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Renesas 71V3558SA166BQG8

Part No.:
71V3558SA166BQG8
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V3558SA166BQG8.pdf
Description:
IC SRAM 4.5MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,312

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Product details

Overview

71V3558SA166BQG8 from IDT (now Renesas) is a 3.3V, 128K × 36-bit (4.5 Mbit) synchronous ZBT™ SRAM with zero bus turnaround, 166 MHz operation, 3.5 ns clock-to-data access, pipelined outputs, and integrated JTAG boundary scan (IEEE 1149.1). It serves as high-speed buffer/cache memory in network packet processors and telecom line cards requiring deterministic burst read/write without dead cycles.

For engineers reviewing the 71V3558SA166BQG8 datasheet, 71V3558SA166BQG8 pinout, 71V3558SA166BQG8 application, or 71V3558SA166BQG8 equivalent, this page delivers verified timing behavior, validated TQFP-100 pin mapping, industrial-grade thermal specs (–40°C to +85°C), and direct alternatives for ZBT SRAM migration in backplane switching and FPGA co-processor designs.

Technical Context

The 71V3558SA166BQG8 implements a fully synchronous, positive-edge-triggered architecture with registered address, control, and data paths - enabling full pipelining across three clock stages: address/control capture → internal memory access → output register latch. Its ZBT™ feature eliminates bus turnaround latency by allowing immediate read-after-write or write-after-read transitions without wait states.

It integrates a 4-word burst counter (linear/interleaved via LBO pin), individual byte write enables (BW1–BW4), three chip enables (CE1, CE2, CE2) for depth expansion, and optional IEEE 1149.1 JTAG boundary scan with TRST support - all operating at 3.3V core (VDD) and I/O (VDDQ) supplies with ±5% tolerance.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36-bit (4.5 Mbit); supports x36 interface with 36-bit data bus (I/O[0:31] + I/OP1–I/OP4)
Max Clock Frequency 166 MHz; enables 6.0 ns cycle time for sustained burst throughput in high-bandwidth interconnects
Clock-to-Data Access 3.5 ns (typical); guarantees deterministic read latency for real-time packet buffering applications
Supply Voltage VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; dual-rail design isolates core logic noise from I/O signaling
Operating Temperature –40°C to +85°C (industrial grade); qualified for deployment in carrier-grade telecom equipment
Package 100-pin TQFP (14 mm × 20 mm, JEDEC standard); compatible with automated SMT assembly and thermal management
JTAG Support IEEE 1149.1 compliant with TMS/TDI/TCK/TDO/TRST; enables in-system test and board-level diagnostics

Pinout & Package

71V3558SA166BQG8 is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm pitch. Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14, 16, and 66 tolerate VIH-level inputs without direct VDD connection.

Pin/Terminal Circuit Role Design Meaning
A0–A16 Address Inputs 17-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled
CLK Clock Input Primary timing reference; all synchronous inputs sampled on rising edge; OE is sole asynchronous signal
R/W Read/Write Control Synchronous command; determines load-cycle operation type (read or write); data transfer occurs two cycles later
ADV/LD Advance Burst / Load Address Controls burst counter (HIGH) or loads new external address (LOW); critical for burst sequence management
BW1–BW4 Byte Write Enables Four active-low signals enabling independent 9-bit byte writes; allows partial-word updates without masking logic
CE1, CE2, CE2 Chip Enables Three-signal enable scheme: CE1=LOW, CE2=LOW, CE2=HIGH selects device; any violation initiates 2-cycle deselect
I/O0–I/O31, I/OP1–I/OP4 Data I/O Bus 36-bit bidirectional synchronous bus; input and output paths both registered for pipelined timing compliance
LBO Burst Order Select Static input selecting linear (LBO=LOW) or interleaved (LBO=HIGH) 4-word burst addressing sequence
TMS, TDI, TCK, TDO, TRST JTAG Boundary Scan IEEE 1149.1 interface; TRST is optional asynchronous reset; all JTAG pins have internal pull-ups
ZZ Sleep Mode Active-high synchronous input gating internal CLK; reduces power while retaining data; pin 64 in TQFP

Key Features

Feature Design Value
ZBT™ Zero Bus Turnaround Eliminates dead cycles between consecutive reads/writes - enables continuous 166 MHz burst streaming without pipeline stalls
Pipelined Output Registers Internally synchronized OE eliminates need for external timing control; outputs stable on second clock edge after access
4-Word Burst Counter Hardware-accelerated sequential access; reduces address bus traffic by 75% during block transfers in packet buffers
Individual Byte Write (BW1–BW4) Enables precise 9-bit sub-word updates - avoids full-word read-modify-write in protocol header manipulation
Three-Chip-Enable Architecture Supports seamless depth expansion (e.g., 128K×72 or 256K×36) without external logic or address decoding overhead
JTAG Boundary Scan (IEEE 1149.1) Facilitates PCB-level structural testing and interconnect verification - critical for high-reliability telecom backplanes

Applications

Network Packet Buffering Telecom Line Card Cache

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in multi-gigabit switches.

IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level packet buffer with deterministic 3.5 ns read access and zero-turnaround burst writes.

Use Value: Enables wire-speed processing of 10 Gbps+ traffic by eliminating bus idle cycles during header rewrite and payload reassembly.

Use Scenario: Caching ATM cell headers and control metadata in OC-192 SONET line cards.

