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Renesas 71V3558S133PFGI

Part No.:
71V3558S133PFGI
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V3558S133PFGI.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,806

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Product details

Overview

71V3558S133PFGI from Renesas is a 3.3V, 128K × 36-bit (4.5 Mbit) synchronous ZBT™ SRAM with zero bus turnaround, 133 MHz operation (7.5 ns clock-to-data), pipelined outputs, and 4-word burst capability. It features synchronous address/control/data registers, individual byte write enables (BW1–BW4), and three chip enables for depth expansion. Used in high-speed networking line cards requiring deterministic read/write interleaving without dead cycles.

For engineers reviewing the 71V3558S133PFGI datasheet, 71V3558S133PFGI pinout, 71V3558S133PFGI application, or 71V3558S133PFGI equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, industrial temperature support (–40°C to +85°C), and JTAG optional boundary scan integration for system-level testability.

Technical Context

The 71V3558S133PFGI implements a fully synchronous, clock-edge-triggered architecture where address, control, and data signals are registered on the rising edge of CLK. Its ZBT™ feature eliminates bus turnaround latency by enabling immediate read-after-write or write-after-read transitions without idle cycles.

It integrates an on-chip burst counter controlled by ADV/LD and LBO pins, supporting both linear and interleaved 4-word burst sequences. Output enable (OE) remains asynchronous, allowing dynamic output tri-state control independent of clock timing.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128K × 36-bit (4.5 Mbit); supports x36 interface with I/O[0:31] and I/OP[1:4]
Max Clock Frequency133 MHz; enables 7.5 ns clock-to-data access time for pipelined read/write operations
Supply VoltageVDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate power domains reduce noise coupling
Operating Temperature–40°C to +85°C (industrial grade); validated for sustained operation in telecom chassis environments
Burst Capability4-word burst (linear or interleaved); reduces address bus traffic and improves bandwidth efficiency
Byte Write ControlFour independent active-low BW1–BW4 signals; enables selective 9-bit byte writes without full-word masking logic
Package100-pin TQFP (14 mm × 20 mm, JEDEC standard); compatible with automated SMT assembly and thermal management

Pinout & Package

Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm footprint, with exposed pad not specified. Pin functions validated per Renesas IDT71V3558 datasheet Rev. Aug.06.21.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address InputsSynchronous 18-bit address bus; A0–A16 used for 128K×36 addressing; A17 reserved/NC in this configuration
CLKClock InputRising-edge-triggered master clock; all synchronous registers (address, control, I/O) sample on this edge
R/WRead/Write ControlSynchronous signal defining cycle type; determines whether next data transfer is read (H) or write (L)
ADV/LDBurst Address Advance / LoadSynchronous control: LOW loads new external address; HIGH increments internal burst counter
LBOLinear/Interleaved Burst OrderStatic input selecting burst sequence mode; LOW = linear, HIGH = interleaved
BW1–BW4Byte Write EnablesActive-low per-byte controls for 9-bit segments; allows partial-word writes without external gating
CE1, CE2, CE2Chip EnablesThree independent enables (CE1/CE2 active-low, CE2 active-high); enable depth expansion with no external logic
I/O0–I/O31, I/OP1–I/OP4Data I/O Bus36-bit bidirectional synchronous data path; registered inputs/outputs ensure timing predictability
OEOutput EnableAsynchronous control; drives I/O pins to high-impedance when HIGH, independent of clock
ZZSleep ModeSynchronous input; HIGH gates internal clock and reduces power while retaining memory contents
VDD, VDDQ, VSSPower/GroundDual-supply design: VDD (3.3 V core), VDDQ (3.3 V I/O), and common ground plane for noise isolation

Key Features

FeatureDesign Value
ZBT™ ArchitectureEliminates dead bus cycles between read/write transitions, enabling continuous 133 MHz throughput in burst-mode systems
Pipelined OutputsInternally synchronized output buffer enable removes need for external OE timing control, simplifying PCB layout
4-Word Burst CounterReduces address bus activity by 75% per burst; selectable linear/interleaved order via LBO pin for cache-line alignment
Individual Byte WriteEnables precise 9-bit updates without full-word read-modify-write, critical for packet header manipulation in switch fabrics
Optional JTAG Boundary ScanIEEE 1149.1-compliant test interface (SA variant only); supports structural testing in dense backplane assemblies
Industrial Temperature RangeValidated operation from –40°C to +85°C; meets GR-63-CORE reliability requirements for central office equipment

Applications

Packet Buffering in Ethernet Switch ASIC InterfacesHigh-Speed Cache for DSP-Based Radar Signal Processors

Use Scenario: Line-rate buffering of variable-length Ethernet frames between MAC and switching fabric.

IC Role / Device Role / Timing Role: Asynchronous-to-synchronous bridge with zero-turnaround burst reads/writes, absorbing jitter from PHY-layer timing skew.

Use Value: Eliminates 2-cycle dead time per bus direction change, sustaining 133 MHz effective bandwidth under mixed traffic loads.

Use Scenario: Real-time storage of FFT coefficients and filter taps in airborne radar front-end modules.

