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Renesas 71V35761S166PFGI
- Part No.:
- 71V35761S166PFGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V35761S166PFGI.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,964
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Product details
Overview
71V35761S166PFGI from IDT is a 128K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, burst counter, and single-cycle deselect. It operates at 166MHz (3.5ns clock access time), supports linear/interleaved burst modes via LBO input, and features self-timed write with global/byte write control. Used in high-speed networking line cards requiring deterministic latency and burst data throughput.
For engineers reviewing the 71V35761S166PFGI datasheet, 71V35761S166PFGI pinout, 71V35761S166PFGI application, or 71V35761S166PFGI equivalent, key selection criteria include burst mode timing compliance, ZZ sleep-mode current (30mA), TQFP-100 package compatibility, and industrial temperature support (–40°C to +85°C).
Technical Context
The 71V35761S166PFGI implements a synchronous pipeline architecture with registered address, data, and control inputs triggered on CLK rising edge. Its internal burst counter generates four sequential addresses per initial address, with output pipelining delivering first data one cycle after address latch and subsequent data on successive clock edges.
Burst order is selected by the asynchronous LBO pin (LOW = linear, HIGH = interleaved), while ADV enables burst advance. Write operations are controlled synchronously via GW (global) or BWE/BW1–BW4 (byte-select), with OE providing asynchronous output enable for bus sharing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits = 4.608 Mbit; supports 36-bit wide data paths without external width expansion. |
| Clock Frequency / Access Time | 166 MHz / 3.5 ns; guarantees deterministic read latency for real-time packet buffering in telecom ASIC interfaces. |
| Supply Voltages | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; separate core/I/O rails allow independent noise management and signal integrity tuning. |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade embedded systems including base station control modules. |
| Power Consumption | ISB1 = 30 mA (standby), IZZ = 30 mA (full sleep); enables low-power idle states in always-on network infrastructure. |
| Burst Mode Control | LBO pin selects linear or interleaved address sequence; critical for cache-line alignment with MIPS or PowerPC processors. |
| Write Architecture | Self-timed write with GW + BWE + BW1–BW4; allows partial-word writes without bus turnaround or external timing logic. |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 1 marked by dot; pin 14 (VDD/NC) and pin 64 (ZZ) have specific biasing options per datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous 18-bit address bus; latched on rising CLK edge when ADSP or ADSC asserts, enabling burst address generation. |
| CLK | System Clock Input | Primary timing reference; all synchronous registers (address, data, control) sample on rising edge - no internal PLL or divider. |
| GW, BWE, BW1–BW4 | Write Control Inputs | GW enables full 36-bit write; BWE gates byte enables; BW1–BW4 select 9-bit subwords (I/O0–7+I/OP1, etc.) for granular memory updates. |
| ADV, ADSP, ADSC | Burst Address Control | ADSP/ADSC load initial address; ADV advances internal counter - essential for cache-coherent burst reads in RISC pipelines. |
| LBO | Burst Order Select | Asynchronous static input; sets linear (LBO = LOW) or interleaved (LBO = HIGH) burst sequence - must remain stable during operation. |
| ZZ | Asynchronous Sleep Enable | Drives internal clock gate when HIGH; reduces supply current to 30 mA while retaining data - no reset or reinitialization required on wake. |
| I/O0–I/O31, I/OP1–I/OP4 | Bi-directional Data I/O | 36-bit synchronous data path; registered input/output with pipelined output staging - eliminates external latch requirements. |
| OE | Asynchronous Output Enable | Directly controls I/O driver state; enables high-impedance mode independent of clock - supports shared bus arbitration. |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Burst Outputs | First data appears one clock cycle after address latch; next three words delivered on consecutive CLK edges - eliminates wait states in burst-oriented processors. |
| Single-Cycle Deselect | Chip deactivation completes within one clock cycle; enables rapid context switching between multiple SRAM banks in multi-protocol line cards. |
| Byte-Write Granularity | Four independent 9-bit write enables (BW1–BW4) allow partial-word updates without read-modify-write cycles - critical for descriptor table maintenance. |
| Industrial Temperature Range | –40°C to +85°C operation with guaranteed timing; supports deployment in uncontrolled environments like outdoor wireless base stations. |
| Low-Power Sleep Mode | ZZ-controlled full sleep draws only 30 mA; retains data indefinitely - extends uptime in battery-backed or energy-constrained telecom modules. |
Applications
| High-Speed Network Line Cards | Telecom Baseband Processing |
|---|---|
Use Scenario: Buffering packet headers and payload fragments in OC-192/STM-64 line interface units. IC Role / Device Role / Timing Role: Primary burst-access SRAM for frame assembly/disassembly engines interfacing with SerDes PHYs. Use Value: 166MHz pipelined reads deliver 4×36-bit data per 6ns cycle, matching SONET/SDH framing rates without FIFO bottlenecks. | Use Scenario: Storing channelized TDM timeslots and control descriptors in 3G/4G radio base stations. IC Role / Device Role / Timing Role: Dual-port accessible memory bank for DSP-to-FPGA handoff with deterministic 3.5ns access. Use Value: Linear burst mode aligns with TI C6000 DSP cache-line fetches, reducing instruction stall cycles by >40% vs. non-burst SRAM. |
