Renesas 71V3559S80PFGI
- Part No.:
- 71V3559S80PFGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V3559S80PFGI.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,269
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Product details
Overview
71V3559S80PFGI from Integrated Device Technology is a 3.3V synchronous ZBT™ SRAM organized as 128K x 36 (4.5 Mbit), featuring flow-through outputs, 4-word burst capability (linear or interleaved), and zero bus turnaround for high-speed memory interfacing in network packet buffers and cache controllers. It operates at 100 MHz with 7.5 ns clock-to-data access and supports industrial temperature range (–40°C to +85°C).
For engineers reviewing the 71V3559S80PFGI datasheet, 71V3559S80PFGI pinout, 71V3559S80PFGI application, or 71V3559S80PFGI equivalent, key selection criteria include burst mode control via ADV/LD and LBO pins, individual byte write enables (BW1–BW4), JTAG boundary scan support, and compatibility with 3.3V core/I/O supplies in TQFP-100 packaging.
Technical Context
The 71V3559S80PFGI implements a synchronous dual-edge-triggered architecture where address, control, and data-in signals are registered on the rising edge of CLK. Its internal burst counter advances on ADV/LD = HIGH, enabling four consecutive data transfers per address load without dead cycles between read/write transitions.
It features three chip enables (CE1, CE2, CE2) with mixed polarity - CE1/CE2 active-low and CE2 active-high - allowing flexible depth expansion. Output enable (OE) is asynchronous and tri-states I/Os independently of clock, while sleep mode (ZZ) gates the internal clock to reduce power with guaranteed data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits (4.5 Mbit); supports 256K × 18 via pin-compatible variant |
| Clock Frequency | 100 MHz maximum; enables 10 ns cycle time for high-bandwidth data streaming |
| Access Time | 7.5 ns clock-to-data (tCD); determines minimum latency from CLK rise to valid output |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); requires separate decoupling for noise isolation |
| Burst Mode | 4-word linear or interleaved burst; controlled by static LBO pin; eliminates external address sequencing logic |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for embedded telecom and industrial control environments |
| JTAG Support | IEEE 1149.1 compliant boundary scan (TMS/TDI/TCK/TDO/TRST); enables in-system testability and debug |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 64 supports ZZ (sleep mode) on latest die revisions; pins 83–84 reserved for future density expansion.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous inputs latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CE1, CE2, CE2 | Chip Enables | CE1/CE2 active-low, CE2 active-high; any false condition initiates one-cycle deselect and I/O tri-state |
| R/W | Read/Write Control | Synchronous signal defining operation type; data transfer occurs one cycle after load |
| ADV/LD | Advance Burst / Load Address | LOW loads new external address; HIGH increments internal burst counter; defines burst sequence timing |
| LBO | Linear/Interleaved Burst Order | Static input: LOW = linear, HIGH = interleaved; must remain stable during burst operation |
| BW1–BW4 | Byte Write Enables | Active-low per-9-bit-byte controls; allows partial writes without masking logic or extra glue |
| CLK | System Clock Input | Rising-edge-triggered master timing reference; all synchronous inputs referenced to this edge |
| OE | Asynchronous Output Enable | LOW enables flow-through outputs; HIGH forces I/Os to high-impedance regardless of clock state |
| ZZ | Sleep Mode Input | Active-high synchronous input that gates internal clock and reduces power; data retention guaranteed |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional bus; input path registered, output path flow-through (no output register) |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between read and write operations, enabling continuous data streaming in burst mode |
| Internally synchronized OE | Removes need for external OE timing control; simplifies interface design and reduces PCB routing complexity |
| Single R/W control pin | Reduces control bus width vs. separate RD/WR signals; lowers FPGA/GPIO resource usage in host systems |
| Individual byte write (BW1–BW4) | Enables precise 9-bit granularity writes without external byte-enable logic or data masking circuitry |
| Three chip enables with mixed polarity | Supports seamless depth expansion across multiple devices using standard logic-level translation |
| JTAG boundary scan (IEEE 1149.1) | Provides production test coverage and in-system debug capability without requiring additional test fixtures |
Applications
| Network Packet Buffer | Cache Controller Interface |
|---|---|
|
Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/3 switches before forwarding decisions. IC Role / Device Role / Timing Role: High-speed temporary storage with burst reads/writes aligned to packet boundaries. Use Value: 100 MHz operation and ZBT™ feature sustain >800 MB/s sustained throughput with no inter-burst gaps. |
Use Scenario: Acting as L2 cache tag/data RAM in microprocessor-based industrial controllers. IC Role / Device Role / Timing Role: Low-latency, deterministic-access memory supporting CPU-side burst transactions. Use Value: 7.5 ns tCD and flow-through outputs minimize cache miss penalty versus registered-output SRAMs. |
| Telecom Line Card Memory | DSP Co-Processor Buffer |
|
Use Scenario: Holding voice/data channel buffers in TDM-over-packet gateways operating at E1/T1 rates. IC Role / Device Role / Timing Role: Synchronous interface to FPGA-based framer logic with strict jitter tolerance. Use Value: Industrial temp rating and robust 3.3V I/O ensure reliable operation in uncooled line card environments. |
Use Scenario: Providing scratchpad memory for TI C6000 or Analog Devices SHARC DSPs executing real-time filtering. IC Role / Device Role / Timing Role: Off-chip high-bandwidth data buffer synchronized to DSP's external memory interface. Use Value: 4-word burst mode matches typical DSP DMA burst lengths, reducing address overhead by 75%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355KV18-100BZXI | 256K × 18 organization, 100 MHz, same TQFP-100 package but no JTAG or ZZ pin | Requires two devices for 128K × 36 width; lacks sleep mode and boundary scan | Select when cost-sensitive designs prioritize density over low-power or testability features |
| AS7C3128PFSIG | 128K × 36, 133 MHz, 2.5V core/3.3V I/O, no burst counter or ADV/LD functionality | Requires external burst address generation logic; incompatible ZBT™ timing model | Select only for non-burst, higher-frequency applications where zero turnaround is not required |
Compared with CY7C1355KV18-100BZXI and AS7C3128PFSIG, the 71V3559S80PFGI uniquely integrates burst addressing, sleep mode, and JTAG in a single 128K × 36 device - reducing system component count and enabling power-aware, testable designs without external logic.
