Renesas 71V3558SA166BQGI
- Part No.:
- 71V3558SA166BQGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V3558SA166BQGI.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,007
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Product details
Overview
71V3558SA166BQGI from IDT (now Renesas) is a 3.3V synchronous ZBT SRAM with 128K × 36-bit organization, 166 MHz operation, 3.5 ns clock-to-data access, zero bus turnaround architecture, and pipelined outputs. It serves as high-speed buffer/cache memory in network switches, telecom line cards, and packet processing engines requiring deterministic latency and burst throughput.
For engineers reviewing the 71V3558SA166BQGI datasheet, 71V3558SA166BQGI pinout, 71V3558SA166BQGI application, or 71V3558SA166BQGI equivalent, key selection criteria include ZBT timing compliance, 4-word burst mode (linear/interleaved), individual byte write control (BW1–BW4), JTAG IEEE 1149.1 support, and industrial temperature range (–40°C to +85°C) in 165-ball fine-pitch BGA packaging.
Technical Context
The 71V3558SA166BQGI implements a fully synchronous, positive-edge-triggered architecture with registered address, data, and control inputs. Its internal burst counter advances on ADV/LD = HIGH, enabling four-cycle data transfers per address load, with LBO selecting linear or interleaved sequence.
ZBT operation eliminates dead cycles between read/write transitions via synchronized output buffer enable and dual-phase chip enable logic (CE1, CE2, CE2). The device supports pipelined reads/writes with two-cycle latency from address/control registration to data valid, and includes optional boundary-scan JTAG for production testability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports depth expansion via three chip enables |
| Max Clock Frequency | 166 MHz; enables 6 ns cycle time for high-throughput packet buffering |
| Clock-to-Data Access | 3.5 ns; guarantees deterministic read latency for real-time traffic shaping |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus overhead in streaming applications |
| Supply Voltage | 3.3 V ±5% (VDD core), 3.3 V ±5% (VDDQ I/O); compatible with standard 3.3V logic domains |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade embedded networking hardware |
| JTAG Support | IEEE 1149.1 compliant; enables boundary-scan testing without external test fixtures |
Pinout & Package
Packaged in a JEDEC-standard 165-ball fine-pitch ball grid array (fBGA), BQ165 footprint, with 1.0 mm ball pitch and 13 mm × 13 mm body size. Pinout validated per IDT document 5281 tbl 25 (128K×36 fBGA configuration).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Positive-edge-triggered master timing reference; all synchronous registers latch on rising edge |
| A0–A16 | Address inputs | 17-bit address bus for 128K-word addressing; latched synchronously with CLK |
| R/W | Read/Write control | Synchronous signal defining cycle type; determines data direction two cycles later |
| ADV/LD | Burst advance/load | Drives internal burst counter when HIGH; loads new external address when LOW |
| LBO | Burst order select | Static input selecting linear (LOW) or interleaved (HIGH) burst sequence |
| BW1–BW4 | Byte write enables | Four independent active-low signals controlling 9-bit byte writes; supports partial-word updates |
| CE1, CE2, CE2 | Chip enables | Three-input logic: CE1=LOW, CE2=LOW, CE2=HIGH selects device; enables depth expansion |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional data bus with registered input/output paths; supports burst read/write |
| TMS, TDI, TCK, TDO, TRST | JTAG interface | IEEE 1149.1 boundary-scan pins; TRST is optional asynchronous reset (pull-up internal) |
| VDD, VDDQ, VSS | Power/Ground | VDD = 3.3V core supply; VDDQ = 3.3V I/O supply; separate rails reduce noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates idle cycles between consecutive read/write operations, enabling continuous bus utilization in packet forwarding pipelines |
| Internally synchronized OE | Removes need for external OE timing control; outputs enabled/disabled synchronously with CLK edge |
| 4-word burst with selectable order | Reduces address bus bandwidth by 75% per burst; LBO pin allows runtime selection of linear or interleaved addressing |
| Individual byte write control | Enables precise 9-bit sub-word writes without masking logic; BW1–BW4 can be tied low for full-word writes |
| Three chip enables for depth expansion | Supports seamless memory capacity scaling using CE1/CE2/CE2 logic; no external decode required |
Applications
| Network Packet Buffering | Telecom Line Card Cache |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level packet buffer with deterministic 3.5 ns read access. Use Value: Enables wire-speed packet classification and queuing without backpressure, leveraging ZBT to sustain 166 MHz burst reads/writes. | Use Scenario: Caching protocol state and signaling data in 3G/4G base station remote radio units. IC Role / Device Role / Timing Role: Synchronous cache memory interfacing directly with DSP or FPGA fabric via 36-bit bus. Use Value: 4-word burst mode reduces address setup overhead by 75%, accelerating channel estimation and beamforming lookups. |
| Industrial PLC Data Logging | Avionics Data Acquisition Buffer |