| Industrial PLC Motion Controllers | Radar Signal Processing Modules |
Use Scenario: Real-time interpolation tables and axis position buffers in CNC machine controllers. IC Role / Device Role / Timing Role: Deterministic-latency scratchpad for motion trajectory calculation engines. Use Value: Single-cycle deselect and 36-bit width eliminate glue logic for 32-bit microcontroller bus interfaces, reducing PCB layer count. | Use Scenario: Storing FFT coefficients and range-Doppler map tiles in airborne SAR processors. IC Role / Device Role / Timing Role: High-bandwidth buffer between ADC front-end and FPGA-based beamformer. Use Value: 119-ball BGA variant (compatible footprint) supports thermal vias under die for sustained 183MHz operation in conduction-cooled avionics enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-166AXC | 128K × 32 organization; no LBO pin; 32-bit data width requires external parity handling for 36-bit systems. | Lacks burst order selection and dedicated I/OP pins; not drop-in for parity-sensitive telecom designs. | Select only if system uses 32-bit data path and does not require interleaved burst addressing. |
| AS7C3256A-166JCIN | 128K × 32, 3.3V, but asynchronous interface; no CLK, ADV, or pipelined outputs - fundamentally different timing model. | Cannot replace synchronous burst behavior; unsuitable for processor/SerDes interfaces requiring clock-aligned data. | Consider only for legacy board refresh where timing-critical burst performance is not required. |
Compared with CY7C1362BV33-166AXC and AS7C3256A-166JCIN, the 71V35761S166PFGI uniquely delivers 36-bit width with programmable burst order and pipelined outputs - essential for modern telecom and radar subsystems demanding sub-4ns deterministic access.
Availability
71V35761S166PFGI is available at Aetrix Electronics and suitable for high-speed networking line cards, telecom baseband processing, and industrial motion controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 71V35761S166PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology) is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs, now part of Renesas Electronics.
The 71V35761S166PFGI belongs to IDT's high-speed synchronous SRAM product line, designed specifically for bandwidth-intensive applications in telecommunications infrastructure, test equipment, and real-time embedded systems.
FAQ
What is the maximum operating frequency of the 71V35761S166PFGI?
The 71V35761S166PFGI is rated for 166 MHz operation with a 3.5 ns clock access time, validated over the industrial temperature range (–40°C to +85°C). This speed is guaranteed under VDD/VDDQ = 3.3 V ±5% and specified AC loading conditions per the official IDT datasheet revision May 18, 2020.
Does the 71V35761S166PFGI support both linear and interleaved burst modes?
Yes, the 71V35761S166PFGI supports both burst modes via the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW selects linear addressing, LBO = HIGH selects interleaved. The pin is asynchronous and static - it must remain stable during active burst operation to prevent address misalignment.
What package type is used for the 71V35761S166PFGI?
71V35761S166PFGI is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, 0.5 mm lead pitch. Pin 1 is marked with a dot; pins 14 (VDD/NC) and 64 (ZZ) have configurable biasing per datasheet guidelines.
How does the ZZ pin function in the 71V35761S166PFGI?
The ZZ pin on the 71V35761S166PFGI is an asynchronous sleep-mode enable. When driven HIGH, it gates the internal clock and reduces supply current to 30 mA (IZZ) while guaranteeing data retention. Recovery time (tZZR) is 100 ns, and no reinitialization is needed upon wake-up.
Is JTAG boundary scan supported on the 71V35761S166PFGI?
No, the 71V35761S166PFGI does not include JTAG boundary scan. That feature is exclusive to the "SA" suffix variants (e.g., 71V35761SA). The "S" version - including 71V35761S166PFGI - omits TMS, TDI, TCK, TDO, and TRST pins; those balls/pads are designated NC in the TQFP package.
71V35761S166PFGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V35761S166PFGI FAQ
1.How can I place an order for 71V35761S166PFGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V35761S166PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V35761S166PFGI reliable?
The price and inventory of 71V35761S166PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V35761S166PFGI is usually 5 days.
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71V35761S166PFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V35761S166PFGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V35761S166PFGI?
For technical support, including 71V35761S166PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V35761S166PFGI requirements.
6.How does Aetrix verify that 71V35761S166PFGI is sourced from the original manufacturer or authorized distributors?
All 71V35761S166PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V35761S166PFGI meets industry standards.
7.What is the process for return or replacement of 71V35761S166PFGI?
All 71V35761S166PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V35761S166PFGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V35761S166PFGI part is unused and in its original packaging.
Return procedure for 71V35761S166PFGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V35761S166PFGI Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
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