Renesas 71V3559S85BG8
- Part No.:
- 71V3559S85BG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V3559S85BG8.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
IDT71V3559S85BG8 from Integrated Device Technology is a 3.3V synchronous ZBT™ SRAM organized as 128K x 36 (4.5 Mbit), featuring flow-through outputs, 4-word burst capability (linear or interleaved), and zero bus turnaround for high-speed memory interfacing in networking and telecom data-path applications.
For engineers reviewing the IDT71V3559S85BG8 datasheet, IDT71V3559S85BG8 pinout, IDT71V3559S85BG8 application, or IDT71V3559S85BG8 equivalent, key selection criteria include its 100 MHz clock rate, synchronous burst counter, individual byte write enables (BW1–BW4), JTAG boundary scan support, and JEDEC-standard 100-pin TQFP package with VDD/VDDQ separation.
Technical Context
The IDT71V3559S85BG8 implements a synchronous dual-edge-triggered control architecture where address, R/W, ADV/LD, and byte write signals are registered on the rising CLK edge. Its internal burst counter advances on ADV/LD = HIGH, enabling four consecutive data transfers per address load without dead cycles between read/write transitions.
It integrates flow-through output logic (no output register), asynchronous OE for tri-state control, and a synchronous ZZ sleep mode that gates CLK internally while guaranteeing data retention. The device supports IEEE 1149.1 JTAG boundary scan via dedicated TMS/TDI/TCK/TDO/TRST pins, with TRST optional and internally pulled up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits (4.5 Mbit); supports 256K × 18 via pin-compatible variant |
| Clock Frequency | 100 MHz - enables 10 ns cycle time for high-bandwidth packet buffering |
| Access Time | 7.5 ns clock-to-data - defines minimum latency from CLK rise to valid output |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O) - separate rails reduce noise coupling |
| Burst Mode | 4-word linear/interleaved burst - reduces address bus traffic by 75% per burst sequence |
| Byte Write Control | BW1–BW4 active-low enables - allows independent 9-bit byte writes without masking logic |
| Operating Temperature | –40°C to +85°C (industrial grade) - qualified for base station and router environments |
Pinout & Package
Package: JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous inputs latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CE1, CE2, CE2 | Chip Enables | Three-input enable logic: CE1 = LOW, CE2 = LOW, CE2 = HIGH required for selection |
| R/W | Read/Write Control | Synchronous signal determining access type; data transfer occurs one cycle later |
| ADV/LD | Advance Burst / Load Address | HIGH increments internal burst counter; LOW loads new external address into register |
| LBO | Linear/Interleaved Burst Order | Static input: LOW = linear, HIGH = interleaved burst addressing sequence |
| BW1–BW4 | Byte Write Enables | Active-low enables for 9-bit I/O bytes; all may be tied LOW for full-word writes |
| CLK | System Clock Input | All synchronous timing referenced to rising edge; CEN can suspend operation |
| OE | Asynchronous Output Enable | LOW enables outputs; HIGH forces I/O pins to high-impedance regardless of clock state |
| ZZ | Sleep Mode Input | HIGH gates internal clock and reduces power; data retention guaranteed during sleep |
| TMS, TDI, TCK, TDO, TRST | JTAG Boundary Scan Interface | IEEE 1149.1 compliant; TRST optional and internally pulled up if unused |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional bus; input path registered, output path flow-through (no latch) |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between read and write operations, enabling continuous data streaming in burst mode |
| Flow-Through Outputs | Removes output register delay, delivering data directly from memory array on same cycle as address advance |
| Individual Byte Write (BW1–BW4) | Enables precise 9-bit sub-word writes without external byte-mask logic or additional control signals |
| Synchronous Burst Counter | Internally generates four sequential addresses per ADV/LD = HIGH, reducing external address generation overhead |
| Separate VDD/VDDQ Supplies | Isolates core logic and I/O power domains to minimize switching noise and improve signal integrity |
Applications
| Packet Buffering in Switch ASICs | Line Card Memory in Telecom Routers |
|---|---|
Use Scenario: High-throughput packet buffering in Layer 2/3 switching fabric where back-to-back read/write bursts occur at line rate. IC Role / Device Role / Timing Role: Primary data-path SRAM providing zero-turnaround burst reads/writes synchronized to switch fabric clock. Use Value: 100 MHz operation and 7.5 ns access enable sustained 3.6 Gbps throughput across 36-bit bus with no inter-burst gaps. | Use Scenario: Control-plane memory for route table lookups and configuration storage in modular telecom line cards operating at –40°C to +85°C. IC Role / Device Role / Timing Role: Industrial-grade synchronous SRAM supporting deterministic burst access for CPU-side memory-mapped registers. Use Value: ZZ sleep mode reduces standby power by >70%, and separate VDD/VDDQ rails ensure stable I/O signaling under heavy thermal cycling. |
| Network Processor Data Cache | High-Speed Test Equipment Memory |
Use Scenario: On-chip cache extension for multi-core network processors requiring low-latency, burst-capable external memory. IC Role / Device Role / Timing Role: External cache SRAM interfaced directly to NPU's high-speed parallel bus with synchronous burst addressing. Use Value: Linear/interleaved burst modes align with NPU's prefetch engine stride patterns, improving cache hit efficiency by 22% vs. non-burst SRAM. | Use Scenario: Pattern memory in automated test equipment (ATE) requiring deterministic, jitter-free memory access for stimulus generation. IC Role / Device Role / Timing Role: Timing-critical waveform buffer with JTAG boundary scan for production testability and fault isolation. Use Value: IEEE 1149.1 compliance enables full pin-level controllability and observability during board-level functional test. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355KV18-100BZI | 128K × 36, 100 MHz, but uses QDR-II architecture with separate read/write ports and no ZBT™ zero-turnaround | Requires dual-port controller logic; not drop-in compatible due to different burst protocol and pinout | Select only when dual-port bandwidth outweighs ZBT™ simplicity and layout compatibility |
| AS7C3256A-10JIN | 128K × 32 (not 36-bit), 10 ns access, no burst counter, no JTAG, no ZZ sleep mode | Lacks burst capability and industrial temp rating; suitable only for cost-sensitive non-burst applications | Choose only for legacy designs where 4-bit parity/IOPx pins are unused and JTAG is unnecessary |
Compared with CY7C1355KV18-100BZI and AS7C3256A-10JIN, the IDT71V3559S85BG8 uniquely delivers ZBT™ zero-turnaround, integrated burst counter, and industrial-grade JTAG testability in a pin-defined 100-pin TQFP-enabling simpler controller design, lower system latency, and higher production test coverage.
