Renesas 71V3558SA133BQGI
- Part No.:
- 71V3558SA133BQGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V3558SA133BQGI.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3558SA133BQGI from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit organization (4.5 Mbit), 133 MHz operation, 3.5 ns clock-to-data access, zero bus turnaround architecture, and pipelined outputs. It supports interleaved/linear 4-word burst reads/writes, individual byte write control (BW1–BW4), and operates across –40°C to +85°C for industrial embedded memory subsystems.
For engineers reviewing the 71V3558SA133BQGI datasheet, 71V3558SA133BQGI pinout, 71V3558SA133BQGI application, or 71V3558SA133BQGI equivalent, key selection criteria include ZBT™ timing compatibility, TQFP-100 package footprint, 3.3V I/O and core supply, JTAG IEEE 1149.1 support, and industrial temperature qualification - all critical for high-throughput packet buffering and cache coherency in networking ASIC interfaces.
Technical Context
The 71V3558SA133BQGI implements a fully synchronous, positive-edge-triggered pipeline with address/control/data registers clocked on CLK rising edge. Its ZBT™ architecture eliminates dead cycles between read/write transitions by decoupling bus direction control from data transfer timing.
It integrates an on-chip burst counter, selectable linear/interleaved burst order via LBO, and three chip enables (CE1, CE2, CE2) for depth expansion. Optional IEEE 1149.1 JTAG boundary scan is supported, with TRST, TMS, TDI, TCK, and TDO pins available in BGA packages - though not implemented in the TQFP variant of this specific part.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 256K × 18-bit mode via configuration |
| Max Clock Frequency | 133 MHz; enables 7.5 ns cycle time for sustained burst throughput |
| Access Time | 3.5 ns clock-to-data; guarantees deterministic output valid window for synchronous system timing closure |
| Supply Voltage | VDD = VDDQ = 3.3 V ±5%; dual-rail design isolates core logic from I/O noise |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade reliability in base station and router environments |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus traffic and improves bandwidth efficiency |
| Byte Write Control | BW1–BW4 enable independent 9-bit byte writes; avoids full-word overwrites in partial-update scenarios |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14, 16, and 66 tolerate VIH-level inputs without direct VDD connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous 18-bit address bus; A0–A16 used for 128K×36 mode; A17 enables 256K×18 mode |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous registers (address, control, I/O) align to this edge |
| R/W | Read/Write Control | Synchronous signal defining load-cycle operation type; sampled with ADV/LD to initiate read or write |
| ADV/LD | Burst Counter Control | Low = load external address; High = increment internal burst counter; determines burst sequence progression |
| BW1–BW4 | Byte Write Enables | Active-low per-byte controls for 9-bit segments; allows granular 36-bit word updates without masking logic |
| CE1, CE2, CE2 | Chip Enable Inputs | Three independent enables (CE1/CE2 active-low, CE2 active-high); enable depth expansion with no external logic |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous data path; registered input/output with 2-cycle latency from address load |
| ZZ | Sleep Mode Input | Active-high synchronous entry into low-power state; retains memory contents while gating internal clock |
| LBO | Burst Order Select | Static input selecting linear (LBO = low) or interleaved (LBO = high) burst addressing sequence |
| OE | Output Enable | Asynchronous control; tri-states outputs immediately when high - simplifies timing-critical bus sharing |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Architecture | Eliminates bus turnaround dead cycles between consecutive reads and writes - enabling continuous 133 MHz throughput without interlock stalls |
| Pipelined Output Buffer | Internally synchronized OE elimination - removes need for external OE timing control and simplifies PCB layout |
| 4-Word Burst Mode | Single address initiates four sequential data transfers; cuts address bus activity by 75% during streaming operations |
| Individual Byte Write | Four independent 9-bit write enables (BW1–BW4); permits partial-word updates without read-modify-write overhead |
| Three Chip Enables | CE1 (active-low), CE2 (active-low), CE2 (active-high) allow flexible depth expansion using standard logic levels |
Applications
| High-Speed Packet Buffering | Network Processor Cache Interface |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/3 switches with line-rate forwarding. IC Role / Device Role / Timing Role: Primary burst-access buffer providing zero-turnaround read-after-write capability for back-to-back packet processing. Use Value: Sustains 133 MHz burst throughput with 3.5 ns access, eliminating pipeline bubbles in multi-port switch fabric arbitration. | Use Scenario: Acting as instruction/data scratchpad between network processor cores and external DRAM controllers. IC Role / Device Role / Timing Role: Low-latency, pipelined SRAM interfacing directly to NP's synchronous bus with minimal glue logic. Use Value: 2-cycle deterministic latency from address load to data valid enables tight timing closure in 133 MHz NP clock domains. |
| Industrial PLC Data Logging | Medical Imaging Frame Buffer |
Use Scenario: Capturing time-stamped sensor data streams from multiple I/O modules in real-time control systems. IC Role / Device Role / Timing Role: Industrial-temperature SRAM storing burst-collected analog/digital samples before DMA transfer to host. Use Value: –40°C to +85°C rating ensures reliable operation in uncontrolled cabinet environments; ZZ sleep mode reduces power during idle intervals. | Use Scenario: Holding uncompressed DICOM image frames (e.g., 1024×1024×16-bit) during real-time reconstruction and display. IC Role / Device Role / Timing Role: High-bandwidth frame buffer supporting simultaneous read (display engine) and write (acquisition engine) with ZBT™ arbitration. Use Value: 4-word burst mode delivers >400 MB/s effective bandwidth - sufficient for real-time 30 fps 16-bit medical video streams. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355BV133BZC | 128K × 36-bit QDR SRAM; 133 MHz; separate read/write ports; no ZBT™ architecture | Requires dual-port controller logic; higher bandwidth but no zero-turnaround benefit for single-bus systems | Select when true concurrent read/write is required; avoid if legacy ZBT™ timing compatibility is mandatory |
| AS7C33128PFSI-133BIN | 128K × 36-bit sync SRAM; 133 MHz; no JTAG; no ZZ sleep; only commercial temp (0°C to +70°C) | Lacks industrial temperature range and power management features; no boundary scan test support | Acceptable for cost-sensitive non-industrial designs where JTAG debug and extended temp are not required |
Compared with CY7C1355BV133BZC and AS7C33128PFSI-133BIN, the 71V3558SA133BQGI uniquely delivers ZBT™ zero-turnaround operation in an industrial-qualified TQFP package with integrated JTAG and sleep mode - making it optimal for timing-critical, field-deployed networking and control systems requiring guaranteed interoperability and testability.
