Renesas 71V3558SA133BQGI8
- Part No.:
- 71V3558SA133BQGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V3558SA133BQGI8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3558SA133BQGI8 from Renesas is a 3.3V, 128K × 36-bit (4.5 Mbit) synchronous ZBT™ SRAM with zero bus turnaround, 133 MHz operation (7.5 ns clock-to-data), pipelined outputs, and JTAG boundary scan (IEEE 1149.1). It supports interleaved/linear 4-word burst reads/writes, individual byte write control (BW1–BW4), and operates across –40°C to +85°C for industrial embedded memory subsystems.
For engineers reviewing the 71V3558SA133BQGI8 datasheet, 71V3558SA133BQGI8 pinout, 71V3558SA133BQGI8 application, or 71V3558SA133BQGI8 equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, burst counter behavior under ADV/LD control, and JTAG test interface availability in the SA variant.
Technical Context
The 71V3558SA133BQGI8 implements a fully synchronous, pipelined architecture where address/control registration occurs on the rising CLK edge, with data access occurring two cycles later. Its ZBT™ feature eliminates dead cycles between read/write transitions by decoupling bus direction control from OE and using internal synchronization of output enable.
It integrates a programmable burst counter (LBO-selectable linear/interleaved), three chip enables (CE1, CE2 active-low; CE2 active-high), and a dedicated sleep mode (ZZ) that gates CLK internally while guaranteeing data retention. The SA version includes optional IEEE 1149.1-compliant JTAG (TMS/TDI/TCK/TDO/TRST) for boundary scan testing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 256K × 18-bit via pin-compatible mapping |
| Max Clock Frequency | 133 MHz - enables 7.5 ns clock-to-data access time for high-throughput memory subsystems |
| Supply Voltages | VDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O) - requires separate low-noise regulation paths |
| Burst Capability | 4-word burst (linear or interleaved) - reduces address bus traffic and improves bandwidth efficiency |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade reliability in harsh environments |
| JTAG Support | IEEE 1149.1-compliant boundary scan (TMS/TDI/TCK/TDO/TRST) - enables production test and debug visibility |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard) - compatible with standard SMT assembly and thermal management |
Pinout & Package
71V3558SA133BQGI8 is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14/16/66 tolerate VIH-level input without direct VDD connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous inputs latched on rising CLK edge; A0–A16 used for 128K×36 mode; A17 unused |
| CLK | System Clock Input | Rising-edge-triggered master timing reference; all synchronous operations referenced to this edge |
| R/W | Read/Write Control | Synchronous signal defining cycle type; determines data flow direction two cycles later |
| ADV/LD | Burst Address Advance / Load | High = increment internal burst counter; Low = load new external address into register |
| LBO | Burst Order Select | Static input: Low = linear burst sequence; High = interleaved burst sequence |
| BW1–BW4 | Byte Write Enables | Active-low synchronous controls for 9-bit bytes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CE1, CE2, CE2 | Chip Enable Inputs | Three independent enables: CE1/CE2 active-low, CE2 active-high; any false deselects device in two cycles |
| OE | Output Enable | Asynchronous, active-low; tri-states I/Os immediately when high - no timing coordination required |
| TMS, TDI, TCK, TDO, TRST | JTAG Test Interface | IEEE 1149.1 boundary scan signals; TRST optional asynchronous reset; all except TDO are inputs |
| VDD, VDDQ, VSS | Power & Ground | VDD = 3.3V core; VDDQ = 3.3V I/O; VSS = common ground - require local decoupling per JEDEC layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between read/write transitions - enables continuous high-bandwidth bus utilization without turnaround overhead |
| Pipelined Output Buffer | Internally synchronized OE eliminates need for external OE timing control - simplifies system timing closure |
| 4-Word Burst Counter | Reduces address bus activity by 75% per burst - improves effective throughput and lowers controller complexity |
| Individual Byte Write (BW1–BW4) | Enables partial-word writes without read-modify-write - preserves data integrity and reduces latency in mixed-access systems |
| Three Chip Enables | Supports seamless depth expansion across multiple devices - enables scalable memory capacity without additional logic |
| Sleep Mode (ZZ) | Gates internal clock and reduces power consumption while retaining data - extends battery life in portable industrial equipment |
Applications
| Network Packet Buffering | Industrial PLC Data Cache |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with line-rate throughput requirements. IC Role / Device Role / Timing Role: High-speed, low-latency buffer providing zero-turnaround burst reads/writes to match MAC controller timing. Use Value: 133 MHz clock rate and pipelined outputs sustain >500 MB/s sustained bandwidth; ZBT™ eliminates inter-packet gaps caused by bus turnaround delays. |
Use Scenario: Real-time I/O data caching in programmable logic controllers handling analog/digital sensor inputs and actuator outputs. IC Role / Device Role / Timing Role: Industrial-grade SRAM serving as deterministic, low-jitter working memory for cyclic control tasks. Use Value: –40°C to +85°C rating ensures reliability in uncontrolled cabinet environments; ZZ sleep mode reduces standby power during idle cycles. |
| Telecom Baseband Processing | Medical Imaging Frame Buffer |
|
Use Scenario: Temporary storage of baseband IQ samples in 4G/5G remote radio units before FFT processing or digital upconversion. IC Role / Device Role / Timing Role: Synchronous burst-capable memory interfacing directly with FPGA-based DSP engines. Use Value: 4-word burst mode aligns with common FFT block sizes; JTAG support enables in-system verification of memory integrity pre-deployment. |
