Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 71V3558S100PFG8

Part No.:
71V3558S100PFG8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V3558S100PFG8.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,026

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

71V3558S100PFG8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 256K × 18-bit organization (4.5 Mbit), 100 MHz clock speed, 3.5 ns clock-to-data access time, zero bus turnaround architecture, and pipelined outputs in a 100-pin TQFP package. It enables high-throughput memory interfacing in network packet buffers and telecom line cards.

For engineers reviewing the 71V3558S100PFG8 datasheet, 71V3558S100PFG8 pinout, 71V3558S100PFG8 application, or 71V3558S100PFG8 equivalent, key selection criteria include burst mode support (linear/interleaved), individual byte write control (BW1–BW4), three chip enables for depth expansion, JTAG boundary scan capability, and industrial temperature range (–40°C to +85°C) operation.

Technical Context

The 71V3558S100PFG8 implements a fully synchronous, positive-edge-triggered architecture with registered address, data, and control inputs. Its ZBT™ feature eliminates dead cycles between read/write transitions via internal burst counter and ADV/LD-controlled address loading or incrementing.

It supports 4-word burst sequences (linear or interleaved via LBO pin), asynchronous OE for output tri-state control, and optional IEEE 1149.1 JTAG test interface. The device uses separate 3.3V core (VDD) and I/O (VDDQ) supplies with ±5% tolerance and includes sleep mode (ZZ pin) for low-power retention.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 18-bit (4.5 Mbit); supports depth expansion via CE1/CE2/CE2 pins
Max Clock Frequency100 MHz; enables 10 ns clock period for high-speed pipelined memory access
Clock-to-Data Access3.5 ns; defines minimum latency from CLK edge to valid output data
Supply VoltagesVDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; independent core/I/O rails reduce noise coupling
Operating Temperature–40°C to +85°C; qualified for industrial-grade embedded systems and telecom infrastructure
Burst Capability4-word burst (linear or interleaved); reduces address bus traffic and improves throughput in sequential access
Byte Write ControlBW1–BW4 enable per-9-bit-byte writes; allows partial-word updates without read-modify-write overhead

Pinout & Package

Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14, 16, and 66 tolerate VIH-level input without direct VDD connection.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address InputsSynchronous 18-bit address bus; A0–A16 used for 256K×18 configuration; A17 unused
CE1, CE2, CE2Chip EnablesThree independent enables (CE1/CE2 active-low, CE2 active-high); enable depth expansion with no external logic
R/WRead/Write ControlSynchronous signal defining cycle type; sampled at rising CLK edge to initiate read or write two cycles later
ADV/LDAdvance Burst / Load AddressLoads new external address when low; increments internal burst counter when high
LBOLinear/Interleaved Burst OrderStatic input selecting burst sequence; low = linear, high = interleaved; must remain stable during operation
BW1–BW4Byte Write EnablesActive-low per-byte controls for 9-bit segments; all may be tied low for full 18-bit writes
CLKSystem Clock InputPrimary timing reference; all synchronous operations triggered on rising edge
OEOutput EnableAsynchronous control; drives I/O pins to high-impedance when high; may be tied low for always-enabled reads
ZZSleep ModeActive-high synchronous input gating internal clock; retains data while minimizing power consumption
I/O0–I/O15, I/OP1–I/OP2Data I/O18-bit bidirectional data bus (16 data + 2 parity); registered input/output paths ensure timing predictability
VDD, VDDQ, VSSPower/GroundVDD = 3.3V core supply; VDDQ = 3.3V I/O supply; VSS = common ground; decoupling required per JEDEC layout guidelines

Key Features

FeatureDesign Value
ZBTTM ArchitectureEliminates bus turnaround dead cycles between consecutive reads/writes, enabling continuous data flow in burst-mode systems
Pipelined OutputsInternally synchronized output buffer enable removes need for external OE timing control, simplifying system-level timing closure
4-Word Burst CounterReduces address bus activity by 75% during sequential accesses; LBO pin selects linear or interleaved addressing order
Individual Byte WriteEnables precise 9-bit segment updates without disturbing adjacent bytes-critical for packet header manipulation in networking ASICs
Three Chip EnablesSupports seamless memory depth expansion up to 3× without glue logic or address decoding complexity
JTAG Boundary ScanIEEE 1149.1-compliant test interface (optional in "SA" variant); enables board-level interconnect testing and debug visibility

Applications

Packet BufferingTelecom Line Cards

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in switch fabric ASICs.

IC Role / Device Role / Timing Role: High-speed, low-latency dual-port buffer supporting concurrent ingress/egress traffic with zero bus turnaround.

Use Value: 3.5 ns clock-to-data access and 4-word burst mode enable line-rate packet processing at 10 Gbps+ speeds.

Use Scenario: Frame buffering and header processing in OC-192/STM-64 SONET/SDH line interface units.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as temporary storage for ATM cells or GFP frames before serialization.

Use Value: Industrial temperature rating (–40°C to +85°C) and 100 MHz operation ensure reliability in carrier-grade chassis environments.

Network Processor OffloadHigh-Speed Test Equipment

Use Scenario: Accelerating deep packet inspection and pattern matching in network processors.

IC Role / Device Role / Timing Role: Local instruction/data cache supplementing NPU microengines with deterministic access timing.

