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Renesas 71V3559S85BG

Part No.:
71V3559S85BG
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V3559S85BG.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,138

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Product details

Overview

71V3559S85BG from Integrated Device Technology is a 3.3V synchronous ZBT™ SRAM organized as 256K x 18 (4.5 Mbit), featuring flow-through outputs, 4-word burst capability (linear or interleaved), and zero bus turnaround for seamless read/write transitions. It operates at 100 MHz with 7.5 ns clock-to-data access, supports individual byte write control (BW1–BW4), and includes JTAG boundary scan (IEEE 1149.1) for system-level testability in high-speed networking and packet buffering applications.

For engineers reviewing the 71V3559S85BG datasheet, 71V3559S85BG pinout, 71V3559S85BG application, or 71V3559S85BG equivalent, this device delivers deterministic timing, synchronous burst addressing via ADV/LD, low-latency memory access without dead cycles, and industrial-temperature operation (–40°C to +85°C) in a JEDEC-standard 100-pin TQFP package.

Technical Context

The 71V3559S85BG implements a synchronous dual-edge-triggered architecture where address, control, and data-in are registered on the rising edge of CLK, while output data flows through without an output register-enabling immediate availability one cycle after read initiation. Its internal burst counter advances on ADV/LD = HIGH, with sequence order selected by static LBO pin (VSS = linear, VDD = interleaved).

Three chip enables (CE1, CE2 active-low; CE2 active-high) provide flexible depth expansion, while CEN suspends all synchronous logic without affecting output state. The optional JTAG interface (TMS/TDI/TCK/TDO/TRST) supports IEEE 1149.1 compliance, and ZZ pin enables synchronous sleep mode with guaranteed data retention.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K x 18 (4.5 Mbit); supports 18-bit data path with parity pins I/OP1–I/OP2
Clock Frequency 100 MHz maximum; enables 10-ns cycle time for high-throughput packet buffer systems
Access Time 7.5 ns clock-to-data (tCD); guarantees deterministic read latency for real-time traffic shaping
Supply Voltages VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate power domains reduce noise coupling
Operating Temperature –40°C to +85°C (industrial grade); validated for base station and industrial controller environments
Burst Mode 4-word burst (linear or interleaved); reduces address bus overhead in sequential memory access patterns
Byte Write Control BW1–BW4 enable independent 9-bit byte writes; eliminates full-word overwrite in partial updates

Pinout & Package

71V3559S85BG is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, with 0.5 mm pitch. Pin 64 supports ZZ (sleep mode) on latest die revisions; pins 83–84 are reserved for future density extensions.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs Synchronous 18-bit address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled
CE1, CE2, CE2 Chip Enables Three independent enables (CE1/CE2 active-low, CE2 active-high); allow multi-chip depth expansion with one-cycle deselect
R/W Read/Write Control Synchronous signal defining cycle type; determines data direction one clock cycle after load
ADV/LD Advance Burst / Load Address Controls burst counter (HIGH) or loads new external address (LOW); critical for burst sequencing
LBO Linear/Interleaved Burst Order Static input selecting burst pattern; must remain stable during operation to avoid sequence corruption
CLK System Clock Input Rising-edge-triggered master clock; all synchronous timing referenced to this edge
I/O0–I/O15, I/OP1–I/OP2 Data I/O (18-bit + 2 parity) Flow-through outputs; no output register-data appears one cycle after read initiation
ZZ Sleep Mode Input Active-high synchronous entry into lowest-power state; retains memory contents with gated internal clock

Key Features

Feature Design Value
ZBT™ Zero Bus Turnaround Eliminates dead cycles between read and write operations-enables back-to-back memory transactions without bus idle time
4-Word Synchronous Burst Reduces address bus activity by 75% for sequential accesses; supports both linear and interleaved sequences per LBO setting
Individual Byte Write (BW1–BW4) Enables selective 9-bit writes without masking or full-word reread-modify-write; critical for protocol header updates
JTAG Boundary Scan (IEEE 1149.1) Provides structural test coverage for PCB interconnects and board-level integration verification
Three Independent Chip Enables Supports flexible memory depth expansion across multiple devices with independent select control and one-cycle deselect
Flow-Through Output Architecture Delivers read data with minimal latency (1-cycle delay), avoiding pipeline stalls in time-critical datapaths

Applications

Packet Buffering in Switch ASICs Real-Time Protocol Processing

Use Scenario: High-speed Ethernet switch fabric buffers incoming/outgoing frames before forwarding decisions.

IC Role / Device Role / Timing Role: Primary 18-bit synchronous SRAM providing low-latency, burst-capable storage for frame headers and payload fragments.

Use Value: 7.5 ns tCD and ZBT™ operation enable line-rate buffering at 10 Gbps without pipeline bubbles or bus turnaround penalties.

Use Scenario: Deep packet inspection engine updating TCP/UDP checksums and TTL fields in real time.

IC Role / Device Role / Timing Role: Memory for temporary packet staging with byte-granular write capability for field edits.

Use Value: BW1–BW4 allows in-place 9-bit updates to checksum bytes without full-word read-modify-write, reducing latency by >3×.

