Renesas 71V3558SA100BQG8
- Part No.:
- 71V3558SA100BQG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V3558SA100BQG8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3558SA100BQG8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit organization (4.5 Mbit), 100 MHz clock speed, 3.5 ns clock-to-data access time, zero bus turnaround architecture, and JEDEC-standard 100-pin TQFP packaging. It serves as a high-bandwidth, low-latency memory buffer in network packet processors and telecom line cards requiring burst pipelined reads/writes.
For engineers reviewing the 71V3558SA100BQG8 datasheet, 71V3558SA100BQG8 pinout, 71V3558SA100BQG8 application, or 71V3558SA100BQG8 equivalent, key selection criteria include ZBT™ dead-cycle elimination, 4-word interleaved/linear burst capability, individual byte write control (BW1–BW4), JTAG IEEE 1149.1 support, and industrial temperature operation (–40°C to +85°C).
Technical Context
The 71V3558SA100BQG8 implements a fully synchronous, pipelined architecture where address/control registration occurs on the rising CLK edge, with data output valid two cycles later. Its ZBT™ feature eliminates bus turnaround latency by enabling immediate read-after-write or write-after-read transitions without idle cycles.
It integrates an on-chip burst counter controlled by ADV/LD and LBO pins, supporting both linear and interleaved 4-word burst sequences. The device includes three chip enables (CE1, CE2, CE2) for depth expansion, asynchronous OE for output tri-state control, and optional boundary-scan JTAG (TMS/TDI/TCK/TDO/TRST) compliant with IEEE 1149.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 256K × 18-bit via pin-compatible variant - enables flexible data bus width matching. |
| Clock Frequency | 100 MHz maximum; defines system timing budget and throughput ceiling for burst transfers. |
| Access Time | 3.5 ns clock-to-data (tCD); determines minimum read latency from address load to valid Q output. |
| Supply Voltage | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; requires dual 3.3V rails with independent decoupling. |
| Operating Temperature | –40°C to +85°C industrial grade; validated for base station, router, and industrial control environments. |
| Burst Capability | 4-word linear or interleaved burst; reduces address overhead and improves sustained bandwidth in sequential access patterns. |
| JTAG Support | IEEE 1149.1-compliant optional boundary scan (TMS/TDI/TCK/TDO/TRST); enables production test and debug visibility. |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch, lead-free and RoHS-compliant (BQG suffix). Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14/16/66 tolerate VIH-level inputs without direct VDD connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Input | Synchronous 17-bit address bus; latched on rising CLK when ADV/LD = LOW and chip enabled. |
| CLK | Clock Input | Single-ended positive-edge-triggered master clock; all synchronous timing referenced to this signal. |
| R/W | Read/Write Control | Synchronous command input defining cycle type; sampled with ADV/LD to initiate load operations. |
| ADV/LD | Burst Counter Control | Loads external address (LOW) or increments internal burst counter (HIGH); enables burst chaining. |
| LBO | Burst Order Select | Static input selecting linear (LOW) or interleaved (HIGH) 4-word burst sequence; must remain stable during operation. |
| BW1–BW4 | Byte Write Enables | Active-low synchronous controls for 9-bit bytes I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4; allows partial writes without masking logic. |
| CE1, CE2, CE2 | Chip Enable Inputs | Three independent enables (CE1/CE2 active-low, CE2 active-high); enable depth expansion with no external glue logic. |
| OE | Output Enable | Asynchronous tri-state control; allows output disable at any time without affecting internal state or timing. |
| TMS, TDI, TCK, TDO, TRST | JTAG Boundary Scan | IEEE 1149.1 interface; TRST is optional asynchronous reset; all JTAG pins have internal pull-ups. |
| ZZ | Sleep Mode Input | Active-high synchronous entry into low-power sleep; gates internal CLK and guarantees data retention. |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous bus; registered inputs/outputs eliminate external latch requirements. |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between consecutive read/write operations - increases effective bus utilization by up to 30% in mixed-access workloads. |
| Internally Synchronized OE | Removes need for external OE timing control - simplifies PCB layout and eliminates race conditions in high-speed systems. |
| 4-Word Burst Counter | Reduces address bus activity by 75% per burst - lowers controller overhead and improves sustained throughput in streaming applications. |
| Individual Byte Write (BW1–BW4) | Enables granular 9-bit writes without full-word masking - critical for protocol header updates and descriptor management. |
| Three Chip Enables (CE1/CE2/CE2) | Supports seamless memory depth expansion using identical parts - avoids custom decoding logic and minimizes BOM variants. |
Applications
| Packet Buffering in Network Processors | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in real-time traffic shaping engines. IC Role / Device Role / Timing Role: High-throughput, low-latency dual-port buffer with ZBT™-enabled back-to-back read/write for ingress/egress pipeline stages. Use Value: 3.5 ns tCD and zero bus turnaround reduce frame buffering latency by ≥2.1 ns per transition versus standard SSRAMs. | Use Scenario: Frame assembly/disassembly and header modification in OC-192/STM-64 line interface units. IC Role / Device Role / Timing Role: Burst-capable memory for DMA-controlled descriptor tables and payload buffers operating at 100 MHz system clock. Use Value: 4-word interleaved burst with ADV/LD sequencing delivers 4× sustained bandwidth over single-word access for contiguous payloads. |
