Renesas 71V3558SA133BQG
- Part No.:
- 71V3558SA133BQG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V3558SA133BQG.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3558SA133BQG from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 256K × 18-bit organization (4.5 Mbit), 133 MHz maximum clock frequency, 3.5 ns clock-to-data access time, and zero bus turnaround architecture. It supports pipelined burst reads/writes, individual byte write control, and JTAG boundary scan in a 165-ball fine-pitch BGA (BQG) package for high-speed cache and buffer applications in networking and telecom systems.
For engineers reviewing the 71V3558SA133BQG datasheet, 71V3558SA133BQG pinout, 71V3558SA133BQG application, or 71V3558SA133BQG equivalent, key selection criteria include ZBT™ bus efficiency, 4-word burst capability (linear/interleaved), 3.3V I/O compatibility, industrial temperature support (–40°C to +85°C), and JTAG IEEE 1149.1 compliance for system-level testability.
Technical Context
This SRAM implements a fully synchronous, positive-edge-triggered architecture with registered address, data, and control inputs. Its ZBT™ feature eliminates dead cycles between read/write transitions by enabling immediate bus direction reversal without wait states.
The device integrates an on-chip 4-word burst counter controlled by ADV/LD and LBO pins, supports pipelined outputs via dual-register data paths, and includes three chip enables (CE1, CE2, CE2) for flexible depth expansion-enabling seamless integration into high-bandwidth memory subsystems requiring deterministic latency and low bus overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 18-bit (4.5 Mbit); matches x18 bus width for compact high-density buffering |
| Max Clock Frequency | 133 MHz; enables 133 MT/s throughput with precise timing alignment to system clocks |
| Clock-to-Data Access | 3.5 ns; guarantees sub-4 ns read latency critical for real-time packet processing |
| Supply Voltage | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; compatible with standard 3.3V logic interfaces and power rails |
| Burst Mode | 4-word linear or interleaved burst; reduces address bus traffic by 75% per burst transaction |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade deployment in base stations and edge routers |
| JTAG Support | IEEE 1149.1 compliant; enables boundary-scan testing without additional test fixtures |
Pinout & Package
Packaged in a 165-ball fine-pitch ball grid array (BQG) per JEDEC MO-207AD, with 1.0 mm ball pitch and 15.0 mm × 15.0 mm body size. Pinout validated per IDT document 5281 tbl 25a (256K × 18 configuration).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous 18-bit address bus; latched on rising CLK edge with ADV/LD low |
| CLK | System Clock Input | Primary timing reference; all synchronous operations aligned to rising edge |
| R/W | Read/Write Control | Single-pin mode select; determines cycle type at load time, not during burst |
| ADV/LD | Burst Counter Control | Low = load new external address; high = increment internal burst counter |
| LBO | Burst Order Select | Static input: low = linear sequence, high = interleaved sequence |
| BW1–BW2 | Byte Write Enables | Active-low controls for two 9-bit bytes (I/O[0:8]/I/OP1 and I/O[9:17]/I/OP2) |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 active-low, CE2 active-high) for multi-SRAM depth expansion |
| I/O0–I/O17, I/OP1–I/OP2 | Data I/O | 18-bit bidirectional data bus with registered input/output paths for pipelined operation |
| TMS, TDI, TCK, TDO, TRST | JTAG Interface | IEEE 1149.1 boundary scan signals; TRST optional asynchronous reset |
| VDD, VDDQ, VSS | Power/Ground | VDD = 3.3V core supply; VDDQ = 3.3V I/O supply; separate rails reduce noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between read/write transitions-enables back-to-back memory accesses without bus idle time |
| Internally Synchronized OE | Output enable is fully synchronous; removes need for external OE timing control in pipelined systems |
| 4-Word Burst Capability | Reduces address bus activity by 75% per burst; supports both linear and interleaved sequences via LBO pin |
| Individual Byte Write Control | BW1/BW2 allow selective 9-bit writes-critical for partial-word updates in protocol header manipulation |
| Three Chip Enables | Enables seamless depth expansion across multiple devices without external logic or address decoding overhead |
Applications
| Packet Buffering in Switch ASICs | Line Card Memory in Telecom Routers |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switch fabric. IC Role / Device Role / Timing Role: High-speed, low-latency buffer with deterministic 3.5 ns access and zero-turnaround burst reads for header inspection pipelines. Use Value: Enables full-line-rate packet processing at 10 Gbps+ by eliminating bus turnaround stalls during sequential header fetches. | Use Scenario: Acting as shared buffer memory for multiple DSP cores handling voice-over-IP channel aggregation. IC Role / Device Role / Timing Role: Synchronous SRAM providing pipelined burst writes for real-time voice sample buffering with JTAG test access. Use Value: Supports concurrent multi-core access via CE partitioning and maintains data integrity across –40°C to +85°C operating range. |
| Cache Memory in Baseband Processors | Control Plane Buffer in Network Security Appliances |