IC Role / Device Role / Timing Role: Synchronous ZBT SRAM providing pipelined 166 MHz burst reads for real-time cell scheduling logic.

Use Value: Guarantees sub-4 ns access for time-critical header lookups, reducing jitter in cell multiplexing and QoS enforcement.

FPGA Co-Processor Memory Backplane Switching Fabric

Use Scenario: Offloading memory-intensive tasks (e.g., table lookup, CRC calculation) from FPGA fabric to dedicated SRAM.

IC Role / Device Role / Timing Role: Externally interfaced SRAM with registered I/O and burst capability, synchronized to FPGA clock domain.

Use Value: Frees FPGA logic resources by handling 4-word bursts per address - cuts external memory transaction count by 75%.

Use Scenario: Interfacing between switch fabric ASICs and line interface modules in modular chassis systems.

IC Role / Device Role / Timing Role: Bidirectional, low-jitter SRAM buffer managing flow-controlled data transfers across hot-swappable modules.

Use Value: Industrial temperature rating (–40°C to +85°C) and JTAG testability ensure reliability in uncontrolled chassis environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ZBT SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1355BV18-166BZC 256K × 18-bit organization; same 166 MHz speed, but narrower 18-bit bus; no JTAG support Better suited for width-constrained designs where 18-bit data path suffices; lacks boundary scan for production test Select when system uses 18-bit datapath and JTAG is unnecessary; requires redesign of data bus routing and width-handling logic
AS7C33128PFSIG 128K × 32-bit async SRAM; no ZBT, no burst, no pipelining; 15 ns access; no JTAG; commercial temp only Lower cost for non-real-time buffering; incompatible timing model - cannot replace 71V3558SA166BQG8 in pipelined systems Consider only for legacy upgrades with relaxed timing; not suitable for 166 MHz burst or zero-turnaround requirements

Compared with CY7C1355BV18-166BZC and AS7C33128PFSIG, the 71V3558SA166BQG8 uniquely delivers 128K×36 organization with ZBT™, JTAG, and industrial temperature support - making it irreplaceable in carrier-class, high-throughput, testable designs.

Availability

71V3558SA166BQG8 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card cache, FPGA co-processor memory, and backplane switching fabric applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for 71V3558SA166BQG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.

The 71V3558SA166BQG8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency, high-throughput data buffering in telecom, networking, and military/aerospace systems demanding deterministic timing and industrial reliability.

FAQ

What is the memory configuration and bus width of the 71V3558SA166BQG8?

The 71V3558SA166BQG8 is configured as 128K × 36-bit (4.5 Mbit), supporting a full 36-bit data bus comprising I/O[0:31] plus four parity bits on I/OP1–I/OP4. This matches x36 synchronous SRAM interfaces used in high-end packet processors and switch fabrics where wide data paths reduce transaction overhead.

Does the 71V3558SA166BQG8 support JTAG boundary scan, and which pins are used?

Yes, the 71V3558SA166BQG8 supports IEEE 1149.1 JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and optional TRST are assigned to JTAG functions - implemented on the TQFP-100 package per the "SA" variant designation. All JTAG pins include internal pull-up resistors, simplifying board-level implementation.

What is the role of the ADV/LD and LBO pins in burst operation of the 71V3558SA166BQG8?

ADV/LD controls whether the internal burst counter advances (HIGH) or loads a new external address (LOW). LBO selects burst order: LOW enables linear addressing (0,1,2,3), HIGH enables interleaved (0,2,3,1). Together, they define how the 71V3558SA166BQG8 executes its 4-word hardware burst - critical for optimizing memory bandwidth in streaming applications.

How does the ZBT™ feature eliminate bus turnaround latency in the 71V3558SA166BQG8?

The 71V3558SA166BQG8's ZBT™ architecture allows immediate transition from write to read (or vice versa) without inserting idle cycles. By decoupling bus direction control from memory access timing and using pipelined registers, it ensures the data bus remains active - achieving continuous 166 MHz throughput in burst sequences without dead cycles.

What is the function of the ZZ (Sleep Mode) pin on the 71V3558SA166BQG8, and how is it implemented in the TQFP package?

The ZZ pin on the 71V3558SA166BQG8 is an active-high synchronous input that gates the internal clock and places the device in ultra-low-power sleep mode while retaining memory contents. In the TQFP-100 package, ZZ is assigned to pin 64 - supported on the latest die revision and internally pulled down for default inactive state.

71V3558SA166BQG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V3558SA166BQG8 FAQ

1.How can I place an order for 71V3558SA166BQG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3558SA166BQG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3558SA166BQG8 reliable?

The price and inventory of 71V3558SA166BQG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3558SA166BQG8 is usually 5 days.

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71V3558SA166BQG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3558SA166BQG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3558SA166BQG8?

For technical support, including 71V3558SA166BQG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3558SA166BQG8 requirements.

6.How does Aetrix verify that 71V3558SA166BQG8 is sourced from the original manufacturer or authorized distributors?

All 71V3558SA166BQG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3558SA166BQG8 meets industry standards.

7.What is the process for return or replacement of 71V3558SA166BQG8?

All 71V3558SA166BQG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3558SA166BQG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3558SA166BQG8 part is unused and in its original packaging.

Return procedure for 71V3558SA166BQG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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