Renesas 71V3559S80BQG8
- Part No.:
- 71V3559S80BQG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V3559S80BQG8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3559S80BQG8 from Integrated Device Technology is a 3.3V synchronous ZBT™ SRAM organized as 256K x 18 (4.5 Mbit), featuring flow-through outputs, 4-word burst capability (linear or interleaved), and zero bus turnaround for seamless read/write transitions. It operates at 100 MHz with 7.5 ns clock-to-data access, supports individual byte write control (BW1–BW4), and includes JTAG boundary scan (IEEE 1149.1) for system-level testability in high-speed networking and packet buffering applications.
For engineers reviewing the 71V3559S80BQG8 datasheet, 71V3559S80BQG8 pinout, 71V3559S80BQG8 application, or 71V3559S80BQG8 equivalent, key selection criteria include its 100-pin TQFP package, synchronous 3.3V core/I/O supply, burst counter architecture, sleep mode (ZZ) support, and compatibility with ZBT™-optimized memory controllers in telecom infrastructure and FPGA-based data path designs.
Technical Context
The 71V3559S80BQG8 implements a synchronous dual-edge-triggered interface with ADV/LD controlling address load versus burst counter increment, and LBO selecting linear or interleaved burst order. Its flow-through output path eliminates output register latency, while internal synchronization of OE removes external timing constraints on output enable control.
It integrates three chip enables (CE1, CE2, CE2) with mixed polarity for flexible depth expansion, a dedicated Clock Enable (CEN) to suspend operation without clock gating, and optional JTAG test logic with TMS/TDI/TCK/TDO/TRST pins. Sleep mode (ZZ) gates the internal clock to minimize power while retaining data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K x 18 (4.5 Mbit); supports 18-bit data bus width with parity pins I/OP1–I/OP2 |
| Clock Frequency | 100 MHz maximum; enables 10-ns cycle time for high-bandwidth streaming buffer applications |
| Access Time | 7.5 ns clock-to-data (tCD); guarantees deterministic read latency for real-time packet processing |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate supplies reduce noise coupling between logic and data paths |
| Burst Capability | 4-word burst with programmable order (LBO pin); reduces address bus traffic by 75% per burst sequence |
| Operating Temperature | –40°C to +85°C (industrial grade); qualified for base station and industrial control environments |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); compatible with automated SMT assembly and thermal management |
Pinout & Package
71V3559S80BQG8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, with 0.5 mm lead pitch. Pin 1 is located at top-left corner (marking dot adjacent), and pin numbering follows counter-clockwise convention.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous inputs latched on rising CLK edge when ADV/LD = LOW and chip enabled; A0–A17 used fully for 256K x 18 configuration |
| CE1, CE2, CE2 | Chip Enables | Three independent enables: CE1/CE2 active-low, CE2 active-high; any false condition deactivates device after one cycle |
| R/W | Read/Write Control | Synchronous signal defining cycle type; determines data direction one clock cycle after address load |
| ADV/LD | Advance Burst / Load Address | LOW loads new external address; HIGH increments internal burst counter - critical for burst sequencing control |
| LBO | Linear/Interleaved Burst Order | Static input: LOW = linear burst (0,1,2,3), HIGH = interleaved (0,2,1,3); must remain stable during burst operation |
| BW1–BW4 | Byte Write Enables | Active-low synchronous controls for four 9-bit bytes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4); enables partial writes without masking logic |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous timing referenced to this edge; no internal clock division |
| OE | Output Enable | Asynchronous, active-low; tri-states outputs immediately - simplifies timing-critical read handshaking |
| ZZ | Sleep Mode | Active-high synchronous input; gates internal clock and reduces power consumption while preserving memory contents |
| I/O0–I/O15, I/OP1–I/OP2 | Data I/O | 18-bit bidirectional data bus (16 data + 2 parity); flow-through output path ensures no added latency on reads |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between consecutive reads and writes - enables back-to-back memory transactions without bus idle time |
| Flow-Through Outputs | No output register; data appears on I/O pins one clock cycle after read initiation - reduces read latency by one cycle vs registered outputs |
| 4-Word Burst Counter | Internally generates sequential addresses for four consecutive words using single ADV/LD assertion - cuts address bus activity by 75% |
| Individual Byte Write Control | Four independent BWx signals allow selective 9-bit byte updates without read-modify-write - essential for protocol header manipulation |
| JTAG Boundary Scan (IEEE 1149.1) | Full TAP controller with TMS/TDI/TCK/TDO/TRST supports board-level interconnect testing and in-system debug visibility |
| Synchronous Clock Enable (CEN) | Holds all internal registers and outputs unchanged when asserted - enables precise power gating without clock tree redesign |
Applications
| Packet Buffering in Switch ASICs | High-Speed FPGA Data Buffers |
|---|---|
Use Scenario: Temporary storage of variable-length Ethernet/IP packets in line-rate switching fabric. IC Role / Device Role / Timing Role: Asynchronous burst-access SRAM interfaced to switch fabric controller via ZBT™-compliant bus protocol. Use Value: 7.5 ns tCD and zero-turnaround enable full-line-rate buffering at 10 Gbps with deterministic latency under burst load. |
Use Scenario: Real-time data staging between high-speed ADC/DAC interfaces and FPGA processing pipelines. IC Role / Device Role / Timing Role: Synchronous memory co-processor providing low-latency, burst-capable scratchpad for FPGA soft-core DMA engines. Use Value: Flow-through outputs and 100 MHz clocking eliminate pipeline stalls during multi-word transfers between FPGA logic and external sensors/actuators. |
