Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 71V3558SA133BQG

Part No.:
71V3558SA133BQG
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V3558SA133BQG.pdf
Description:
IC SRAM 4.5MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,788

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

71V3558SA133BQG from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 256K × 18-bit organization (4.5 Mbit), 133 MHz maximum clock frequency, 3.5 ns clock-to-data access time, and zero bus turnaround architecture. It supports pipelined burst reads/writes, individual byte write control, and JTAG boundary scan in a 165-ball fine-pitch BGA (BQG) package for high-speed cache and buffer applications in networking and telecom systems.

For engineers reviewing the 71V3558SA133BQG datasheet, 71V3558SA133BQG pinout, 71V3558SA133BQG application, or 71V3558SA133BQG equivalent, key selection criteria include ZBT™ bus efficiency, 4-word burst capability (linear/interleaved), 3.3V I/O compatibility, industrial temperature support (–40°C to +85°C), and JTAG IEEE 1149.1 compliance for system-level testability.

Technical Context

This SRAM implements a fully synchronous, positive-edge-triggered architecture with registered address, data, and control inputs. Its ZBT™ feature eliminates dead cycles between read/write transitions by enabling immediate bus direction reversal without wait states.

The device integrates an on-chip 4-word burst counter controlled by ADV/LD and LBO pins, supports pipelined outputs via dual-register data paths, and includes three chip enables (CE1, CE2, CE2) for flexible depth expansion-enabling seamless integration into high-bandwidth memory subsystems requiring deterministic latency and low bus overhead.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 18-bit (4.5 Mbit); matches x18 bus width for compact high-density buffering
Max Clock Frequency133 MHz; enables 133 MT/s throughput with precise timing alignment to system clocks
Clock-to-Data Access3.5 ns; guarantees sub-4 ns read latency critical for real-time packet processing
Supply VoltageVDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; compatible with standard 3.3V logic interfaces and power rails
Burst Mode4-word linear or interleaved burst; reduces address bus traffic by 75% per burst transaction
Operating Temperature–40°C to +85°C; qualified for industrial-grade deployment in base stations and edge routers
JTAG SupportIEEE 1149.1 compliant; enables boundary-scan testing without additional test fixtures

Pinout & Package

Packaged in a 165-ball fine-pitch ball grid array (BQG) per JEDEC MO-207AD, with 1.0 mm ball pitch and 15.0 mm × 15.0 mm body size. Pinout validated per IDT document 5281 tbl 25a (256K × 18 configuration).

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address InputsSynchronous 18-bit address bus; latched on rising CLK edge with ADV/LD low
CLKSystem Clock InputPrimary timing reference; all synchronous operations aligned to rising edge
R/WRead/Write ControlSingle-pin mode select; determines cycle type at load time, not during burst
ADV/LDBurst Counter ControlLow = load new external address; high = increment internal burst counter
LBOBurst Order SelectStatic input: low = linear sequence, high = interleaved sequence
BW1–BW2Byte Write EnablesActive-low controls for two 9-bit bytes (I/O[0:8]/I/OP1 and I/O[9:17]/I/OP2)
CE1, CE2, CE2Chip EnablesThree independent enables (CE1/CE2 active-low, CE2 active-high) for multi-SRAM depth expansion
I/O0–I/O17, I/OP1–I/OP2Data I/O18-bit bidirectional data bus with registered input/output paths for pipelined operation
TMS, TDI, TCK, TDO, TRSTJTAG InterfaceIEEE 1149.1 boundary scan signals; TRST optional asynchronous reset
VDD, VDDQ, VSSPower/GroundVDD = 3.3V core supply; VDDQ = 3.3V I/O supply; separate rails reduce noise coupling

Key Features

FeatureDesign Value
ZBT™ Zero Bus TurnaroundEliminates dead cycles between read/write transitions-enables back-to-back memory accesses without bus idle time
Internally Synchronized OEOutput enable is fully synchronous; removes need for external OE timing control in pipelined systems
4-Word Burst CapabilityReduces address bus activity by 75% per burst; supports both linear and interleaved sequences via LBO pin
Individual Byte Write ControlBW1/BW2 allow selective 9-bit writes-critical for partial-word updates in protocol header manipulation
Three Chip EnablesEnables seamless depth expansion across multiple devices without external logic or address decoding overhead

Applications

Packet Buffering in Switch ASICsLine Card Memory in Telecom Routers

Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switch fabric.

IC Role / Device Role / Timing Role: High-speed, low-latency buffer with deterministic 3.5 ns access and zero-turnaround burst reads for header inspection pipelines.

Use Value: Enables full-line-rate packet processing at 10 Gbps+ by eliminating bus turnaround stalls during sequential header fetches.

Use Scenario: Acting as shared buffer memory for multiple DSP cores handling voice-over-IP channel aggregation.

IC Role / Device Role / Timing Role: Synchronous SRAM providing pipelined burst writes for real-time voice sample buffering with JTAG test access.

Use Value: Supports concurrent multi-core access via CE partitioning and maintains data integrity across –40°C to +85°C operating range.

Cache Memory in Baseband ProcessorsControl Plane Buffer in Network Security Appliances

Use Scenario: Serving as L2 instruction/data cache for ARM-based baseband processors in 4G/LTE femtocells.