Availability
71V3559S80PFGI is available at Aetrix Electronics and suitable for network packet buffers, telecom line cards, and DSP co-processor buffers requiring stable component supply across extended product lifecycles.
Supply support for 71V3559S80PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.
The 71V3559S80PFGI belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency memory subsystems in high-speed packet processing and real-time control applications.
FAQ
What is the maximum clock frequency supported by the 71V3559S80PFGI?
The 71V3559S80PFGI supports a maximum clock frequency of 100 MHz, corresponding to a 10 ns clock period. This is validated under industrial temperature conditions (–40°C to +85°C) with 3.3 V ±5% supply rails. The 7.5 ns clock-to-data access time (tCD) ensures data validity within the first half of the subsequent clock cycle, enabling tight timing closure in FPGA- or ASIC-based memory controllers.
Does the 71V3559S80PFGI support both linear and interleaved burst modes?
Yes, the 71V3559S80PFGI supports both linear and interleaved 4-word burst sequences, selected by the static LBO pin: LBO = LOW configures linear order (A0, A1, A2, A3), while LBO = HIGH selects interleaved order (A0, A2, A1, A3). The burst counter advances on each rising CLK edge when ADV/LD = HIGH, and the sequence wraps automatically after four words - a feature confirmed in the Interleaved and Linear Burst Sequence Tables of the datasheet.
How does the ZBT™ (Zero Bus Turnaround) feature function in the 71V3559S80PFGI?
The ZBT™ feature in the 71V3559S80PFGI eliminates dead cycles between successive read and write operations by allowing immediate transition from one access type to another without bus idle time. This is achieved through synchronized control logic and flow-through outputs, ensuring that the data bus remains active across consecutive cycles - a behavior verified in the Functional Timing Diagram and Mixed Load/Burst Operation Table of the official datasheet.
Is JTAG boundary scan supported on the 71V3559S80PFGI, and which pins are used?
Yes, the 71V3559S80PFGI includes IEEE 1149.1-compliant JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and optional TRST (pin 65 in TQFP-100) implement the test access port. These pins are dedicated and do not share functions with memory control signals - confirmed in the Pin Definitions table and Functional Block Diagram of the datasheet, with internal pull-ups on TMS, TDI, TCK, and TRST.
What is the role of the ZZ (Sleep Mode) pin on the 71V3559S80PFGI, and how is it implemented?
The ZZ pin on the 71V3559S80PFGI is a synchronous active-high input that gates the internal clock and places the device in low-power sleep mode while retaining memory contents. When asserted, it reduces dynamic power consumption significantly; data retention is guaranteed across the full industrial temperature range. Pin 64 in the TQFP-100 package supports ZZ on latest die revisions, as documented in the Pin Configuration diagrams and Absolute Maximum Ratings section.
71V3559S80PFGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V3559S80PFGI FAQ
1.How can I place an order for 71V3559S80PFGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3559S80PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3559S80PFGI reliable?
The price and inventory of 71V3559S80PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3559S80PFGI is usually 5 days.
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Once your 71V3559S80PFGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3559S80PFGI?
For technical support, including 71V3559S80PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3559S80PFGI requirements.
6.How does Aetrix verify that 71V3559S80PFGI is sourced from the original manufacturer or authorized distributors?
All 71V3559S80PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3559S80PFGI meets industry standards.
7.What is the process for return or replacement of 71V3559S80PFGI?
All 71V3559S80PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V3559S80PFGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3559S80PFGI part is unused and in its original packaging.
Return procedure for 71V3559S80PFGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3559S80PFGI Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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AT24C08C-STUM-T
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