IC Role / Device Role / Timing Role: Low-latency, deterministic memory for pipeline-stage data exchange between dual-core DSPs.

Use Value: 7.5 ns clock-to-data access and pipelined outputs meet sub-10 ns timing budgets for 100+ MSPS sampling rates.

Backplane Interface Memory in Telecom Line CardsControl Plane Packet Classification Table Storage

Use Scenario: Storing configuration tables and status registers shared across multiple SerDes lanes on a 10G/25G line card.

IC Role / Device Role / Timing Role: Shared synchronous SRAM accessed concurrently by multiple protocol engines via time-multiplexed bursts.

Use Value: Three chip enables (CE1/CE2/CE2) allow seamless depth expansion to 256K×36 without glue logic or address decoding.

Use Scenario: Holding TCAM-equivalent rule sets for IPv4/IPv6 packet classification in enterprise firewalls.

IC Role / Device Role / Timing Role: High-throughput lookup table with byte-selectable writes for dynamic rule updates.

Use Value: Independent BW1–BW4 enables atomic 9-bit field updates (e.g., TTL, DSCP) without corrupting adjacent match fields.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1355KV18-133BZC256K × 18 organization; 133 MHz; same TQFP-100 package; no ZZ sleep modeOptimized for x18 data paths; requires two devices for x36 width; lacks low-power sleep stateSelect when x18 interface suffices and power-down capability is non-critical
AS7C33128PFSI-133BIN128K × 32 organization; 133 MHz; 100-pin TQFP; no JTAG option; commercial temp only (0°C to +70°C)Missing 4-bit parity port (I/OP1–I/OP4); unsuitable for industrial environments requiring extended temperature rangeSelect for cost-sensitive commercial applications where parity and industrial temp are not required

Compared with CY7C1355KV18-133BZC and AS7C33128PFSI-133BIN, the 71V3558S133PFGI uniquely delivers x36 width with integrated parity ports, industrial temperature rating, and ZBT™-optimized timing-making it the only choice for deterministic, high-reliability packet buffering in carrier-grade infrastructure.

Availability

71V3558S133PFGI is available at Aetrix Electronics and suitable for high-speed networking line cards, radar signal processors, telecom backplane interfaces, and packet classification engines requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 71V3558S133PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.

The 71V3558S133PFGI belongs to Renesas' legacy IDT synchronous SRAM product line, engineered specifically for zero-latency, high-bandwidth memory interfacing in carrier-class networking and real-time signal processing systems.

FAQ

What is the maximum operating frequency supported by the 71V3558S133PFGI?

The 71V3558S133PFGI supports a maximum clock frequency of 133 MHz, corresponding to a 7.5 ns clock-to-data access time. This specification is guaranteed over the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions, as verified in the Renesas IDT71V3558 datasheet Rev. Aug.06.21.

Does the 71V3558S133PFGI support burst read and write operations?

Yes, the 71V3558S133PFGI supports 4-word burst operations in both linear and interleaved sequences, selected via the LBO pin. Burst mode is initiated using the ADV/LD signal and reduces address bus overhead by 75% per transaction, directly improving effective bandwidth in cache-like applications.

What is the function of the ZZ pin on the 71V3558S133PFGI?

The ZZ pin on the 71V3558S133PFGI is a synchronous sleep mode input. When driven HIGH, it gates the internal clock and places the device in its lowest power consumption state while guaranteeing data retention. This feature is essential for power-aware designs such as portable radar subsystems or energy-efficient line cards.

How many chip enable signals does the 71V3558S133PFGI provide, and what are their polarities?

The 71V3558S133PFGI provides three chip enable signals: CE1 and CE2 are active-low, while CE2 is active-high. All three must be asserted simultaneously (CE1=L, CE2=L, CE2=H) to select the device. This configuration enables flexible depth expansion without external logic, a key advantage in multi-SRAM memory subsystems.

Is JTAG boundary scan supported on the 71V3558S133PFGI?

No, JTAG boundary scan is not supported on the 71V3558S133PFGI. The "S" suffix denotes the standard version without JTAG; only the "SA" variant includes IEEE 1149.1-compliant TMS, TDI, TCK, TDO, and optional TRST pins. For testability requirements, the SA version must be selected instead of the 71V3558S133PFGI.

71V3558S133PFGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V3558S133PFGI FAQ

1.How can I place an order for 71V3558S133PFGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3558S133PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3558S133PFGI reliable?

The price and inventory of 71V3558S133PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3558S133PFGI is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3558S133PFGI transactions.

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71V3558S133PFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3558S133PFGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3558S133PFGI?

For technical support, including 71V3558S133PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3558S133PFGI requirements.

6.How does Aetrix verify that 71V3558S133PFGI is sourced from the original manufacturer or authorized distributors?

All 71V3558S133PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3558S133PFGI meets industry standards.

7.What is the process for return or replacement of 71V3558S133PFGI?

All 71V3558S133PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V3558S133PFGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3558S133PFGI part is unused and in its original packaging.

Return procedure for 71V3558S133PFGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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