Use Scenario: Capturing and staging uncompressed DICOM image frames from ultrasound or MRI front-end ADCs prior to compression or display. IC Role / Device Role / Timing Role: High-reliability, low-access-latency frame buffer ensuring deterministic pixel pipeline timing. Use Value: 128K×36 organization maps efficiently to 1024×1024×32-bit pixel buffers; TQFP package supports reflow-compatible medical PCB assembly. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 71V3558SA133BG108 | Same 128K×36 ZBT™ SRAM, but in 119-ball BGA package - different footprint, thermal profile, and board routing constraints | Preferred for space-constrained, high-density designs where TQFP rework is impractical; requires BGA assembly capability | Select when board area is critical and JTAG test access remains essential; verify thermal dissipation in sealed enclosures |
| 71V3558SA100BQGI8 | Same TQFP-100 package and SA feature set, but rated for 100 MHz (10 ns access) - lower max frequency, relaxed timing margins | Suitable for cost-sensitive industrial controllers where 133 MHz bandwidth is unnecessary | Choose for legacy system upgrades or lower-power operation; retains identical pinout and software compatibility |
Compared with 71V3558SA133BQGI8, the BG108 alternative offers higher density at the cost of assembly complexity, while the 100 MHz variant trades speed for margin and cost - both preserve ZBT™ functionality, JTAG, and industrial temperature range.
Availability
71V3558SA133BQGI8 is available at Aetrix Electronics and suitable for network packet buffering, industrial PLC data caching, telecom baseband processing, and medical imaging frame buffering requiring stable component supply across extended product lifecycles.
Supply support for 71V3558SA133BQGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V3558SA133BQGI8 belongs to Renesas' ZBT™ synchronous SRAM product line, engineered specifically for high-performance, low-latency memory subsystems in networking, telecommunications, and real-time industrial control where deterministic timing and bus efficiency are critical.
FAQ
What is the maximum operating frequency and corresponding access time for the 71V3558SA133BQGI8?
The 71V3558SA133BQGI8 is rated for 133 MHz operation, delivering a 7.5 ns clock-to-data access time. This specification is guaranteed over the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions. Timing parameters assume proper setup/hold compliance relative to the rising CLK edge and valid CEN/CE states.
Does the 71V3558SA133BQGI8 support both linear and interleaved burst modes, and how is selection controlled?
Yes, the 71V3558SA133BQGI8 supports both linear and interleaved 4-word burst sequences. Selection is controlled by the static LBO (Linear Burst Order) input: LBO = LOW selects linear order; LBO = HIGH selects interleaved order. LBO must remain stable during burst operation and is sampled asynchronously but affects only burst counter behavior.
How does the ZBT™ feature eliminate dead cycles between read and write operations in the 71V3558SA133BQGI8?
The 71V3558SA133BQGI8 implements ZBT™ by decoupling bus direction control from external OE and using internally synchronized output enable logic. This allows immediate transition from write to read (or vice versa) without waiting for bus turnaround delays - the next valid R/W cycle begins on the subsequent clock edge with no inserted idle cycles.
What JTAG signals are implemented on the 71V3558SA133BQGI8, and is TRST mandatory?
The 71V3558SA133BQGI8 implements full IEEE 1149.1 JTAG boundary scan with TMS, TDI, TCK, TDO, and optional TRST. TRST is asynchronous and optional - if unused, it may be left floating (internally pulled up). JTAG functionality is exclusive to the "SA" variant and is not present in base "S" versions.
Can the 71V3558SA133BQGI8 operate with only one chip enable asserted, and what happens during deselect?
Yes - the 71V3558SA133BQGI8 requires CE1 = LOW, CE2 = LOW, and CE2 = HIGH for selection; asserting any one of these to its inactive state initiates deselect. Deselect is two-cycle deep: pending transfers complete, then the data bus tri-states two clocks after the deselect condition is sampled. This ensures deterministic bus release timing.
71V3558SA133BQGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V3558SA133BQGI8 FAQ
1.How can I place an order for 71V3558SA133BQGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3558SA133BQGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3558SA133BQGI8 reliable?
The price and inventory of 71V3558SA133BQGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3558SA133BQGI8 is usually 5 days.
3.What payment methods are accepted for 71V3558SA133BQGI8?
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4.How is shipping managed for 71V3558SA133BQGI8?
71V3558SA133BQGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3558SA133BQGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3558SA133BQGI8?
For technical support, including 71V3558SA133BQGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3558SA133BQGI8 requirements.
6.How does Aetrix verify that 71V3558SA133BQGI8 is sourced from the original manufacturer or authorized distributors?
All 71V3558SA133BQGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3558SA133BQGI8 meets industry standards.
7.What is the process for return or replacement of 71V3558SA133BQGI8?
All 71V3558SA133BQGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3558SA133BQGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3558SA133BQGI8 part is unused and in its original packaging.
Return procedure for 71V3558SA133BQGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3558SA133BQGI8 Tags

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M24C02-WMN6TP
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Microchip Technology
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