Renesas 71V35761SA166BQG
- Part No.:
- 71V35761SA166BQG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V35761SA166BQG.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V35761SA166BQG from IDT is a 128K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, burst counter, and single-cycle deselect. It operates at 166MHz (3.5ns clock access time), supports linear/interleaved burst modes via LBO input, and features JTAG boundary scan (IEEE 1149.1) for testability in high-speed networking and telecom systems.
For engineers reviewing the 71V35761SA166BQG datasheet, 71V35761SA166BQG pinout, 71V35761SA166BQG application, or 71V35761SA166BQG equivalent, key selection criteria include burst-mode timing compliance, ZZ sleep-mode current (30mA), TQFP-100 vs. fBGA-165 package compatibility, and JTAG signal mapping for production test integration.
Technical Context
The 71V35761SA166BQG implements a synchronous, clock-driven architecture with registered address, data, and control paths. Its internal burst counter generates four sequential addresses per initial address, with output pipelining delivering first data on the second clock edge and subsequent data on successive rising edges.
Burst order is determined by the asynchronous LBO pin (LOW = linear, HIGH = interleaved), while ADV enables burst advance and ADSP/ADSC provide processor- or cache-controller–driven address latching. The device supports byte-selectable writes (BW1–BW4), global write (GW), and self-timed write cycles gated by BWE and CE.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.608 Mbit); supports 36-bit parallel data path for high-bandwidth buffering |
| Clock Frequency | 166 MHz (tCYC = 6 ns); enables sustained 664 MB/s read/write throughput in burst mode |
| Access Time | 3.5 ns clock-to-data (tCD); guarantees pipelined output validity within one clock cycle after address setup |
| Supply Voltage | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; separate core/I/O rails reduce noise coupling in mixed-signal systems |
| Sleep Current | IZZ = 30 mA (max) at VDD = 3.465 V; enables low-power standby during packet idle periods |
| Burst Mode | Linear or interleaved via LBO pin; defines A0/A1 sequence for four-word bursts without external address generation |
| JTAG Support | IEEE 1149.1 compliant (TMS/TDI/TCK/TRST/TDO); enables board-level structural test and debug in fBGA-165 package |
Pinout & Package
71V35761SA166BQG is packaged in a 165-ball fine-pitch ball grid array (fBGA), JEDEC-compliant, with 1.0 mm ball pitch and 13 mm × 15 mm body size. Pinout validated per IDT document 5301 tbl 17 and drw 04.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous inputs latched on rising CLK edge with ADSP/ADSC; 18-bit address space selects 128K words |
| CLK | System Clock Input | Primary timing reference; all registers and burst counter advance on rising edge |
| ADV | Burst Address Advance | Active-Low synchronous signal controlling burst counter increment; HIGH suspends burst sequence |
| LBO | Burst Order Select | Asynchronous static input defining linear (LOW) or interleaved (HIGH) A0/A1 sequence for four-word burst |
| ZZ | Sleep Mode Enable | Asynchronous HIGH input gating internal clock and reducing supply current to 30 mA; retains memory data |
| TMS/TDI/TCK/TRST/TDO | JTAG Test Interface | IEEE 1149.1 boundary scan pins mapped to dedicated fBGA balls (R2/P2/N6/B11/A1/R11 per doc 5301 tbl 17) |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional bus with registered input/output paths; I/OPx are parity bits for ECC-capable systems |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Burst Outputs | First data available on second CLK edge; eliminates wait states in high-clock-rate processors and FPGAs |
| Single-Cycle Deselect | Chip deactivation completes within one clock cycle; enables rapid context switching between memory banks |
| Byte-Write Flexibility | Four independent 9-bit byte enables (BW1–BW4) + global write (GW) + byte-write enable (BWE) allow granular data updates |
| Low-Power Sleep Mode | ZZ-controlled full sleep draws only 30 mA; critical for power-constrained telecom line cards and baseband units |
| JTAG Boundary Scan | Fully IEEE 1149.1-compliant test interface embedded in SA variant; supports automated PCB test and interconnect validation |
Applications
| Baseband Processing Unit | High-Speed Packet Switch |
|---|---|
Use Scenario: Real-time buffering of LTE/5G downlink channel data between RF front-end and DSP core. IC Role / Device Role / Timing Role: Synchronous SRAM providing pipelined 36-bit burst reads at 166 MHz to match FPGA fabric clocking. Use Value: Single-cycle deselect and 3.5 ns tCD enable zero-wait-state operation, reducing latency in symbol processing pipelines. | Use Scenario: Storing forwarding tables and packet descriptors in multi-gigabit Ethernet switch ASICs. IC Role / Device Role / Timing Role: High-bandwidth buffer interfacing with SerDes PHYs and traffic manager logic. Use Value: Linear burst mode (LBO = LOW) delivers deterministic 4-word sequences matching TCAM lookup widths. |
| Optical Transport Network Line Card | Radar Signal Processor |
Use Scenario: Temporary storage of OTU4 frame headers and overhead bytes during SONET/SDH grooming. IC Role / Device Role / Timing Role: Low-latency SRAM with JTAG test access for field-upgradable line cards requiring high reliability. Use Value: Integrated IEEE 1149.1 boundary scan enables in-system test without physical probe access to dense fBGA layout. | Use Scenario: Capturing and staging chirp samples in pulsed-Doppler radar front-ends before FFT processing. IC Role / Device Role / Timing Role: Burst-mode SRAM synchronized to ADC sampling clock for continuous streaming into DSP memory. Use Value: ZZ sleep mode reduces average power by >70% during inter-pulse intervals while preserving acquired sample buffers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-166BZXI | 128K × 36, 166 MHz, 3.3V, no JTAG; uses different burst control (MODE pin instead of LBO) | Lacks IEEE 1149.1 test interface; requires external burst address generation logic | Select when JTAG is unnecessary and legacy Cypress footprint compatibility is required |
| AS7C3256P-166JCIN | 128K × 36, 166 MHz, 3.3V, no pipelined outputs; asynchronous OE with 5.5 ns access | No burst counter or pipelining; higher read latency prevents zero-wait-state CPU/FPGA interfaces | Select for cost-sensitive industrial controllers where burst performance is not required |
Compared with CY7C1362BV33-166BZXI and AS7C3256P-166JCIN, the 71V35761SA166BQG uniquely combines JTAG testability, pipelined burst outputs, and single-cycle deselect-enabling lower system latency and higher test coverage in telecom infrastructure designs.
