speed packet buffering and network switch fabric memory subsystems.
For engineers reviewing the 71V3557S85BGI8 datasheet, 71V3557S85BGI8 pinout, 71V3557S85BGI8 application, or 71V3557S85BGI8 equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 3.3V core/I/O supply tolerance, burst counter synchronization with ADV/LD, and sleep mode (ZZ) support for power-sensitive telecom line cards.
Technical Context
The 71V3557S85BGI8 implements a synchronous dual-edge-triggered address/control register interface with flow-through output path-no output register-enabling deterministic 1-cycle read latency after address load. Its internal burst counter advances on ADV/LD = HIGH and loads new addresses on ADV/LD = LOW, with LBO pin selecting linear or interleaved sequence order.
Three chip enables (CE1, CE2 active-low; CE2 active-high) enable depth expansion without external logic; CEN suspends all synchronous operation while preserving register state; OE remains asynchronous for fast output disable. The device integrates IEEE 1149.1 JTAG test circuitry with optional TRST and supports guaranteed data retention in ZZ sleep mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 256K × 18-bit via pin-compatible variant |
| Clock Frequency | 100 MHz maximum; enables 10 ns cycle time for high-throughput buffering |
| Access Time | 7.5 ns clock-to-data (tCD); defines minimum read latency from CLK rise to valid I/O |
| Supply Voltage | VDD = VDDQ = 3.3 V ±5%; separate core and I/O rails reduce noise coupling |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus traffic by 75% per burst |
| Operating Temperature | –40°C to +85°C (industrial grade); qualified for base station and router deployment |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); surface-mount compatible with automated assembly |
Pinout & Package
71V3557S85BGI8 is housed in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 1 marked by dot; pins 14, 64, and 66 require VSS connection per latest die revision (pin 64 supports ZZ sleep mode).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Input | 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CE1, CE2, CE2 | Chip Enable | Three independent enables: CE1/CE2 active-low, CE2 active-high; any false condition de-selects device in one cycle |
| R/W | Read/Write Control | Synchronous signal defining cycle type; sampled at rising CLK with ADV/LD = LOW to initiate load operation |
| ADV/LD | Burst Address Control | LOW loads new external address; HIGH increments internal burst counter; determines burst vs. load behavior |
| LBO | Burst Order Select | Static input: LOW = linear burst (0,1,2,3), HIGH = interleaved (0,2,1,3); must remain stable during operation |
| CLK | System Clock | Main timing reference; all synchronous inputs referenced to rising edge; OE is sole asynchronous signal |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional bus; input path registered, output path flow-through (no output register) |
| ZZ | Sleep Mode | Active-high synchronous input; gates internal CLK and reduces power to minimum while retaining data |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between consecutive reads/writes-enables back-to-back memory transactions without wait states |
| 4-Word Burst Counter | Reduces address bus activity by 75% per burst; supports both linear and interleaved sequences via LBO pin |
| Individual Byte Write (BW1–BW4) | Enables selective 9-bit byte writes without masking logic; all BWx can be tied low for full-word writes |
| Internally Synchronized OE | OE is asynchronous but internally synchronized to CLK-prevents metastability and eliminates need for external OE timing control |
| JTAG Boundary Scan (IEEE 1149.1) | Supports production test and board-level diagnostics; includes TMS, TDI, TCK, TDO, and optional TRST |
Applications
| Network Switch Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing packet headers and metadata in multi-gigabit Ethernet switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level packet buffer with ZBT™ enabling immediate read-after-write for header modification. Use Value: 7.5 ns tCD and zero bus turnaround allow real-time packet classification and forwarding at 10 Gbps line rate. |
Use Scenario: Frame buffering in carrier-grade DSLAMs and OLTs requiring industrial temperature operation and long-term reliability. IC Role / Device Role / Timing Role: Synchronous SRAM providing burst-access scratchpad for ATM cell reassembly and QoS scheduling engines. Use Value: 4-word burst mode cuts memory controller overhead by 75%, improving scheduler throughput under heavy traffic load. |
| Baseband Processing Cache | Radar Signal Processing FIFO |
|
Use Scenario: Temporary storage of decoded channel symbols in LTE/5G baseband units before FEC decoding. IC Role / Device Role / Timing Role: Low-power, flow-through SRAM used as ping-pong buffer between FFT and Viterbi blocks with precise clock-domain alignment. Use Value: ZZ sleep mode reduces idle power by >60% during inter-frame gaps while guaranteeing data retention. |