Use Scenario: Serving as L2 instruction/data cache for ARM-based baseband processors in 4G/LTE femtocells. IC Role / Device Role / Timing Role: Low-power, high-bandwidth SRAM with CEN-controlled clock gating and ZZ sleep mode for dynamic power management. Use Value: Reduces average power consumption by >40% during idle periods while retaining full data integrity in sleep mode. | Use Scenario: Holding session state tables and policy rule sets for deep packet inspection engines. IC Role / Device Role / Timing Role: Deterministic-access memory supporting rapid random reads and partial-word writes for dynamic rule updates. Use Value: Enables sub-microsecond rule lookup latency and atomic 9-bit policy field updates using BW1/BW2 controls. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355BV18-133BZI | 133 MHz, 256K × 18, 3.3V, no ZBT™-uses conventional burst with turnaround cycles | Lacks zero-bus-turnaround; requires additional bus arbitration logic for back-to-back transfers | Choose when ZBT™ is not required and legacy Cypress footprint compatibility is prioritized |
| AS7C3256B-133JCIN | 133 MHz, 256K × 18, 3.3V, no JTAG, no burst counter, asynchronous OE | No burst addressing or IEEE 1149.1 support; simpler interface but higher software overhead for sequential access | Prefer for cost-sensitive designs where boundary scan and burst efficiency are non-critical |
Compared with CY7C1355BV18-133BZI and AS7C3256B-133JCIN, the 71V3558SA133BQG delivers measurable bus efficiency gains via ZBT™ and simplifies system test through integrated JTAG-making it optimal for high-throughput, testable telecom infrastructure where deterministic latency and production test coverage are mandatory.
Availability
71V3558SA133BQG is available at Aetrix Electronics and suitable for packet buffering, telecom line card memory, and baseband processor cache applications requiring stable component supply, long-term lifecycle support, and industrial temperature qualification.
Supply support for 71V3558SA133BQG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.
The 71V3558SA series belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency bus turnaround in high-speed networking and telecom infrastructure where deterministic memory access and burst efficiency are critical.
FAQ
What is the memory organization and density of the 71V3558SA133BQG?
The 71V3558SA133BQG is configured as 256K × 18 bits, delivering a total capacity of 4,718,592 bits (4.5 Mbit). This x18 organization aligns with common 18-bit data buses in telecom and networking ASICs, and its 165-ball BQG package supports high-density PCB layouts without compromising signal integrity.
Does the 71V3558SA133BQG support burst read and write operations?
Yes, the 71V3558SA133BQG supports 4-word burst operations in both linear and interleaved sequences, controlled by the LBO pin. Burst mode is initiated by sampling ADV/LD high after initial address load, and each burst cycle advances the internal counter-reducing address bus transactions by 75% per burst.
What is the role of the ZZ (Sleep Mode) pin on the 71V3558SA133BQG?
The ZZ pin on the 71V3558SA133BQG is a synchronous sleep mode input. When driven high, it gates the internal clock and reduces power consumption to the lowest level while guaranteeing full data retention. This feature is essential for power-aware telecom systems that require rapid wake-up with zero data loss.
How does the ZBT™ architecture improve system performance in the 71V3558SA133BQG?
The ZBT™ architecture in the 71V3558SA133BQG eliminates dead cycles between read and write operations by allowing immediate bus direction reversal. Unlike conventional SRAMs that insert wait states, this enables true back-to-back memory transactions-increasing effective bandwidth by up to 30% in burst-intensive applications like packet forwarding.
Is JTAG boundary scan supported on the 71V3558SA133BQG, and which pins are used?
Yes, the 71V3558SA133BQG includes optional IEEE 1149.1-compliant JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and optional TRST are assigned to dedicated balls in the BQG package (per document 5281 tbl 25a), enabling full interconnect testing without requiring additional test hardware or board-level probes.
71V3558SA133BQG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V3558SA133BQG FAQ
1.How can I place an order for 71V3558SA133BQG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3558SA133BQG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3558SA133BQG reliable?
The price and inventory of 71V3558SA133BQG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3558SA133BQG is usually 5 days.
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6.How does Aetrix verify that 71V3558SA133BQG is sourced from the original manufacturer or authorized distributors?
All 71V3558SA133BQG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3558SA133BQG meets industry standards.
7.What is the process for return or replacement of 71V3558SA133BQG?
All 71V3558SA133BQG units undergo pre-shipment inspection (PSI). If there is an issue with 71V3558SA133BQG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3558SA133BQG part is unused and in its original packaging.
Return procedure for 71V3558SA133BQG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3558SA133BQG Tags

-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
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