Availability
IDT71V3559S85BG8 is available at Aetrix Electronics and suitable for packet buffering in telecom switches, line card memory in industrial routers, and high-speed test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for IDT71V3559S85BG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and real-time interconnect solutions for communications and computing infrastructure.
The IDT71V3559S85BG8 belongs to IDT's ZBT™ SRAM product line, designed specifically for high-speed data-path applications requiring deterministic burst access, zero bus turnaround, and industrial reliability in networking and telecom systems.
FAQ
What is the memory organization and total capacity of the IDT71V3559S85BG8?
The IDT71V3559S85BG8 is organized as 128K × 36 bits, delivering a total capacity of 4,718,592 bits (4.5 Mbit). It supports both 128K × 36 and 256K × 18 configurations via pin-compatible variants, with the IDT71V3559S85BG8 specifically configured for the 128K × 36 mode. This structure provides 36-bit wide data access optimized for high-throughput packet processing applications.
Does the IDT71V3559S85BG8 support burst mode, and how is burst order selected?
Yes, the IDT71V3559S85BG8 supports 4-word synchronous burst mode with selectable linear or interleaved addressing. Burst order is controlled by the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW selects linear burst (A0, A1, A2, A3), while LBO = HIGH selects interleaved burst (A0, A1, A2, A3 in bit-reversed sequence). The burst counter advances automatically on ADV/LD = HIGH, eliminating need for external address sequencing logic.
What is the role of the ZZ pin on the IDT71V3559S85BG8, and does it retain data in sleep mode?
The ZZ pin on the IDT71V3559S85BG8 is a synchronous sleep mode input. When driven HIGH, it gates the internal clock and places the device in its lowest power consumption state. Crucially, data retention is guaranteed during sleep mode - all stored memory contents remain intact without refresh. This feature enables significant power savings in idle periods of telecom line cards and test equipment without compromising data integrity.
How does the IDT71V3559S85BG8 implement zero bus turnaround (ZBT™), and what benefit does it provide?
The IDT71V3559S85BG8 implements ZBT™ by eliminating dead cycles between consecutive read and write operations. Its synchronous architecture allows immediate transition from a read burst to a write burst (or vice versa) without bus idle time, using the same clock domain and shared address/data bus. This enables continuous data streaming in high-speed packet buffers and switch fabrics, increasing effective bandwidth by up to 25% compared to conventional SRAMs requiring turnaround cycles.
Is JTAG boundary scan supported on the IDT71V3559S85BG8, and which pins are used?
Yes, the IDT71V3559S85BG8 includes optional IEEE 1149.1-compliant JTAG boundary scan. It uses five dedicated pins: TMS (Test Mode Select), TDI (Test Data Input), TCK (Test Clock), TDO (Test Data Output), and TRST (optional JTAG reset). TRST is internally pulled up and may be left floating if not used. This capability enables full pin-level controllability and observability for production testing and board-level diagnostics.
71V3559S85BG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V3559S85BG8 FAQ
1.How can I place an order for 71V3559S85BG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3559S85BG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3559S85BG8 reliable?
The price and inventory of 71V3559S85BG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3559S85BG8 is usually 5 days.
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Once your 71V3559S85BG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3559S85BG8?
For technical support, including 71V3559S85BG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3559S85BG8 requirements.
6.How does Aetrix verify that 71V3559S85BG8 is sourced from the original manufacturer or authorized distributors?
All 71V3559S85BG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3559S85BG8 meets industry standards.
7.What is the process for return or replacement of 71V3559S85BG8?
All 71V3559S85BG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3559S85BG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3559S85BG8 part is unused and in its original packaging.
Return procedure for 71V3559S85BG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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