Industrial PLC Data Logging Base Station Channel Buffers

Use Scenario: Deterministic logging of sensor inputs and actuator commands in safety-critical automation systems.

IC Role / Device Role / Timing Role: Industrial-grade SRAM storing timestamped I/O snapshots with guaranteed data retention in sleep mode.

Use Value: –40°C to +85°C rating and ZZ sleep mode ensure reliable operation during thermal cycling and power-save intervals.

Use Scenario: Per-channel uplink/downlink buffers in LTE/5G remote radio units requiring jitter-free memory access.

IC Role / Device Role / Timing Role: Burst-access memory supporting TDMA slot alignment with precise 100 MHz clock synchronization.

Use Value: Synchronous ADV/LD-controlled burst addressing ensures deterministic slot boundary alignment without software intervention.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1355BV18-100BZI 100 MHz, 256K × 18, but uses QDR-II+ architecture with separate read/write ports and no ZBT™ zero-turnaround Requires dual-port arbitration logic; better suited for simultaneous read/write workloads than burst-sequential access Select when true concurrent read/write bandwidth outweighs burst efficiency and deterministic turnaround needs
AS7C3256A-10JIN 10 ns async access, 32K × 8 organization; no burst, no JTAG, no synchronous clock domain Lacks ADV/LD, CEN, and burst control-requires external state machine for sequential access Choose only for cost-sensitive, non-burst, low-frequency control-plane memory where timing determinism is not required

Compared with CY7C1355BV18-100BZI and AS7C3256A-10JIN, the 71V3559S85BG uniquely delivers ZBT™ zero-turnaround, integrated burst counter, and IEEE 1149.1 JTAG in a single industrial-grade 100-pin TQFP-making it optimal for deterministic, high-throughput packet buffering where bus efficiency and testability are co-primary requirements.

Availability

71V3559S85BG is available at Aetrix Electronics and suitable for high-speed networking equipment, industrial programmable logic controllers, and wireless infrastructure requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for 71V3559S85BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications and computing markets.

The 71V3559S85BG belongs to IDT's ZBT™ SRAM product line, engineered specifically for high-bandwidth, low-latency applications in networking switches, routers, and baseband processing where deterministic burst access and zero bus turnaround are essential.

FAQ

What is the memory organization and total capacity of the 71V3559S85BG?

The 71V3559S85BG is organized as 256K × 18, delivering 4,718,592 bits (4.5 Mbit) of synchronous SRAM. It provides an 18-bit data bus with two dedicated parity bits (I/OP1 and I/OP2), supporting error detection in mission-critical communication systems. This configuration matches standard 18-bit bus widths used in many packet processors and FPGA-based datapaths.

Does the 71V3559S85BG support burst mode, and how is it configured?

Yes, the 71V3559S85BG supports a 4-word synchronous burst mode controlled by the ADV/LD and LBO pins. When ADV/LD is HIGH, the internal burst counter increments; LBO selects linear (LBO = LOW) or interleaved (LBO = HIGH) sequence order. Burst operation reduces address bus toggling and improves throughput for sequential memory accesses common in packet buffering and video streaming.

What is the role of the ZZ pin on the 71V3559S85BG, and does it retain data in sleep mode?

The ZZ pin on the 71V3559S85BG is a synchronous sleep mode input (active HIGH). When asserted, it gates the internal clock and reduces power consumption to its minimum level while guaranteeing full data retention-critical for energy-constrained base station radios and industrial controllers needing rapid wake-up without data reload.

Is JTAG boundary scan supported on the 71V3559S85BG, and which pins implement it?

Yes, the 71V3559S85BG includes optional IEEE 1149.1-compliant JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and TRST (optional reset) are dedicated to the JTAG interface and appear on the 100-pin TQFP package (pins U16, U15, U14, U13, and U12 respectively). This enables structural testing of PCB interconnects during manufacturing and field diagnostics.

How does the 71V3559S85BG achieve zero bus turnaround (ZBT™), and what benefit does it provide?

The 71V3559S85BG achieves ZBT™ via synchronized control logic that eliminates dead cycles between read and write operations: the last word of a read burst can be immediately followed by the first word of a write burst without bus idle time. This enables sustained 100% bus utilization in high-throughput packet forwarding engines, directly improving system-level throughput and reducing average packet latency.

71V3559S85BG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V3559S85BG FAQ

1.How can I place an order for 71V3559S85BG through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3559S85BG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3559S85BG reliable?

The price and inventory of 71V3559S85BG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3559S85BG is usually 5 days.

3.What payment methods are accepted for 71V3559S85BG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3559S85BG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V3559S85BG?

71V3559S85BG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3559S85BG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3559S85BG?

For technical support, including 71V3559S85BG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3559S85BG requirements.

6.How does Aetrix verify that 71V3559S85BG is sourced from the original manufacturer or authorized distributors?

All 71V3559S85BG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3559S85BG meets industry standards.

7.What is the process for return or replacement of 71V3559S85BG?

All 71V3559S85BG units undergo pre-shipment inspection (PSI). If there is an issue with 71V3559S85BG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3559S85BG part is unused and in its original packaging.

Return procedure for 71V3559S85BG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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