| Industrial PLC Data Logging | Radar Signal Processing Buffers |
Use Scenario: Cyclic acquisition and timestamped storage of sensor data streams in deterministic control loops. IC Role / Device Role / Timing Role: Deterministic-access SRAM with industrial temp rating (–40°C to +85°C) and sleep mode (ZZ) for power-gated logging intervals. Use Value: Synchronous CEN and ZZ inputs enable precise power-state coordination with PLC scan cycles - reducing average power by >65% during idle periods. | Use Scenario: Real-time buffering of ADC samples and FFT intermediate results in airborne radar front-ends. IC Role / Device Role / Timing Role: Pipelined memory with registered I/O and burst counter for synchronized sample ingestion and processing stage handoff. Use Value: Registered address/data paths ensure setup/hold compliance at 100 MHz across wide temperature ranges - eliminating timing closure risk in FPGA-based DSP chains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV33-100AXC | 128K × 32-bit, 100 MHz, no JTAG, no ZZ, only linear burst, 100-pin TQFP | Lacks ZBT™ dead-cycle elimination and interleaved burst; lower pin count (32-bit vs 36-bit data bus) | Select when JTAG testability and 36-bit bus alignment are not required; verify burst mode compatibility with controller. |
| AS7C33128PFSI-100BIN | 128K × 36-bit, 100 MHz, no ZBT™, no JTAG, no ZZ, 100-pin TQFP | Standard synchronous SRAM behavior with 2-cycle turnaround; lacks burst counter and advanced control features | Choose for cost-sensitive designs where ZBT™ performance gain is unnecessary and controller handles burst sequencing externally. |
Compared with CY7C1356BV33-100AXC and AS7C33128PFSI-100BIN, the 71V3558SA100BQG8 uniquely delivers ZBT™-enabled zero-turnaround operation, IEEE 1149.1 JTAG, and programmable interleaved/linear burst - making it optimal for latency-critical, testable, and controller-offloaded memory subsystems.
Availability
71V3558SA100BQG8 is available at Aetrix Electronics and suitable for network infrastructure, telecom line cards, and industrial control systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for 71V3558SA100BQG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing markets.
The 71V3558SA100BQG8 belongs to IDT's ZBT™ SRAM product line, designed specifically for high-speed packet processing, telecom switching, and real-time embedded systems demanding deterministic low-latency memory access.
FAQ
What is the memory organization and total capacity of the 71V3558SA100BQG8?
The 71V3558SA100BQG8 is configured as 128K × 36-bit, delivering 4,718,592 bits (4.5 Mbit) of synchronous SRAM. It supports the 256K × 18-bit configuration via pin-compatible variant 71V3556SA100BQG8, allowing design reuse across different data bus widths while maintaining identical timing and control interfaces.
Does the 71V3558SA100BQG8 support JTAG boundary scan, and which pins are used?
Yes, the 71V3558SA100BQG8 includes optional IEEE 1149.1-compliant JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and TRST (on BGA packages) implement the test interface. TRST is optional and internally pulled up; if unused, it may be left floating. All JTAG pins have internal pull-up resistors per the datasheet.
How does the ZBT™ feature improve system performance in the 71V3558SA100BQG8?
The ZBT™ (Zero Bus Turnaround) feature in the 71V3558SA100BQG8 eliminates mandatory idle cycles between consecutive read and write operations. This allows immediate back-to-back access - e.g., a write followed instantly by a read - increasing effective bus utilization by up to 30% in mixed-access scenarios typical of network packet buffers and descriptor queues.
What is the function of the ADV/LD and LBO pins on the 71V3558SA100BQG8?
ADV/LD controls the burst counter: LOW loads a new external address, HIGH advances the internal counter. LBO selects burst order - LOW enables linear sequence, HIGH enables interleaved. Both are synchronous inputs sampled on the rising CLK edge, and LBO must remain static during burst operation to prevent undefined addressing.
Can the 71V3558SA100BQG8 operate in low-power mode, and how is it activated?
Yes, the 71V3558SA100BQG8 supports sleep mode via the ZZ pin. When ZZ is driven HIGH synchronously, the internal clock is gated and core power consumption drops significantly while guaranteeing data retention. This mode is ideal for power-gated states in industrial PLCs or standby intervals in telecom equipment.
71V3558SA100BQG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V3558SA100BQG8 FAQ
1.How can I place an order for 71V3558SA100BQG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3558SA100BQG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3558SA100BQG8 reliable?
The price and inventory of 71V3558SA100BQG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3558SA100BQG8 is usually 5 days.
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5.How can I obtain technical support or documentation for 71V3558SA100BQG8?
For technical support, including 71V3558SA100BQG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3558SA100BQG8 requirements.
6.How does Aetrix verify that 71V3558SA100BQG8 is sourced from the original manufacturer or authorized distributors?
All 71V3558SA100BQG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3558SA100BQG8 meets industry standards.
7.What is the process for return or replacement of 71V3558SA100BQG8?
All 71V3558SA100BQG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3558SA100BQG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3558SA100BQG8 part is unused and in its original packaging.
Return procedure for 71V3558SA100BQG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3558SA100BQG8 Tags

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