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Renesas 71V3558S166PFG

Part No.:
71V3558S166PFG
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V3558S166PFG.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,677

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Product details

Overview

71V3558S166PFG from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit organization (4.5 Mbit), 166 MHz clock frequency, 3.5 ns clock-to-data access time, zero bus turnaround architecture, and pipelined outputs. It operates in industrial temperature range (–40°C to +85°C) and is packaged in a 100-pin TQFP for high-speed cache and buffer applications in networking and telecom equipment.

For engineers reviewing the 71V3558S166PFG datasheet, 71V3558S166PFG pinout, 71V3558S166PFG application, or 71V3558S166PFG equivalent, key selection criteria include ZBT™ burst capability (linear/interleaved), individual byte write control (BW1–BW4), three chip enables for depth expansion, JTAG boundary scan support (IEEE 1149.1), and sleep mode (ZZ) for power management.

Technical Context

The 71V3558S166PFG implements a fully synchronous, pipelined architecture where address/control signals are registered on the rising edge of CLK, and data transfers occur two cycles later. Its ZBT™ feature eliminates dead cycles between read and write operations by enabling immediate bus turnaround without OE control.

It integrates an on-chip 4-word burst counter controlled by ADV/LD and LBO pins, supports interleaved or linear burst sequences, and includes asynchronous OE for output tri-state control. The device uses separate VDD (3.3V core) and VDDQ (3.3V I/O) supplies and features a synchronous sleep mode (ZZ) that gates the internal clock while retaining data.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36-bit (4.5 Mbit); supports high-bandwidth data paths in packet buffering and cache line storage.
Clock Frequency 166 MHz; enables 6.0 ns cycle time for sustained high-throughput memory access in real-time systems.
Clock-to-Data Access 3.5 ns; guarantees deterministic read latency critical for synchronous pipeline alignment in switch fabric controllers.
Supply Voltages VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; dual-rail design isolates core logic noise from I/O signaling integrity.
Operating Temperature –40°C to +85°C; qualified for industrial-grade deployment in base station and router chassis environments.
Burst Capability 4-word burst (linear or interleaved); reduces address bus overhead and improves effective bandwidth in sequential access patterns.
Byte Write Control BW1–BW4 active-low enables per-9-bit byte writes; allows precise partial-word updates without read-modify-write cycles.

Pinout & Package

Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm. Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14, 16, and 66 tolerate VIH-level input without direct VDD connection.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs Synchronous inputs latched on rising CLK edge; A0–A16 used for 128K×36 addressing; A17 unused in this configuration.
CLK System Clock Input Rising-edge-triggered master timing reference; all synchronous registers (address, control, data I/O) align to this edge.
R/W Read/Write Control Synchronous signal defining load-cycle operation type; determines whether subsequent data transfer is read or write.
ADV/LD Burst Counter Control Loads external address when low; advances internal burst counter when high - enables seamless burst sequencing.
BW1–BW4 Byte Write Enables Active-low per-byte controls for I/O[0:7]/I/OP1 through I/O[24:31]/I/OP4; allows granular 9-bit word updates.
CE1, CE2, CE2 Chip Enable Inputs Three independent enables (CE1/CE2 active-low, CE2 active-high) for flexible depth expansion and hierarchical memory decoding.
I/O0–I/O31, I/OP1–I/OP4 Data I/O Pins 36-bit bidirectional synchronous data bus; registered input and output paths ensure timing predictability across temperature/voltage.
ZZ Sleep Mode Input Active-high synchronous signal that gates internal clock and reduces dynamic power while preserving data retention.

Key Features

Feature Design Value
ZBTTM Zero Bus Turnaround Eliminates idle cycles between read/write transitions - enables continuous data flow in full-duplex bus architectures like PCI-X and RapidIO.
Internally Synchronized OE Removes need for external OE timing control; outputs remain valid or tri-state deterministically based on synchronous register state.
Pipelined Address/Data Registers Two-stage pipeline (load → execute) ensures consistent 3.5 ns access time regardless of clock skew or trace length variation.
JTAG Boundary Scan (IEEE 1149.1) Optional test interface available in BGA variants; supports production ICT and board-level interconnect validation without additional test points.
Individual Byte Write (BW1–BW4) Enables 9-bit granularity writes without read-modify-write overhead - essential for protocol header manipulation in packet processors.

Applications

High-Speed Network Switch Buffer Telecom Line Card Cache

Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switching ASICs.

IC Role / Device Role / Timing Role: Primary packet buffer SRAM with ZBT™ burst reads/writes synchronized to switch fabric clock.

Use Value: 3.5 ns access and zero bus turnaround enable line-rate 10 Gbps frame buffering with minimal latency jitter.

Use Scenario: Holding ATM cell headers and payload fragments in OC-192 line interface units.

IC Role / Device Role / Timing Role: Dual-port-accessible cache for header parsing engines requiring deterministic 166 MHz throughput.

Use Value: 4-word burst mode and individual byte write reduce bus arbitration overhead during multi-protocol header inspection.