Use Scenario: Real-time buffering of digitized IF samples in phased-array radar receivers prior to DSP correlation. IC Role / Device Role / Timing Role: Synchronous SRAM serving as deep FIFO with deterministic 1-cycle read latency for time-critical pulse compression. Use Value: 100 MHz clock rate and 36-bit bus width support ≥360 MB/s sustained sample streaming without bottleneck. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355KV18-100BZI | 256K × 18-bit, 100 MHz, 3.3V; no ZZ sleep mode; different pinout (119-ball BGA only) | Targeted at space-constrained designs where density > speed; lacks sleep mode for power cycling | Select when footprint allows BGA and sleep mode is unnecessary; verify ADV/LD timing compatibility |
| AS7C3256P-10JIN | 128K × 32-bit, 10 ns access, 3.3V; asynchronous interface; no burst counter or JTAG | Used in legacy control-plane buffers where synchronous timing and testability are not required | Choose only for cost-sensitive, non-burst, non-JTAG applications; requires redesign for ZBT™ timing model |
Compared with CY7C1355KV18-100BZI and AS7C3256P-10JIN, the 71V3557S85BGI8 uniquely delivers ZBT™-optimized timing, integrated JTAG, and industrial-grade sleep mode in a manufacturable TQFP package-critical for next-gen telecom infrastructure where latency, test coverage, and thermal resilience are co-constrained.
Availability
71V3557S85BGI8 is available at Aetrix Electronics and suitable for network switch buffering, telecom line card memory, and baseband processing cache applications requiring stable component supply across extended product lifecycles.
Supply support for 71V3557S85BGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications and computing markets.
The 71V3557S85BGI8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for high-speed networking equipment requiring deterministic latency, zero bus turnaround, and robust industrial temperature operation.
FAQ
What is the maximum operating frequency and corresponding access time for the 71V3557S85BGI8?
The 71V3557S85BGI8 operates up to 100 MHz with a guaranteed clock-to-data access time (tCD) of 7.5 ns. This specification ensures deterministic read latency from CLK rising edge to valid data on I/O pins under industrial temperature conditions (–40°C to +85°C) and 3.3 V ±5% supply.
Does the 71V3557S85BGI8 support burst read and write operations, and how is burst order controlled?
Yes, the 71V3557S85BGI8 supports 4-word synchronous burst operations for both reads and writes. Burst order is selected via the LBO pin: LBO = LOW enables linear sequence (0,1,2,3), while LBO = HIGH selects interleaved (0,2,1,3). LBO is static and must remain stable during burst execution.
How does the ZBT™ (Zero Bus Turnaround) feature function in the 71V3557S85BGI8?
ZBT™ in the 71V3557S85BGI8 eliminates dead cycles between consecutive read and write operations by allowing immediate bus direction reversal. Unlike conventional SRAMs requiring turnaround cycles, the 71V3557S85BGI8 permits back-to-back reads and writes with no inserted wait states-critical for high-throughput packet buffering.
What is the role of the ZZ pin on the 71V3557S85BGI8, and what power savings does it provide?
The ZZ pin on the 71V3557S85BGI8 enables synchronous sleep mode: when asserted HIGH, it gates the internal clock and reduces dynamic power consumption to minimum while guaranteeing full data retention. Power savings exceed 60% during idle periods, validated across the –40°C to +85°C industrial range.
Is JTAG boundary scan supported on the 71V3557S85BGI8, and which pins implement the interface?
Yes, the 71V3557S85BGI8 includes IEEE 1149.1-compliant JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and optional TRST implement the interface. TRST is pull-up internally and may be left floating if unused; all JTAG signals are synchronous and referenced to CLK.
71V3557S85BGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V3557S85BGI8 FAQ
1.How can I place an order for 71V3557S85BGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3557S85BGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3557S85BGI8 reliable?
The price and inventory of 71V3557S85BGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3557S85BGI8 is usually 5 days.
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5.How can I obtain technical support or documentation for 71V3557S85BGI8?
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6.How does Aetrix verify that 71V3557S85BGI8 is sourced from the original manufacturer or authorized distributors?
All 71V3557S85BGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3557S85BGI8 meets industry standards.
7.What is the process for return or replacement of 71V3557S85BGI8?
All 71V3557S85BGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3557S85BGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3557S85BGI8 part is unused and in its original packaging.
Return procedure for 71V3557S85BGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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