Renesas 71V3558S133PFG8
- Part No.:
- 71V3558S133PFG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V3558S133PFG8.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,200
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Product details
Overview
71V3558S133PFG8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit organization (4.5 Mbit), supporting 133 MHz operation (7.5 ns clock-to-data access), zero bus turnaround, pipelined outputs, and 4-word burst capability. It serves as high-speed buffer/cache in network packet processors and telecom line cards requiring deterministic latency and no dead cycles between read/write transitions.
For engineers reviewing the 71V3558S133PFG8 datasheet, 71V3558S133PFG8 pinout, 71V3558S133PFG8 application, or 71V3558S133PFG8 equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 3.3V I/O interface, industrial temperature support (–40°C to +85°C), and JTAG boundary scan availability in SA variants - all confirmed for this specific speed-grade and package variant.
Technical Context
The 71V3558S133PFG8 implements a fully synchronous, rising-edge-triggered architecture with registered address, control, and data paths. Its ZBT™ feature eliminates bus turnaround overhead by enabling immediate read-after-write or write-after-read transitions without wait states.
It integrates an on-chip 4-word burst counter (linear or interleaved via LBO pin), individual byte write enables (BW1–BW4), three chip enables (CE1, CE2, CE2) for depth expansion, and optional IEEE 1149.1 JTAG boundary scan - all synchronized to CLK, with only OE asynchronous.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports x36 mode with full 36-bit I/O width including four parity bits (I/OP1–I/OP4) |
| Max Clock Frequency | 133 MHz; guarantees ≤7.5 ns clock-to-data access time for timing-critical pipeline stages |
| Supply Voltage | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); enables direct interfacing with 3.3V logic families without level shifters |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus traffic by 75% per burst sequence, improving bandwidth efficiency |
| Operating Temperature | –40°C to +85°C; qualified for industrial environments including base station equipment and industrial controllers |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); compatible with standard SMT reflow profiles and automated optical inspection |
| ZBT™ Feature | Zero Bus Turnaround; allows consecutive read/write cycles with no dead cycles, essential for high-throughput packet buffering |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch, lead-free (Pb-free) and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous registers (address, control, I/O) align to this edge |
| R/W | Read/Write Control | Synchronous signal defining cycle type; determines whether data bus transfers read data or accepts write data two cycles later |
| ADV/LD | Burst Counter Control | Loads new external address (LOW) or increments internal burst counter (HIGH); defines burst initiation and sequencing |
| BW1–BW4 | Byte Write Enables | Four independent active-low enables for 9-bit bytes; allows partial writes without disturbing other byte lanes |
| CE1, CE2, CE2 | Chip Enable Inputs | Three synchronous enables (CE1/CE2 active-low, CE2 active-high); enable depth expansion with no external glue logic |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Pins | 36-bit bidirectional synchronous data bus (32 data + 4 parity); registered input/output paths ensure clean setup/hold margins |
| OE | Output Enable | Asynchronous enable; tri-states outputs immediately when HIGH, eliminating need for precise timing coordination |
| LBO | Burst Order Select | Static input selecting linear (LOW) or interleaved (HIGH) burst sequence; must remain stable during burst operation |
| ZZ | Sleep Mode Input | Active-high synchronous sleep control; gates internal clock and reduces power while retaining memory contents |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates dead cycles between read/write transitions, enabling continuous data flow in burst-intensive applications like packet forwarding |
| Internally Synchronized OE | Removes need for external OE timing control; output drivers respond asynchronously to OE, simplifying system-level timing closure |
| 4-Word Burst Counter | Reduces address bus activity by 75% per burst; supports both linear and interleaved sequences via LBO pin for cache-line alignment flexibility |
| Individual Byte Write (BW1–BW4) | Enables selective 9-bit byte updates without read-modify-write; critical for protocol header manipulation in networking ASICs |
| Three Chip Enables (CE1/CE2/CE2) | Supports seamless depth expansion across multiple devices using standard logic levels-no additional decode logic required |
Applications
| Network Packet Buffering | Telecom Line Card Cache |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in high-speed switch fabric buffers. IC Role / Device Role / Timing Role: High-bandwidth, low-latency dual-port SRAM acting as first-level packet buffer with deterministic 7.5 ns access. Use Value: ZBT™ eliminates bus turnaround stalls, sustaining >95% bus utilization under mixed read/write traffic typical of packet queuing. | Use Scenario: Caching ATM cell headers or MPLS labels in carrier-grade DSLAMs and OLTs. IC Role / Device Role / Timing Role: Pipelined synchronous SRAM providing burst-aligned header storage for real-time classification engines. Use Value: 4-word burst mode matches common 16-byte header sizes, reducing address bus cycles and improving throughput by 4× vs. single-word access. |
| Industrial PLC Data Logging | Test Equipment Pattern Memory |
Use Scenario: Capturing sensor timestamped values at 100 kSPS in programmable logic controllers with deterministic response. IC Role / Device Role / Timing Role: Industrial-temperature SRAM serving as cyclic buffer for time-series data acquisition subsystems. Use Value: –40°C to +85°C rating ensures reliable operation in uncontrolled cabinet environments; ZZ sleep mode cuts idle power by >60%. | Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: High-speed SRAM providing glitch-free vector delivery synchronized to tester clock domains. Use Value: Registered I/O and tight 7.5 ns access guarantee sub-cycle timing margin for 133 MHz ATE clocks, preventing pattern corruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV18-133AXC | 256K × 18-bit organization, same 133 MHz speed, but x18 interface (18-bit data width vs. 36-bit); no I/OP parity pins | Requires two devices for equivalent 36-bit width; better suited for systems with x18 bus architecture or lower density needs | Select when board layout uses x18 buses or when 256K × 18 capacity suffices and parity is not required |
| AS7C33128PFSI-133BIN | 128K × 32-bit (no parity), 133 MHz, same TQFP-100 package; lacks ZBT™, JTAG, and byte write enables | Non-ZBT architecture introduces 1-cycle turnaround penalty; suitable only for simpler burst-unaware systems | Choose only if ZBT™, parity, or fine-grained byte writes are unnecessary and cost is primary constraint |
Compared with CY7C1356BV18-133AXC and AS7C33128PFSI-133BIN, the 71V3558S133PFG8 uniquely delivers 128K × 36-bit density with ZBT™, full parity support, and industrial temperature range in a single TQFP-100 device - making it optimal for high-integrity, high-throughput embedded buffering where bus efficiency and data integrity are non-negotiable.