Availability
71V35761SA166BQG is available at Aetrix Electronics and suitable for high-speed networking equipment, telecom line cards, and radar signal processors requiring stable component supply, long-term lifecycle support, and traceable green-part sourcing.
Supply support for 71V35761SA166BQG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology) is a semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.
The 71V35761SA166BQG belongs to IDT's high-speed synchronous SRAM product line, designed specifically for low-latency, high-throughput buffering in telecom infrastructure, military radar, and high-performance computing subsystems.
FAQ
What is the maximum operating frequency of the 71V35761SA166BQG?
The 71V35761SA166BQG is rated for 166 MHz operation (tCYC = 6 ns) across the industrial temperature range (–40°C to +85°C). This speed is guaranteed with VDD and VDDQ at 3.3 V ±5%, and all AC timing parameters-including tCD = 3.5 ns and tOE = 3.5 ns-meet specification under these conditions. The "166" in the part number explicitly denotes this speed grade.
Does the 71V35761SA166BQG support both linear and interleaved burst modes?
Yes, the 71V35761SA166BQG supports both burst modes via the LBO (Linear/Interleaved Burst Order) pin. When LBO is driven LOW, the device executes linear burst addressing (00→01→10→11 on A1/A0). When LBO is HIGH, it performs interleaved burst (00→01→11→10). This behavior is defined in the Interleaved and Linear Burst Sequence Tables (5301 tbl 14–15) and applies identically across all supported speeds.
What is the function of the ZZ pin on the 71V35761SA166BQG?
The ZZ pin on the 71V35761SA166BQG is an asynchronous sleep-mode enable. When driven HIGH, it gates the internal clock and reduces supply current to IZZ = 30 mA (max), while retaining full data integrity. Recovery requires tZZR ≥ 100 ns after ZZ returns LOW. This feature is essential for power-gating during packet idle periods in telecom and networking applications.
Which package type does the 71V35761SA166BQG use, and what are its key mechanical attributes?
The 71V35761SA166BQG uses a 165-ball fine-pitch BGA (fBGA) package, designated BQG165 per IDT documentation. It has a 13 mm × 15 mm body size, 1.0 mm ball pitch, and conforms to JEDEC MO-244. Ball assignments for JTAG signals (TMS/TDI/TCK/TRST/TDO) are fixed per table 5301 tbl 17, enabling reliable test fixture design.
How does the 71V35761SA166BQG handle byte-write operations?
The 71V35761SA166BQG supports granular byte writes using four dedicated 9-bit enables (BW1–BW4), a byte-write enable (BWE), and global write (GW). When BWE is LOW, BWx signals control individual 9-bit segments (e.g., BW1 → I/O0–I/O7 + I/OP1). GW overrides BWx to write all 36 bits simultaneously. All write controls are synchronous to CLK and validated in the Synchronous Write Function Truth Table (5301 tbl 12).
71V35761SA166BQG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V35761SA166BQG FAQ
1.How can I place an order for 71V35761SA166BQG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V35761SA166BQG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 71V35761SA166BQG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V35761SA166BQG is usually 5 days.
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6.How does Aetrix verify that 71V35761SA166BQG is sourced from the original manufacturer or authorized distributors?
All 71V35761SA166BQG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V35761SA166BQG meets industry standards.
7.What is the process for return or replacement of 71V35761SA166BQG?
All 71V35761SA166BQG units undergo pre-shipment inspection (PSI). If there is an issue with 71V35761SA166BQG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V35761SA166BQG part is unused and in its original packaging.
Return procedure for 71V35761SA166BQG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V35761SA166BQG Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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