IC Role / Device Role / Timing Role: Low-power, high-bandwidth SRAM with CEN-controlled clock gating and ZZ sleep mode for dynamic power management.

Use Value: Reduces average power consumption by >40% during idle periods while retaining full data integrity in sleep mode.

Use Scenario: Holding session state tables and policy rule sets for deep packet inspection engines.

IC Role / Device Role / Timing Role: Deterministic-access memory supporting rapid random reads and partial-word writes for dynamic rule updates.

Use Value: Enables sub-microsecond rule lookup latency and atomic 9-bit policy field updates using BW1/BW2 controls.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1355BV18-133BZI133 MHz, 256K × 18, 3.3V, no ZBT™-uses conventional burst with turnaround cyclesLacks zero-bus-turnaround; requires additional bus arbitration logic for back-to-back transfersChoose when ZBT™ is not required and legacy Cypress footprint compatibility is prioritized
AS7C3256B-133JCIN133 MHz, 256K × 18, 3.3V, no JTAG, no burst counter, asynchronous OENo burst addressing or IEEE 1149.1 support; simpler interface but higher software overhead for sequential accessPrefer for cost-sensitive designs where boundary scan and burst efficiency are non-critical

Compared with CY7C1355BV18-133BZI and AS7C3256B-133JCIN, the 71V3558SA133BQG delivers measurable bus efficiency gains via ZBT™ and simplifies system test through integrated JTAG-making it optimal for high-throughput, testable telecom infrastructure where deterministic latency and production test coverage are mandatory.

Availability

71V3558SA133BQG is available at Aetrix Electronics and suitable for packet buffering, telecom line card memory, and baseband processor cache applications requiring stable component supply, long-term lifecycle support, and industrial temperature qualification.

Supply support for 71V3558SA133BQG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.

The 71V3558SA series belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency bus turnaround in high-speed networking and telecom infrastructure where deterministic memory access and burst efficiency are critical.

FAQ

What is the memory organization and density of the 71V3558SA133BQG?

The 71V3558SA133BQG is configured as 256K × 18 bits, delivering a total capacity of 4,718,592 bits (4.5 Mbit). This x18 organization aligns with common 18-bit data buses in telecom and networking ASICs, and its 165-ball BQG package supports high-density PCB layouts without compromising signal integrity.

Does the 71V3558SA133BQG support burst read and write operations?

Yes, the 71V3558SA133BQG supports 4-word burst operations in both linear and interleaved sequences, controlled by the LBO pin. Burst mode is initiated by sampling ADV/LD high after initial address load, and each burst cycle advances the internal counter-reducing address bus transactions by 75% per burst.

What is the role of the ZZ (Sleep Mode) pin on the 71V3558SA133BQG?

The ZZ pin on the 71V3558SA133BQG is a synchronous sleep mode input. When driven high, it gates the internal clock and reduces power consumption to the lowest level while guaranteeing full data retention. This feature is essential for power-aware telecom systems that require rapid wake-up with zero data loss.

How does the ZBT™ architecture improve system performance in the 71V3558SA133BQG?

The ZBT™ architecture in the 71V3558SA133BQG eliminates dead cycles between read and write operations by allowing immediate bus direction reversal. Unlike conventional SRAMs that insert wait states, this enables true back-to-back memory transactions-increasing effective bandwidth by up to 30% in burst-intensive applications like packet forwarding.

Is JTAG boundary scan supported on the 71V3558SA133BQG, and which pins are used?

Yes, the 71V3558SA133BQG includes optional IEEE 1149.1-compliant JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and optional TRST are assigned to dedicated balls in the BQG package (per document 5281 tbl 25a), enabling full interconnect testing without requiring additional test hardware or board-level probes.

71V3558SA133BQG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V3558SA133BQG FAQ

1.How can I place an order for 71V3558SA133BQG through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3558SA133BQG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3558SA133BQG reliable?

The price and inventory of 71V3558SA133BQG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3558SA133BQG is usually 5 days.

3.What payment methods are accepted for 71V3558SA133BQG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3558SA133BQG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V3558SA133BQG?

71V3558SA133BQG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3558SA133BQG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3558SA133BQG?

For technical support, including 71V3558SA133BQG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3558SA133BQG requirements.

6.How does Aetrix verify that 71V3558SA133BQG is sourced from the original manufacturer or authorized distributors?

All 71V3558SA133BQG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3558SA133BQG meets industry standards.

7.What is the process for return or replacement of 71V3558SA133BQG?

All 71V3558SA133BQG units undergo pre-shipment inspection (PSI). If there is an issue with 71V3558SA133BQG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3558SA133BQG part is unused and in its original packaging.

Return procedure for 71V3558SA133BQG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

71V3558SA133BQG Tags

  • 71V3558SA133BQG
  • 71V3558SA133BQG PDF
  • 71V3558SA133BQG Datasheet
  • 71V3558SA133BQG Specifications
  • 71V3558SA133BQG Images
  • Renesas
  • Renesas 71V3558SA133BQG
  • Buy 71V3558SA133BQG
  • 71V3558SA133BQG Price
  • 71V3558SA133BQG Distributor
  • 71V3558SA133BQG Supplier
  • 71V3558SA133BQG Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER