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Renesas 71V3559S80BG

Part No.:
71V3559S80BG
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V3559S80BG.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,756

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Product details

Overview

71V3559S80BG from Integrated Device Technology is a 3.3V synchronous ZBT™ SRAM organized as 128K x 36 (4.5 Mbit), featuring flow-through outputs, 4-word burst capability (linear or interleaved), and zero bus turnaround for high-speed memory interfacing in networking and telecom data paths. It operates at 100 MHz with 7.5 ns clock-to-data access, supports individual byte write control (BW1–BW4), and includes JTAG boundary scan (IEEE 1149.1).

For engineers reviewing the 71V3559S80BG datasheet, 71V3559S80BG pinout, 71V3559S80BG application, or 71V3559S80BG equivalent, key selection criteria include ZBT™ timing compatibility, TQFP-100 package footprint, 3.3V core/I/O supply requirements, burst sequence control via LBO, and support for depth expansion using CE1/CE2/CE2 chip enables.

Technical Context

The 71V3559S80BG implements a synchronous dual-register architecture: address/control inputs are latched on the rising edge of CLK when ADV/LD is low and chip enables are asserted; data output is flow-through (no output register), enabling immediate read response one cycle after address load. Burst addressing is managed by an internal counter advanced on ADV/LD high transitions.

It integrates three chip enables (CE1, CE2 active-low; CE2 active-high) for flexible depth expansion, a synchronous Clock Enable (CEN) to suspend operation without affecting register state, and optional IEEE 1149.1 JTAG test logic with TMS/TDI/TCK/TDO/TRST pins. Sleep mode (ZZ) gates internal clock and reduces power while retaining data.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128K × 36 bits (4.5 Mbit); supports 256K × 18 via pin-compatible variant
Clock Frequency100 MHz maximum - enables 10-ns cycle time in high-bandwidth packet buffering
Access Time7.5 ns clock-to-data - defines minimum latency between address load and valid read output
Supply VoltagesVDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O) - requires separate low-noise regulation
Burst Length4-word fixed burst - reduces address bus traffic during sequential memory accesses
Operating Temperature–40°C to +85°C (industrial grade) - qualified for base station and industrial control environments
Package100-pin TQFP (14 mm × 20 mm, JEDEC standard) - surface-mount compatible with automated assembly

Pinout & Package

71V3559S80BG is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 1 is located at top-left corner (notch-marked side), with pins numbered counter-clockwise.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address InputsSynchronous inputs latched on rising CLK edge when ADV/LD = LOW and chip enabled - 18-bit address space for 128K × 36 configuration
CE1, CE2, CE2Chip EnablesThree independent enables (CE1/CE2 active-low, CE2 active-high) allow multi-chip depth expansion without external logic
R/WRead/Write ControlSynchronous signal determining cycle type; data transfer occurs one clock cycle after R/W assertion
ADV/LDAddress Load / Burst AdvanceLOW loads new external address; HIGH increments internal burst counter - controls burst sequencing
LBOBurst Order SelectStatic input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word burst sequence per JEDEC standards
BW1–BW4Byte Write EnablesFour active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4)
CLKSystem Clock InputRising-edge-triggered master clock; all synchronous timing referenced to this edge
OEAsynchronous Output EnableActive-low; tri-states outputs immediately when HIGH - no timing dependency on CLK
ZZSleep Mode InputActive-high synchronous input gating internal clock to minimize power while preserving data retention
TMS, TDI, TCK, TDO, TRSTJTAG Test InterfaceIEEE 1149.1-compliant boundary scan chain - supports production testing and in-system diagnostics

Key Features

FeatureDesign Value
ZBT™ Zero Bus TurnaroundEliminates dead cycles between read/write transitions - enables back-to-back memory operations at full clock rate
Flow-Through OutputsNo output register; data appears on I/O pins one cycle after address load - reduces read latency vs. registered-output SRAMs
4-Word Burst CapabilitySingle address initiates four consecutive data transfers - cuts address bus bandwidth requirement by 75% for sequential access
Individual Byte Write ControlBW1–BW4 enable selective 9-bit writes without masking logic - simplifies partial-word updates in protocol engines
Three Chip EnablesCE1 (active-low), CE2 (active-low), CE2 (active-high) support hierarchical decoding for >1M-word memory systems
Optional JTAG Boundary ScanIEEE 1149.1 compliance enables board-level interconnect testing and debug visibility without dedicated test pads

Applications

High-Speed Packet BufferingNetwork Processor Interface

Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/3 switches with line-rate throughput.

IC Role / Device Role / Timing Role: Primary data buffer providing deterministic 7.5 ns read access and zero-turnaround write-read switching for cut-through forwarding.

Use Value: Enables sustained 10 Gbps+ packet processing by eliminating bus idle cycles between header lookup and payload store.

Use Scenario: Interfacing with multi-core network processors requiring low-latency, burst-capable shared memory.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as instruction/data scratchpad with flow-through outputs to match processor pipeline timing.

