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Renesas 71V35761S183PFGI8

Part No.:
71V35761S183PFGI8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V35761S183PFGI8.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,790

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Product details

Overview

71V35761S183PFGI8 from IDT is a 128K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, burst counter, and single-cycle deselect. It operates at 183MHz (3.3ns clock access time), supports linear/interleaved burst modes via LBO input, and features JTAG boundary scan (IEEE 1149.1) in BGA variants. Used in high-speed networking and telecom data buffering.

For engineers reviewing the 71V35761S183PFGI8 datasheet, 71V35761S183PFGI8 pinout, 71V35761S183PFGI8 application, or 71V35761S183PFGI8 equivalent, key selection criteria include burst mode timing compliance, ZZ sleep-mode current (30–35mA), industrial temperature range (–40°C to +85°C), and TQFP-100 package compatibility with JEDEC-standard footprint.

Technical Context

The 71V35761S183PFGI8 implements a synchronous, clock-driven architecture with registered address, data, and control paths. Its internal burst address counter advances on ADV=LOW and selects sequence order via LBO (linear or interleaved), enabling four-word burst reads/writes per address cycle.

It supports multiple write modes: global write (GW), byte write enable (BWE), and individual byte writes (BW1–BW4), with asynchronous OE and ZZ controls. Pipelined output staging delivers first data on the second rising CLK edge after address assertion, reducing system latency.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128K × 36 bits = 4.608 Mbit; supports 36-bit wide data bus for high-throughput memory subsystems.
Max Clock Frequency183 MHz (industrial grade); enables 5.48 ns minimum clock period for deterministic timing in real-time systems.
Access Time3.3 ns clock-to-data (tCD); guarantees pipelined output validity within one clock cycle after address latch.
Supply VoltagesVDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; separate core/I/O rails allow independent noise management and signal integrity optimization.
Sleep Mode CurrentIZZ = 30–35 mA (industrial); low-power ZZ-controlled sleep preserves data while cutting dynamic power during idle bursts.
Burst Mode ControlLBO pin selects linear or interleaved 4-word burst sequence; static configuration prevents runtime corruption of burst address progression.
Temperature Range–40°C to +85°C; qualified for industrial embedded applications including base station controllers and packet switches.

Pinout & Package

Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout validated per IDT 71V35761 PKG100 drawing (5301drw 02).

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address InputsSynchronous 18-bit address bus; latched on rising CLK edge with ADSP/ADSC assertion for burst initiation.
CLKSystem Clock InputPrimary timing reference; all registers (address, data, control) are edge-triggered on rising CLK.
ADVBurst Address AdvanceActive-Low synchronous signal that increments internal burst counter; HIGH suspends burst progression.
LBOBurst Order SelectAsynchronous static input; LOW = linear burst (00→01→10→11), HIGH = interleaved (00→01→11→10) for cache-line alignment.
ZZSleep Mode EnableAsynchronous HIGH activates full sleep: clocks gated, I/O tri-stated, IZZ ≤ 35 mA; retains memory contents.
I/O0–I/O31, I/OP1–I/OP4Data I/O (36-bit)Synchronous bidirectional bus; registered input/output paths ensure setup/hold compliance at 183 MHz.
GW / BWE / BW1–BW4Write Control InputsGW enables full 36-bit write; BWE gates byte enables; BWx select 9-bit subwords (e.g., BW1 → I/O0–I/O7 + I/OP1).
OEOutput EnableAsynchronous control; LOW enables output drivers regardless of clock state-critical for glitch-free bus sharing.

Key Features

FeatureDesign Value
Pipelined Burst OutputsFirst data appears on second CLK edge; subsequent burst words align to consecutive rising edges-reducing read latency by one cycle vs. non-pipelined SRAMs.
Single-Cycle DeselectChip deactivation completes within one clock cycle (via CE/CS0/CS1), enabling rapid context switching between memory banks without pipeline stalls.
JTAG Boundary ScanIEEE 1149.1-compliant test interface (TMS/TDI/TCK/TDO/TRST) supports board-level interconnect testing and in-system debug in BGA variants.
Byte-Write GranularityFour independent 9-bit write enables (BW1–BW4) allow partial-word updates without read-modify-write cycles-essential for protocol header manipulation.
Industrial Temp SupportRated for –40°C to +85°C operation with guaranteed 183 MHz performance and 3.3ns tCD-validated across temperature and voltage corners.

Applications

Telecom Line CardsNetwork Packet Buffers

Use Scenario: High-speed buffering of ATM or Ethernet frames in carrier-grade line cards requiring deterministic latency and burst throughput.

IC Role / Device Role / Timing Role: Primary data buffer SRAM interfacing directly with MAC or framer ASICs via 36-bit synchronous bus and pipelined read/write.

Use Value: 183 MHz operation and 3.3 ns tCD meet strict jitter budgets; single-cycle deselect enables seamless bank switching during traffic load balancing.

Use Scenario: Temporary storage of fragmented IP packets in Layer 3 switches before reassembly or forwarding decisions.

IC Role / Device Role / Timing Role: Burst-capable SRAM providing four-word reads per address to match packet payload word widths and minimize bus arbitration overhead.