Industrial PLC Real-Time Data Log Radar Signal Processing FIFO

Use Scenario: Capturing sensor timestamps and analog-to-digital conversion results in deterministic cyclic execution.

IC Role / Device Role / Timing Role: High-reliability SRAM buffer with industrial temp rating and sleep mode for power-gated logging intervals.

Use Value: ZZ pin enables microamp-level standby current during idle cycles while guaranteeing data retention at –40°C.

Use Scenario: Temporary storage of FFT output bins between processing stages in airborne radar front-ends.

IC Role / Device Role / Timing Role: Low-jitter pipelined memory staging FIFO synchronized to ADC sampling clock.

Use Value: Clock-to-data spec of 3.5 ns ensures phase-coherent bin transfer across multiple DSP cores operating at 166 MHz.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1355KV18-166BZC 256K × 18-bit organization, same 166 MHz speed, but no ZZ sleep mode or JTAG support. Better suited for width-matched 18-bit bus systems; lacks byte-write granularity and industrial temp option. Select when system bus width is 18-bit and sleep mode is not required; verify thermal derating for +85°C operation.
AS7C3256A-166JCIN 128K × 32-bit organization, 166 MHz, no ZBT™ or burst counter; standard sync SRAM timing. Requires external logic for burst sequencing; higher pin count due to separate OE and WE pins. Choose for cost-sensitive designs where ZBT™ advantage is unnecessary and simpler control logic is preferred.

Compared with CY7C1355KV18-166BZC and AS7C3256A-166JCIN, the 71V3558S166PFG uniquely delivers 36-bit width, ZBT™ bus efficiency, and integrated burst control - reducing external glue logic and improving sustained bandwidth in high-clock-frequency systems.

Availability

71V3558S166PFG is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card caches, and industrial PLC real-time data loggers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 71V3558S166PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 71V3558S166PFG belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency bus turnaround in packet-switched infrastructure where deterministic timing and burst efficiency are mandatory.

FAQ

What is the memory organization and total capacity of the 71V3558S166PFG?

The 71V3558S166PFG is configured as 128K × 36-bit, delivering 4,718,592 bits (4.5 Mbit) of synchronous SRAM. This organization supports 36-bit data paths common in high-end networking ASICs and DSP interfaces, with address lines A0–A16 fully utilized and A17 reserved for future expansion or 256K×18 mode compatibility.

Does the 71V3558S166PFG support burst read and write operations, and how is burst order selected?

Yes, the 71V3558S166PFG supports 4-word burst operations in both read and write modes. Burst sequence order - linear or interleaved - is selected via the LBO pin: LBO = LOW selects linear order, LBO = HIGH selects interleaved order. The burst counter advances synchronously on each rising CLK edge when ADV/LD is HIGH.

How does the ZBTTM feature eliminate dead cycles between read and write operations in the 71V3558S166PFG?

The ZBTTM (Zero Bus Turnaround) feature in the 71V3558S166PFG removes the need for idle cycles by allowing immediate transition from read to write (or vice versa) within the same clock domain. This is achieved through internal synchronization of OE and bus direction control, eliminating external OE timing constraints and enabling continuous data flow in full-duplex bus systems.

What are the power supply requirements and voltage tolerances for the 71V3558S166PFG?

The 71V3558S166PFG requires two independent 3.3 V supplies: VDD (core logic, 3.3 V ±5%) and VDDQ (I/O drivers, 3.3 V ±5%). Absolute maximum ratings allow VDD/VDDQ up to +3.465 V and minimum down to +3.135 V. Input voltage thresholds are VIH ≥ 2.0 V and VIL ≤ 0.8 V, ensuring robust noise margin in electrically noisy environments.

Is JTAG boundary scan supported on the 71V3558S166PFG, and which package options include it?

JTAG boundary scan (IEEE 1149.1) is optional and implemented only in BGA package variants (119-ball and 165-fBGA) of the 71V3558S166PFG - not in the 100-pin TQFP package. Signals TMS, TDI, TCK, TDO, and optional TRST are assigned to dedicated pins in BGA versions; the "S" suffix indicates non-JTAG TQFP, while "SA" denotes JTAG-enabled versions in BGA.

71V3558S166PFG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V3558S166PFG FAQ

1.How can I place an order for 71V3558S166PFG through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3558S166PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3558S166PFG reliable?

The price and inventory of 71V3558S166PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3558S166PFG is usually 5 days.

3.What payment methods are accepted for 71V3558S166PFG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3558S166PFG transactions.

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4.How is shipping managed for 71V3558S166PFG?

71V3558S166PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3558S166PFG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3558S166PFG?

For technical support, including 71V3558S166PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3558S166PFG requirements.

6.How does Aetrix verify that 71V3558S166PFG is sourced from the original manufacturer or authorized distributors?

All 71V3558S166PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3558S166PFG meets industry standards.

7.What is the process for return or replacement of 71V3558S166PFG?

All 71V3558S166PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V3558S166PFG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3558S166PFG part is unused and in its original packaging.

Return procedure for 71V3558S166PFG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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