Use Value: Reduces memory wait states and supports 4-word burst reads aligned to processor word width, improving IPC efficiency.

Telecom Line Card MemoryIndustrial Real-Time Controller Cache

Use Scenario: Frame buffering in TDM-over-packet gateways handling E1/T1 and SONET/SDH mapping.

IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via ZBT™ timing, supporting simultaneous ingress buffering and egress scheduling.

Use Value: Guarantees jitter-free frame alignment with deterministic 100 MHz access - critical for CES and SAToP applications.

Use Scenario: Storing motion control trajectory tables and sensor fusion buffers in CNC and robotics controllers.

IC Role / Device Role / Timing Role: Deterministic-access memory for time-critical servo loop variables, leveraging sleep mode (ZZ) for power-gated idle periods.

Use Value: Industrial temperature rating (–40°C to +85°C) and data retention in ZZ mode ensure reliability in uncooled enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1355KV18-100BZI128K × 18 organization, 100 MHz, 3.3V, but lacks ZBT™ zero-turnaround and uses pipelined outputsRequires additional glue logic for turn-around management; not drop-in for ZBT™-optimized designsSelect only if system design accommodates pipelined output latency and does not require burst-sequential access patterns
AS7C33128PFSIG128K × 36, 100 MHz, 3.3V, flow-through outputs, but no JTAG, no ZZ sleep, and no LBO-configurable burst orderMissing industrial temp support and boundary scan - unsuitable for telecom or safety-critical deploymentsConsider for cost-sensitive commercial applications where JTAG testability and deep-sleep power savings are non-essential

Compared with CY7C1355KV18-100BZI and AS7C33128PFSIG, the 71V3559S80BG uniquely delivers ZBT™ timing, configurable burst ordering, IEEE 1149.1 testability, and industrial-grade sleep mode - making it the only option meeting full telecom infrastructure SRAM requirements.

Availability

71V3559S80BG is available at Aetrix Electronics and suitable for high-speed packet buffering, network processor interface, telecom line card memory, and industrial real-time controller cache requiring stable component supply across extended product lifecycles.

Supply support for 71V3559S80BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.

The 71V3559S80BG belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency memory subsystems in high-end networking and telecom equipment where deterministic burst access and bus turnaround elimination are mandatory.

FAQ

What is the memory organization and total capacity of the 71V3559S80BG?

The 71V3559S80BG is organized as 128K × 36 bits, delivering a total capacity of 4,718,592 bits (4.5 Mbit). This configuration supports 36-bit wide data paths common in network processors and DSP interfaces. The device shares pinout and timing with the 256K × 18 variant (71V3557S80BG), enabling layout reuse across density options.

Does the 71V3559S80BG support burst mode, and how is burst order controlled?

Yes, the 71V3559S80BG supports a fixed 4-word burst mode. Burst order is selected via the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW enables linear sequence (A0, A1, A2, A3), while LBO = HIGH selects interleaved order (A0, A2, A1, A3) per JEDEC standards. The burst counter advances synchronously on ADV/LD = HIGH.

What is the role of the ZZ pin on the 71V3559S80BG, and what power savings does it provide?

The ZZ pin on the 71V3559S80BG is a synchronous sleep mode input. When asserted HIGH, it gates the internal clock and reduces dynamic power consumption to its lowest level while guaranteeing data retention. This feature is essential for power-constrained telecom line cards and industrial controllers requiring low standby current without data loss.

Is JTAG boundary scan supported on the 71V3559S80BG, and which pins are used?

Yes, the 71V3559S80BG includes optional IEEE 1149.1-compliant JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and TRST (optional reset) implement the test access port. TRST may be left floating as the TAP controller resets automatically at power-up; all JTAG pins have internal pull-ups per datasheet specifications.

How does the 71V3559S80BG achieve zero bus turnaround, and what is its practical impact?

The 71V3559S80BG achieves zero bus turnaround (ZBT™) by eliminating dead cycles between read and write operations - the bus remains active with no idle clocks required for direction change. This allows back-to-back read-write sequences at full 100 MHz clock rate, directly improving throughput in packet buffering and protocol processing applications where memory bandwidth is critical.

71V3559S80BG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V3559S80BG FAQ

1.How can I place an order for 71V3559S80BG through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3559S80BG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3559S80BG reliable?

The price and inventory of 71V3559S80BG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3559S80BG is usually 5 days.

3.What payment methods are accepted for 71V3559S80BG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3559S80BG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V3559S80BG?

71V3559S80BG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3559S80BG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3559S80BG?

For technical support, including 71V3559S80BG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3559S80BG requirements.

6.How does Aetrix verify that 71V3559S80BG is sourced from the original manufacturer or authorized distributors?

All 71V3559S80BG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3559S80BG meets industry standards.

7.What is the process for return or replacement of 71V3559S80BG?

All 71V3559S80BG units undergo pre-shipment inspection (PSI). If there is an issue with 71V3559S80BG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3559S80BG part is unused and in its original packaging.

Return procedure for 71V3559S80BG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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