Availability
71V3558S133PFG8 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card caching, industrial PLC data logging, and ATE pattern memory applications requiring stable component supply, long-term lifecycle support, and guaranteed industrial-temperature performance.
Supply support for 71V3558S133PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V3558S series belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency bus turnaround in high-speed packet processing, telecom infrastructure, and real-time control systems demanding deterministic timing and burst efficiency.
FAQ
What is the memory organization and total capacity of the 71V3558S133PFG8?
The 71V3558S133PFG8 is configured as 128K × 36-bit, delivering 4,718,592 bits (4.5 Mbit) of synchronous SRAM. This includes 32 data bits (I/O0–I/O31) and 4 parity bits (I/OP1–I/OP4), supporting error detection in mission-critical buffering applications. The device operates exclusively in x36 mode - not x18 - and does not support configuration switching.
Does the 71V3558S133PFG8 support JTAG boundary scan?
The 71V3558S133PFG8 does not include JTAG boundary scan; that feature is exclusive to the "SA" suffix variants (e.g., 71V3558SA). This "S" version omits TMS, TDI, TCK, TDO, and TRST pins - confirmed by pin configurations in PKG100, BG119, and BQ165 packages. For IEEE 1149.1 compliance, select the SA variant instead of the 71V3558S133PFG8.
What is the function of the ZZ pin on the 71V3558S133PFG8, and how is it used?
The ZZ pin on the 71V3558S133PFG8 is a synchronous sleep mode input. When driven HIGH, it internally gates the CLK signal and places the device in its lowest-power state while guaranteeing data retention. It has an internal pulldown resistor, so it defaults to inactive (normal operation) when left unconnected. Sleep mode reduces active power consumption significantly and is ideal for intermittent data capture or standby states in industrial controllers.
How does the ZBTTM feature improve system performance in the 71V3558S133PFG8?
The ZBTTM (Zero Bus Turnaround) feature in the 71V3558S133PFG8 eliminates mandatory idle cycles between consecutive read and write operations. Unlike conventional SRAMs requiring bus turnaround time, the 71V3558S133PFG8 permits immediate transition - e.g., a write cycle at clock n can be followed directly by a read cycle at clock n+1 - sustaining >95% bus utilization in burst-heavy workloads like packet forwarding engines.
What are the valid operating voltage ranges for VDD and VDDQ on the 71V3558S133PFG8?
The 71V3558S133PFG8 requires VDD (core supply) and VDDQ (I/O supply) both at 3.3 V ±5%, i.e., 3.135 V to 3.465 V. These rails must be independently decoupled and may be supplied from separate regulators. Operation outside this range risks timing violations, data corruption, or permanent damage - especially if VDDQ exceeds VDD +0.3 V or falls below VDD −0.3 V, as specified in the DC operating conditions table.
71V3558S133PFG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V3558S133PFG8 FAQ
1.How can I place an order for 71V3558S133PFG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3558S133PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3558S133PFG8 reliable?
The price and inventory of 71V3558S133PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3558S133PFG8 is usually 5 days.
3.What payment methods are accepted for 71V3558S133PFG8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3558S133PFG8 transactions.
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4.How is shipping managed for 71V3558S133PFG8?
71V3558S133PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3558S133PFG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3558S133PFG8?
For technical support, including 71V3558S133PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3558S133PFG8 requirements.
6.How does Aetrix verify that 71V3558S133PFG8 is sourced from the original manufacturer or authorized distributors?
All 71V3558S133PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3558S133PFG8 meets industry standards.
7.What is the process for return or replacement of 71V3558S133PFG8?
All 71V3558S133PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3558S133PFG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3558S133PFG8 part is unused and in its original packaging.
Return procedure for 71V3558S133PFG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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