Availability
71V3558SA133BQGI is available at Aetrix Electronics and suitable for high-speed packet buffering, network processor cache interfaces, and industrial PLC data logging requiring stable component supply, long-term lifecycle support, and verified industrial temperature performance.
Supply support for 71V3558SA133BQGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.
The 71V3558SA133BQGI belongs to IDT's ZBT™ synchronous SRAM product line, engineered specifically for zero-turnaround bus protocols in high-throughput networking ASICs, routers, and telecom baseband processors.
FAQ
What is the memory organization and density of the 71V3558SA133BQGI?
The 71V3558SA133BQGI is configured as 128K × 36-bit, delivering 4,718,592 bits (4.5 Mbit) of synchronous SRAM. It also supports 256K × 18-bit mode via address pin mapping, maintaining full pin compatibility and timing behavior in both configurations. This dual-mode flexibility allows system designers to optimize data bus width without changing the 71V3558SA133BQGI footprint or timing constraints.
Does the 71V3558SA133BQGI support JTAG boundary scan, and which package types include it?
The 71V3558SA133BQGI includes optional IEEE 1149.1 JTAG boundary scan functionality, but only in BGA packages (BG119/BQ165). The "SA" suffix denotes JTAG support, yet the TQFP-100 package (indicated by "BQGI") does not route TMS, TDI, TCK, TDO, or TRST pins - they are NC. Therefore, JTAG is not accessible on the 71V3558SA133BQGI; it is available only on BGA variants like 71V3558SA133BGIG.
How does the ZBT™ feature improve system performance compared to standard synchronous SRAMs?
The ZBT™ (Zero Bus Turnaround) feature in the 71V3558SA133BQGI eliminates dead cycles between successive read and write operations by decoupling bus direction control from data transfer timing. Unlike conventional SRAMs that require idle cycles to change bus direction, the 71V3558SA133BQGI allows immediate back-to-back reads and writes at full 133 MHz - increasing effective bandwidth by up to 30% in burst-intensive applications such as packet buffering and cache coherency protocols.
What is the function of the ADV/LD and LBO pins on the 71V3558SA133BQGI?
On the 71V3558SA133BQGI, ADV/LD is a synchronous input that loads a new external address when low (ADV/LD = L) or advances the internal burst counter when high (ADV/LD = H). LBO is a static input selecting burst order: low enables linear addressing (0,1,2,3), high enables interleaved (0,2,1,3). Both signals are essential for configuring the 4-word burst behavior - a core timing advantage of the 71V3558SA133BQGI in streaming memory applications.
Can the 71V3558SA133BQGI operate with different supply voltages for core and I/O rails?
No - the 71V3558SA133BQGI requires matched 3.3 V ±5% supplies on both VDD (core) and VDDQ (I/O) rails. While physically separate pins, they must be tied to the same 3.3 V source per datasheet specification. Deviating from this violates the recommended operating conditions and risks timing violations or data corruption, as the device's internal register synchronization depends on tightly coupled voltage domains. This constraint applies uniformly across all 71V3558SA133BQGI operating modes and temperature ranges.
71V3558SA133BQGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V3558SA133BQGI FAQ
1.How can I place an order for 71V3558SA133BQGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3558SA133BQGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3558SA133BQGI reliable?
The price and inventory of 71V3558SA133BQGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3558SA133BQGI is usually 5 days.
3.What payment methods are accepted for 71V3558SA133BQGI?
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Once your 71V3558SA133BQGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3558SA133BQGI?
For technical support, including 71V3558SA133BQGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3558SA133BQGI requirements.
6.How does Aetrix verify that 71V3558SA133BQGI is sourced from the original manufacturer or authorized distributors?
All 71V3558SA133BQGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3558SA133BQGI meets industry standards.
7.What is the process for return or replacement of 71V3558SA133BQGI?
All 71V3558SA133BQGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V3558SA133BQGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3558SA133BQGI part is unused and in its original packaging.
Return procedure for 71V3558SA133BQGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3558SA133BQGI Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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Microchip Technology

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Microchip Technology

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Microchip Technology
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Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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