Use Scenario: Capturing sensor timestamps and analog-to-digital conversion results in deterministic real-time control loops. IC Role / Device Role / Timing Role: Industrial-temperature SRAM providing non-volatile-buffered storage for cyclic data acquisition. Use Value: –40°C to +85°C rating ensures reliability in uncontrolled cabinet environments; sleep mode (ZZ) reduces power during idle intervals. | Use Scenario: Buffering high-rate inertial measurement unit (IMU) samples before compression and downlink transmission. IC Role / Device Role / Timing Role: Radiation-tolerant-capable SRAM serving as FIFO buffer between ADC and flight controller SoC. Use Value: Pipelined outputs and clock enable (CEN) allow precise synchronization with avionics timing buses and graceful power-down during maintenance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1372KV18-167BZI | 128K × 18-bit organization, 167 MHz, 3.3V, no JTAG, different pinout | Requires two devices for 36-bit width; lacks burst counter and ZBT optimization | Select when cost-sensitive designs prioritize density over ZBT efficiency and require simpler test flow |
| AS7C33128P-166BIN | 128K × 32-bit, 166 MHz, 3.3V, no JTAG, no byte write enables, commercial temp only | Missing BWx controls and industrial temp grade; incompatible burst architecture | Choose for legacy systems where byte granularity and extended temperature are not required |
Compared with CY7C1372KV18-167BZI and AS7C33128P-166BIN, the 71V3558SA166BQGI uniquely delivers ZBT timing, integrated burst counter, four-byte write control, and industrial-temperature JTAG support in a single 165-ball fBGA package-enabling higher system-level throughput and reduced board complexity.
Availability
71V3558SA166BQGI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card caching, industrial PLC data logging, and avionics data acquisition requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 71V3558SA166BQGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V3558SA166BQGI belongs to IDT's ZBT SRAM product line, engineered specifically for zero-latency bus turnaround in high-speed packet processing, switching, and real-time control applications demanding deterministic timing and burst efficiency.
FAQ
What is the memory organization and total capacity of the 71V3558SA166BQGI?
The 71V3558SA166BQGI is configured as 128K × 36-bit, delivering 4,718,592 bits (4.5 Mbit) of synchronous SRAM. This organization supports direct interface to 36-bit data buses and enables efficient depth expansion using its three chip enable inputs (CE1, CE2, CE2) without external decoding logic.
Does the 71V3558SA166BQGI support burst read and write operations, and how is burst order controlled?
Yes, the 71V3558SA166BQGI supports 4-word burst operations in both read and write modes. Burst order is selected via the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW configures linear addressing (A0, A1, A2, A3), while LBO = HIGH selects interleaved (A0, A2, A1, A3). The internal burst counter advances on ADV/LD = HIGH.
What is the function of the ZZ (Sleep Mode) pin on the 71V3558SA166BQGI, and what power savings does it provide?
The ZZ pin on the 71V3558SA166BQGI is a synchronous sleep mode input. When driven HIGH, it gates the internal clock and reduces power consumption to its lowest level while guaranteeing data retention. This feature is critical for power-constrained industrial and avionics applications where periodic low-power states are required without data loss.
How does the ZBT™ (Zero Bus Turnaround) feature improve system performance in the 71V3558SA166BQGI?
ZBT™ eliminates dead cycles between consecutive read and write operations by synchronizing output buffer enable and using pipelined control logic. In the 71V3558SA166BQGI, this enables immediate bus turnaround-e.g., a write cycle can be followed directly by a read cycle without idle clocks-maximizing bandwidth utilization in packet-forwarding engines and real-time buffers.
Is JTAG boundary-scan supported on the 71V3558SA166BQGI, and which pins are used?
Yes, the 71V3558SA166BQGI includes optional IEEE 1149.1-compliant JTAG boundary-scan. Pins TMS, TDI, TCK, TDO, and optional TRST are dedicated to this function and are assigned to specific balls in the BQ165 fBGA package (per IDT doc 5281 tbl 25). TRST is internally pulled up and may be left floating if unused.
71V3558SA166BQGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V3558SA166BQGI FAQ
1.How can I place an order for 71V3558SA166BQGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3558SA166BQGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 71V3558SA166BQGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3558SA166BQGI is usually 5 days.
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6.How does Aetrix verify that 71V3558SA166BQGI is sourced from the original manufacturer or authorized distributors?
All 71V3558SA166BQGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3558SA166BQGI meets industry standards.
7.What is the process for return or replacement of 71V3558SA166BQGI?
All 71V3558SA166BQGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V3558SA166BQGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3558SA166BQGI part is unused and in its original packaging.
Return procedure for 71V3558SA166BQGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3558SA166BQGI Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
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