Use Value: Individual byte write (BW1–BW4) allows atomic update of match result flags without full-word read-modify-write cycles.

Use Scenario: Real-time waveform capture and pattern generation in automated test equipment (ATE).

IC Role / Device Role / Timing Role: High-bandwidth memory buffer synchronizing digitizer DAC outputs with precision timing engines.

Use Value: Pipelined outputs and clock enable (CEN) support glitch-free pause/resume of data streams during test sequence execution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1356BV33-100AXI256K × 18-bit, 100 MHz, but lacks ZBT™ architecture and burst counter; uses standard synchronous SRAM protocolNo zero bus turnaround; requires external logic for burst sequencing; higher latency between read/write transitionsSelect when ZBT™ is not required and legacy compatibility with Cypress timing models is prioritized
AS7C3256B-10JIN256K × 18-bit, 100 MHz, TTL-compatible I/O, no JTAG or ZZ sleep mode; simpler control interfaceMissing ADV/LD, LBO, and byte write granularity; limited to basic load/read/write cyclesChoose for cost-sensitive industrial controllers where burst mode and low-power sleep are unnecessary

Compared with CY7C1356BV33-100AXI and AS7C3256B-10JIN, the 71V3558S100PFG8 delivers superior throughput in burst-intensive applications due to its integrated ZBT™ architecture and programmable burst counter-reducing effective memory latency by up to 40% in packet-forwarding workloads.

Availability

71V3558S100PFG8 is available at Aetrix Electronics and suitable for telecom infrastructure, network test equipment, and industrial control systems requiring stable component supply across extended product lifecycles.

Supply support for 71V3558S100PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing markets.

The 71V3558S100PFG8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency memory interfacing in high-speed packet-switching, baseband processing, and real-time signal acquisition systems.

FAQ

What is the memory organization and total capacity of the 71V3558S100PFG8?

The 71V3558S100PFG8 is configured as 256K × 18-bit, delivering 4,718,592 bits (4.5 Mbit) of synchronous SRAM. This organization supports efficient 18-bit data paths common in telecom DSPs and network processors, and enables straightforward depth expansion using its three chip enable pins (CE1, CE2, CE2). The device does not support width expansion.

Does the 71V3558S100PFG8 support burst mode, and how is it controlled?

Yes, the 71V3558S100PFG8 supports 4-word burst mode via an on-chip counter. Burst behavior is controlled by the ADV/LD pin (low = load new address, high = increment counter) and the LBO pin (low = linear sequence, high = interleaved sequence). The burst order is static and must not change during active operation to prevent address misalignment.

What is the function of the ZZ pin on the 71V3558S100PFG8, and how does it affect power consumption?

The ZZ pin on the 71V3558S100PFG8 is a synchronous sleep mode input. When driven high, it gates the internal clock and reduces dynamic power consumption to its lowest level while guaranteeing data retention. This feature is especially valuable in power-constrained telecom line cards and portable test instrumentation where standby current must be minimized.

How does the ZBTTM feature eliminate dead cycles in the 71V3558S100PFG8?

The ZBTTM (Zero Bus Turnaround) feature in the 71V3558S100PFG8 removes idle cycles between consecutive read and write operations by overlapping bus control transitions internally. Unlike conventional SRAMs that require explicit turnaround time, the 71V3558S100PFG8 uses pipelined registers and burst counter logic to sustain continuous data flow-enabling back-to-back read/write bursts without performance penalty.

Can the 71V3558S100PFG8 operate across industrial temperature ranges, and what are its supply voltage tolerances?

Yes, the 71V3558S100PFG8 is qualified for industrial temperature operation from –40°C to +85°C. Its core supply (VDD) and I/O supply (VDDQ) both accept 3.3 V ±5% (3.135 V to 3.465 V), ensuring robust operation under varying board-level power conditions. This makes it suitable for deployment in uncontrolled environments such as outdoor base stations and factory-floor automation systems.

71V3558S100PFG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V3558S100PFG8 FAQ

1.How can I place an order for 71V3558S100PFG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3558S100PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3558S100PFG8 reliable?

The price and inventory of 71V3558S100PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3558S100PFG8 is usually 5 days.

3.What payment methods are accepted for 71V3558S100PFG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3558S100PFG8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V3558S100PFG8?

71V3558S100PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3558S100PFG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3558S100PFG8?

For technical support, including 71V3558S100PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3558S100PFG8 requirements.

6.How does Aetrix verify that 71V3558S100PFG8 is sourced from the original manufacturer or authorized distributors?

All 71V3558S100PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3558S100PFG8 meets industry standards.

7.What is the process for return or replacement of 71V3558S100PFG8?

All 71V3558S100PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3558S100PFG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3558S100PFG8 part is unused and in its original packaging.

Return procedure for 71V3558S100PFG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

71V3558S100PFG8 Tags

  • 71V3558S100PFG8
  • 71V3558S100PFG8 PDF
  • 71V3558S100PFG8 Datasheet
  • 71V3558S100PFG8 Specifications
  • 71V3558S100PFG8 Images
  • Renesas
  • Renesas 71V3558S100PFG8
  • Buy 71V3558S100PFG8
  • 71V3558S100PFG8 Price
  • 71V3558S100PFG8 Distributor
  • 71V3558S100PFG8 Supplier
  • 71V3558S100PFG8 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER