Renesas 71V35761SA166BQGI
- Part No.:
- 71V35761SA166BQGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V35761SA166BQGI.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:136
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Product details
Overview
71V35761SA166BQGI from IDT is a 128K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, burst counter, and single-cycle deselect. It supports 166MHz operation (3.5ns clock access time), industrial temperature range (–40°C to +85°C), and optional IEEE 1149.1 JTAG boundary scan. Used in high-speed networking and embedded control buffers requiring deterministic latency.
For engineers reviewing the 71V35761SA166BQGI datasheet, 71V35761SA166BQGI pinout, 71V35761SA166BQGI application, or 71V35761SA166BQGI equivalent, key selection criteria include burst mode configuration (LBO), sleep mode control (ZZ), JTAG availability (TMS/TDI/TCK/TRST/TDO), and compatibility with 3.3V I/O systems requiring pipelined read timing and self-timed write cycles.
Technical Context
The 71V35761SA166BQGI implements a synchronous architecture with registered address, data, and control inputs triggered on the rising edge of CLK. Its internal burst address counter generates four sequential addresses per initial address, with order determined by LBO (linear vs. interleaved) and advanced via ADV.
Burst operations support pipelined reads with one-cycle output latency, while writes are self-timed using GW, BWE, and BW1–BW4 for full- or byte-level writes. Sleep mode is entered asynchronously via ZZ HIGH, reducing supply current to ≤35mA while retaining data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits = 4.608 Mbit; supports 36-bit parallel data path for wide-bus applications. |
| Clock Frequency | 166 MHz max; enables 6 ns clock cycle time for deterministic timing in real-time systems. |
| Access Time | 3.5 ns clock-to-data (tCD); guarantees pipelined output validity within one clock cycle after CLK rise. |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate power domains isolate noise-sensitive logic from I/O switching. |
| Operating Temperature | –40°C to +85°C; qualified for industrial environments without derating. |
| Power Consumption | IZZ ≤ 35 mA in full sleep mode; reduces system standby power in always-on edge devices. |
| Burst Mode Control | LBO input selects linear or interleaved address sequence; static configuration avoids runtime reconfiguration overhead. |
Pinout & Package
Packaged in a JEDEC-standard 165-ball fine-pitch BGA (fBGA), footprint code BQG165, with 1.0 mm ball pitch and 13 mm × 15 mm body size.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous 18-bit address bus; latched on rising CLK edge with ADSP/ADSC assertion. |
| CLK | System Clock Input | Primary timing reference; all synchronous operations aligned to rising edge. |
| GW, BWE, BW1–BW4 | Write Control Inputs | GW enables full 36-bit write; BWE gates byte enables; BWx selects 9-bit bytes (I/O0–7/I/OP1, etc.). |
| ADV, ADSP, ADSC | Burst & Address Status | ADV advances internal burst counter; ADSP (processor) and ADSC (cache) load address register synchronously. |
| LBO | Burst Order Select | Asynchronous static input: LOW = linear, HIGH = interleaved; must remain stable during operation. |
| ZZ | Sleep Mode Enable | Asynchronous HIGH entry to low-power sleep; retains memory contents with minimal current draw. |
| TMS, TDI, TCK, TDO, TRST | JTAG Boundary Scan | IEEE 1149.1-compliant test interface; TRST optional asynchronous reset (internal pull-up). |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous bus; registered input/output paths ensure setup/hold compliance at 166 MHz. |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Burst Reads | Delivers four consecutive 36-bit words per address with one-cycle pipeline latency, maximizing throughput in cache-line fetches. |
| Single-Cycle Deselect | Chip deactivation completes within one clock cycle, enabling rapid context switching between memory banks. |
| Self-Timed Write Cycle | Internal timing logic eliminates external write pulse generation; supports flexible burst or single-word writes with byte granularity. |
| Industrial Temperature Support | Validated operation from –40°C to +85°C ensures reliability in base stations, industrial PLCs, and transportation electronics. |
| JTAG Boundary Scan | IEEE 1149.1-compliant test infrastructure enables board-level interconnect verification and in-system debugging. |
Applications
| Network Packet Buffering | Real-Time Control Memory |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/3 switches before forwarding or classification. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer memory interfacing directly with MAC controllers and traffic managers. Use Value: 166MHz burst reads deliver 5.9 Gbps aggregate bandwidth (36 bits × 166 MHz), matching 10GbE line rates with minimal buffering delay. | Use Scenario: Holding motion control trajectory tables and I/O state snapshots in CNC machines and robotics drives. IC Role / Device Role / Timing Role: Deterministic-access scratchpad memory for servo loop execution with jitter-free timing. Use Value: Single-cycle deselect and pipelined outputs guarantee sub-6ns read-to-use latency, meeting <10 µs real-time interrupt response requirements. |
| Baseband Signal Processing | Avionics Data Acquisition |
Use Scenario: Temporary storage of FFT bins and channel estimation results in LTE/5G baseband FPGAs. IC Role / Device Role / Timing Role: Synchronous SRAM co-located with FPGA fabric for zero-wait-state DMA transfers. Use Value: 3.3V I/O compatibility and 165-ball fBGA enable dense, high-speed routing on RF-adjacent PCB layers without level-shifting. | Use Scenario: Capturing sensor telemetry (IMU, pressure, temp) at 10 kHz in flight data recorders with power-loss resilience. IC Role / Device Role / Timing Role: Nonvolatile-retentive buffer during brown-out events using ZZ-controlled sleep mode. Use Value: Sleep current ≤35 mA preserves battery life during extended idle periods while guaranteeing data retention across power cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1375DV33-166BZXI | 128K × 36, 166MHz, 3.3V, no JTAG; uses different burst control (MODE pin instead of LBO) | Lacks IEEE 1149.1 test interface; requires alternate boundary-scan strategy for production test | Select when JTAG is unnecessary and cost sensitivity outweighs debug flexibility |
| AS7C33128P36A-166BIN | 128K × 36, 166MHz, 3.3V, no sleep mode (ZZ) or pipelined outputs; asynchronous OE | No low-power sleep capability; higher read latency due to non-pipelined output path | Select for simpler designs where power budget allows >100 mA standby and latency tolerance exceeds 5 ns |
Compared with CY7C1375DV33-166BZXI and AS7C33128P36A-166BIN, the 71V35761SA166BQGI uniquely combines JTAG testability, ZZ-controlled sleep, and pipelined burst reads-enabling both production test coverage and energy-efficient operation in space-constrained industrial systems.
Availability
71V35761SA166BQGI is available at Aetrix Electronics and suitable for network packet buffering, real-time control memory, baseband signal processing, and avionics data acquisition requiring stable component supply across industrial temperature ranges and long product lifecycles.
Supply support for 71V35761SA166BQGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology) is a semiconductor company specializing in timing, memory interface, RF, and high-performance computing solutions, now part of Renesas Electronics.
The 71V35761SA166BQGI belongs to IDT's high-speed synchronous SRAM product line, designed specifically for applications demanding deterministic latency, burst bandwidth, and industrial-grade reliability in communications and embedded control systems.
FAQ
What is the maximum operating frequency of the 71V35761SA166BQGI?
The 71V35761SA166BQGI is rated for 166 MHz operation, corresponding to a 6 ns clock cycle time and 3.5 ns clock-to-data (tCD) access time. This speed is guaranteed over the full industrial temperature range (–40°C to +85°C) with VDD and VDDQ at 3.3 V ±5%. The device also supports 183 MHz and 200 MHz variants in commercial grade, but the SA166 suffix confirms the 166 MHz industrial specification.
Does the 71V35761SA166BQGI support JTAG boundary scan?
Yes, the 71V35761SA166BQGI includes an optional IEEE 1149.1-compliant JTAG boundary scan interface. Pins TMS, TDI, TCK, TDO, and optional TRST are implemented on the 165-ball fBGA package. TRST is not required, as the TAP controller resets automatically at power-up and via TMS/TCK sequences per the standard.
How does burst mode work on the 71V35761SA166BQGI?
Burst mode on the 71V35761SA166BQGI delivers four consecutive 36-bit words per address using an internal binary counter. The sequence order (linear or interleaved) is selected by the LBO pin. ADV must be LOW to advance the counter; holding ADV HIGH suspends the burst. First-word output is pipelined, appearing one clock cycle after the initial address is latched.
What is the function of the ZZ pin on the 71V35761SA166BQGI?
The ZZ pin on the 71V35761SA166BQGI controls asynchronous entry into full sleep mode. When driven HIGH, it gates the internal clock and reduces supply current to ≤35 mA while retaining memory contents. ZZ has an internal pull-down, so it defaults to active mode if left unconnected. Recovery requires tZZR ≥100 ns after ZZ returns LOW.
Is the 71V35761SA166BQGI compatible with 3.3V-only systems?
Yes, the 71V35761SA166BQGI operates exclusively from 3.3 V supplies: VDD = 3.3 V ±5% for core logic and VDDQ = 3.3 V ±5% for I/O. All inputs accept 3.3V-compatible logic levels (VIH ≥2.0 V, VIL ≤0.8 V), and outputs drive 3.3V CMOS levels. No 5V tolerance or mixed-voltage support is provided.
71V35761SA166BQGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V35761SA166BQGI FAQ
1.How can I place an order for 71V35761SA166BQGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V35761SA166BQGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 71V35761SA166BQGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V35761SA166BQGI is usually 5 days.
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6.How does Aetrix verify that 71V35761SA166BQGI is sourced from the original manufacturer or authorized distributors?
All 71V35761SA166BQGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V35761SA166BQGI meets industry standards.
7.What is the process for return or replacement of 71V35761SA166BQGI?
All 71V35761SA166BQGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V35761SA166BQGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V35761SA166BQGI part is unused and in its original packaging.
Return procedure for 71V35761SA166BQGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V35761SA166BQGI Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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