Use Value: Linear burst mode (LBO=LOW) delivers sequential cache-line-aligned data; ZZ sleep reduces power during packet idle periods without data loss.

Radar Signal ProcessingIndustrial PLC Memory Modules

Use Scenario: Real-time buffering of digitized RF samples in phased-array radar front-ends operating under extended thermal stress.

IC Role / Device Role / Timing Role: Synchronous SRAM serving as ping-pong buffer between ADC interface and DSP core, leveraging ADV-controlled burst reads.

Use Value: Industrial temperature rating (–40°C to +85°C) and 36-bit width support high-fidelity sample streaming; pipelined outputs prevent timing violations at 183 MHz sampling rates.

Use Scenario: Deterministic program/data storage in safety-critical programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Non-volatile-equivalent working memory with guaranteed data retention in ZZ sleep mode during brown-out events.

Use Value: Asynchronous ZZ and OE enable fail-safe shutdown sequencing; byte-write capability allows atomic tag updates without corrupting adjacent control variables.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1371DV33-183AXC128K × 36, 3.3V, 183 MHz; no JTAG; different pinout (119-ball BGA only); higher ISB1 (45 mA vs. 35 mA)Lacks boundary scan; requires PCB redesign for BGA placement; better suited for cost-sensitive, non-test-intensive designsSelect when JTAG is unnecessary and BGA layout flexibility exists; verify ADV/LBO timing compatibility
AS7C331024B-183BIN128K × 36, 3.3V, 183 MHz; no ZZ sleep; no burst suspend (ADV function absent); TQFP-100 compatible but different pin mappingNo low-power sleep mode; lacks burst suspension capability-unsuitable for intermittent traffic or power-constrained deploymentsChoose only if sleep mode and ADV-controlled burst suspension are not required; validate OE timing against 71V35761S183PFGI8

Compared with CY7C1371DV33-183AXC and AS7C331024B-183BIN, the 71V35761S183PFGI8 uniquely combines industrial-temperature 183 MHz operation, JTAG testability, ZZ sleep, and ADV-suspendable burst-making it optimal for telecom infrastructure and ruggedized embedded systems where reliability, debug access, and power efficiency are co-prioritized.

Availability

71V35761S183PFGI8 is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, radar signal processing, and industrial PLC memory modules requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 71V35761S183PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology) is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions, now part of Renesas Electronics since 2019.

The 71V35761 family was designed for high-bandwidth, low-latency data buffering in communications infrastructure-emphasizing burst efficiency, pipelined timing, and industrial-grade reliability.

FAQ

What is the maximum operating frequency of the 71V35761S183PFGI8?

The 71V35761S183PFGI8 is rated for 183 MHz operation in industrial temperature range (–40°C to +85°C), delivering a 3.3 ns clock-to-data access time (tCD). This speed is guaranteed across voltage (3.3 V ±5%) and temperature corners, making it suitable for deterministic real-time systems like telecom baseband processors.

Does the 71V35761S183PFGI8 support JTAG boundary scan?

Yes, the 71V35761S183PFGI8 supports IEEE 1149.1-compliant JTAG boundary scan-but only in BGA package variants (119-ball and 165-ball). The TQFP-100 version (like 71V35761S183PFGI8) does not include JTAG signals; pins TMS/TDI/TCK/TDO/TRST are NC in this package. Always verify package-specific pinouts before test planning.

How does the LBO pin affect burst behavior in the 71V35761S183PFGI8?

The LBO (Linear Burst Order) pin configures the internal burst counter sequence: LOW selects linear order (00→01→10→11), HIGH selects interleaved (00→01→11→10). It is an asynchronous static input-must remain stable during burst operation. Changing LBO mid-burst may cause undefined address progression and data corruption.

What is the purpose of the ADV pin in the 71V35761S183PFGI8?

The ADV (Burst Address Advance) pin is an active-Low synchronous input that increments the internal burst counter. When ADV is LOW, the counter advances for each clock cycle during burst; when ADV is HIGH, burst progression halts ("suspended burst"), holding the current address for repeated access-useful for debugging or partial-word updates without address recalculations.

What power-saving modes does the 71V35761S183PFGI8 support?

The 71V35761S183PFGI8 supports three low-power states: CMOS standby (ISB1 = 30–35 mA), clock-running standby (ISB2 = 110–130 mA), and full sleep mode (IZZ = 30–35 mA) activated by driving ZZ HIGH. Sleep mode gates internal clocks and disables outputs while retaining memory contents-ideal for intermittent traffic applications like packet buffering.

71V35761S183PFGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
183 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.3 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V35761S183PFGI8 FAQ

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Please submit a Request for Quotation (RFQ) for 71V35761S183PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of 71V35761S183PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V35761S183PFGI8 is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V35761S183PFGI8?

For technical support, including 71V35761S183PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V35761S183PFGI8 requirements.

6.How does Aetrix verify that 71V35761S183PFGI8 is sourced from the original manufacturer or authorized distributors?

All 71V35761S183PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V35761S183PFGI8 meets industry standards.

7.What is the process for return or replacement of 71V35761S183PFGI8?

All 71V35761S183PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V35761S183PFGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V35761S183PFGI8 part is unused and in its original packaging.

Return procedure for 71V35761S183PFGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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