| Telecom Line Card Memory | Industrial PLC Data Logging |
Use Scenario: Storing frame headers, CRC metadata, and payload fragments in 4G/LTE baseband processing units. IC Role / Device Role / Timing Role: Dual-port accessible SRAM supporting concurrent read (DSP fetch) and write (PHY ingress) operations via burst interleaving. Use Value: Interleaved burst mode (LBO = HIGH) matches natural memory access patterns of OFDM symbol processing, improving bandwidth utilization by 30%. |
Use Scenario: Cyclic logging of sensor telemetry (temperature, pressure, vibration) in ruggedized factory automation controllers. IC Role / Device Role / Timing Role: Industrial-grade SRAM serving as nonvolatile-buffered log cache before flash write consolidation. Use Value: –40°C to +85°C operation and ZZ sleep mode ensure reliable data retention during brownouts and extended idle periods without battery backup. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355BV18-100BZXI | 100 MHz, 256K x 18 QDR SRAM; differential clock inputs, no ZZ or JTAG; 165-ball fBGA only | Targeted at QDR-optimized FPGA interfaces requiring higher peak bandwidth but lacking sleep mode or testability | Select when system requires QDR read/write concurrency and board layout accommodates BGA; not drop-in due to pinout and signaling differences |
| AS7C3256B-10JIN | 10 ns async SRAM, 32K x 8; no burst, no clock, no JTAG; 32-pin SOJ; 3.3V only | Used in legacy microcontroller-based systems where synchronous timing and burst features are unnecessary | Choose only for cost-sensitive, low-speed control-plane buffers; incompatible with ZBT™ timing model or clocked bus architectures |
Compared with CY7C1355BV18-100BZXI and AS7C3256B-10JIN, the 71V3559S80BQG8 uniquely combines ZBT™ zero-turnaround, integrated JTAG, industrial temperature range, and TQFP packaging - making it optimal for upgradeable telecom hardware and FPGA-based embedded systems requiring testability and thermal robustness.
Availability
71V3559S80BQG8 is available at Aetrix Electronics and suitable for packet buffering, FPGA co-processing, telecom line card memory, and industrial data logging requiring stable component supply across extended product lifecycles.
Supply support for 71V3559S80BQG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.
The 71V3559S80BQG8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for high-speed, low-latency data buffering in network infrastructure and real-time embedded systems where deterministic timing and bus efficiency are critical.
FAQ
What memory organization does the 71V3559S80BQG8 implement?
The 71V3559S80BQG8 implements a 256K x 18 organization (4.5 Mbit total), supporting an 18-bit data bus with two parity bits (I/OP1 and I/OP2). This configuration is distinct from the 128K x 36 variant (71V3557) and is optimized for systems requiring narrower, higher-speed data paths - such as FPGA-based packet processors and telecom PHY interfaces.
Does the 71V3559S80BQG8 support burst mode, and how is it configured?
Yes, the 71V3559S80BQG8 supports 4-word synchronous burst mode controlled by the ADV/LD and LBO pins. When ADV/LD is HIGH, the internal burst counter advances; LBO selects linear (LBO = LOW) or interleaved (LBO = HIGH) addressing order. Burst operation requires no external address generation, reducing controller overhead and bus contention in high-throughput applications.
What is the purpose of the ZZ pin on the 71V3559S80BQG8?
The ZZ pin on the 71V3559S80BQG8 enables synchronous sleep mode: when driven HIGH, it internally gates the clock and reduces dynamic power consumption while guaranteeing data retention. This feature is critical for energy-constrained telecom modules and industrial controllers that require periodic low-power states without data loss or external refresh circuitry.
How does the 71V3559S80BQG8 achieve zero bus turnaround (ZBT™)?
The 71V3559S80BQG8 achieves ZBT™ by eliminating dead cycles between read and write operations through synchronized control logic and flow-through outputs. Its R/W pin determines transaction type one cycle after address load, and the burst counter allows immediate continuation of sequential accesses - enabling back-to-back reads/writes without bus arbitration delays or turnaround penalties.
Is JTAG boundary scan supported on the 71V3559S80BQG8, and which pins are used?
Yes, the 71V3559S80BQG8 includes optional IEEE 1149.1 JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and TRST (pin 66 on TQFP) implement the full TAP controller. TRST is asynchronous and optional; if unused, it may be left floating (internally pulled up). JTAG enables production test coverage and in-system diagnostics without requiring additional test fixtures.
71V3559S80BQG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V3559S80BQG8 FAQ
1.How can I place an order for 71V3559S80BQG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3559S80BQG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3559S80BQG8 reliable?
The price and inventory of 71V3559S80BQG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3559S80BQG8 is usually 5 days.
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Once your 71V3559S80BQG8 order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for 71V3559S80BQG8?
For technical support, including 71V3559S80BQG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3559S80BQG8 requirements.
6.How does Aetrix verify that 71V3559S80BQG8 is sourced from the original manufacturer or authorized distributors?
All 71V3559S80BQG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3559S80BQG8 meets industry standards.
7.What is the process for return or replacement of 71V3559S80BQG8?
All 71V3559S80BQG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3559S80BQG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3559S80BQG8 part is unused and in its original packaging.
Return procedure for 71V3559S80BQG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3559S80BQG8 Tags

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